Industrial Technology Research Institute

Jen-Rong Huang

Muh-Wang Liang

Chen-Chung Du

Chia-Ming Chen

Pang-Ming Chiang

Tzong-Ming Wu

Fu-Ching Tung

Chih-Cheng Wang

Sheng-Lang Lee

Chih-Yuan Tseng

Peter L Mahneke

Yi-Chao Weng

Chia-Hao Chang

Chih-Yung Huang

Ching-Chiun Wang

Ching-Fa Yeh

Hong-Ming Chen

Wu-Lang Lin

Feng-Yu Tsai

Shih-Chin Lin

Pang-Min Chiang

Kang-Feng Lee

Tien-Lu Ho

Janathan Wang

Chen Max

Ming Horn Zheng

Jonathan Wang

A deposition nozzle and a deposition apparatus include a nozzle body, a precursor passageway formed at a central region of the nozzle body for a precursor gas to be sprayed on the substrate such that the precursor gas reacts with a surface of the substrate, an extraction passageway formed in the nozzle body and located at a peripheral side of the precursor passageway, and extracting residues after the precursor gas reacts with the surface of the substrate, and an air curtain passageway formed in the nozzle body and located at a peripheral side of the extraction passageway for isolating gas to be sprayed on the substrate so as to form a closed gas flow field enclosing a process reaction region between a substrate carrier and the deposition nozzle such that the residues after the precursor gas reacts with the surface of the substrate do not leak.

Deposition nozzle and apparatus for thin film deposition process

Disclosed is an encapsulation film. An inorganic oxide film is formed on an organic sealing layer by an atomic layer deposition (ALD) to form the encapsulation film, wherein the organic sealing layer is a polymer containing hydrophilic groups. The organic sealing layer and the inorganic oxide layer have covalent bondings therebetween. The encapsulation film can solve the moisture absorption problem of conventional organic sealing layers, thereby being suitable for use as a package of optoelectronic devices.

Encapsulation film, package structure utilizing the same, and method for forming the package structure

A method for depositing a microcrystalline silicon film is disclosed, including performing an open loop and close loop plasma enhanced deposition process without and with modulating process parameters, respectively. A film is deposited by the open loop plasma enhanced deposition process till a required film crystallinity and then performing a closed loop plasma enhanced deposition process which monitors species plasma spectrum intensities SiH* and H&#x3b1; and modulates process parameters of the plasma enhanced deposition process resulting in the species concentration stabilization which controls the intensities variation of SiH* and H&#x3b1; within an allowed range of a target value for improving film depositing rate.

Method for depositing microcrystalline silicon and monitor device of plasma enhanced deposition

A wafer electroplating apparatus with a function of bubble removal includes an electroplating bath main body and a fixing device. The electroplating bath main body has an inlet device, a first de-bubble tank and at least an air hole. The fixing device has a second de-bubble tank and an outer shell. The air hole guides gathering bubbles to an outside of the electroplating bath main body so as to remove bubbles. The fixing device can be put into the first de-bubble tank within the electroplating bath main body to form a de-bubble area and is separated easily therefrom to clean the wafer electroplating apparatus. The electroplating bath main body further includes a baffle for rectifying electroplating solution flow before entering the inlet device.

Wafer electroplating apparatus

The present invention provides a fountain-type electroplating apparatus with functions of voltage detection and flow rectification, comprising: an electroplating tank, a rectification device, and an overflow tank, wherein the electroplating tank is positioned inside the overflow tank, and the rectification device is arranged under the electroplating tank, in addition, the electroplating tank is composed of a shell, a cathode electrode, and an mesh shaped anode. The apparatus of the present invention further comprises: a power supplier, a switcher, a plurality of detection circuits, and a plurality of connecting line, which is used for monitoring the same.

Electroplating apparatus with functions of voltage detection and flow rectification

The present invention relates to a compress and position apparatus with positioning, orientating functions and providing more uniform pressing force compliantly. The compress and position apparatus comprises a guiding column, a base, a housing, a seat, a annular portion and a pressing plate. The base has a cylinder, a plurality of locating pins and a convex portion. The annular portion has a through hole and a plurality of locating holes. The guiding column and the cylinder are disposed in the housing provided with an opening for the guiding column passing therethrough. The housing is mounted on the base and passed through a through hole of the annular portion and disposed in a cavity of the seat. A plane on the housing abuts a plane on the cavity to prevent the rotation of the housing. The guiding column is combined with the seat. The locating pin is inserted into the locating hole. The pressing plate engages the annular portion. Thus the guiding column is moved up and down by the gas supply device. The convex portion biases the pressing plate to exert force on the substrate.

Compress and position apparatus

A method for liquid phase deposition, including the steps of providing at least two raw materials from at least two supply devices of a saturation reaction system into a mixture trough and stirring until saturation occurs, filtering out unnecessary solid-state particles, and providing saturated and filtered liquid into an over-saturation reaction trough of a steady-flow over-saturation loop reaction system and stopping the saturated and filtered liquid when the over-saturation reaction trough is filled and the saturated and filtered liquid over-flows into a liquid level control trough to a pre-determined level. The method also includes the steps of providing a substrate in the over-saturation reaction trough, providing reactants from at least two supply devices into the over-saturation reaction trough, and depositing a thin film onto the substrate when the saturated liquid becomes over-saturated.

Method for liquid phase deposition

A Modified door for wafer container, includes a rotatable cammed member, two first links coupled to the rotatable cammed member and vertically aligned and moved in and out of respective first latch holes on the wafer transport module upon rotary motion of the rotatable cammed member, and two second links respectively coupled to the first links and horizontally moved in and out of respective second latch holes on the wafer transport module upon movement of the first links. The links each have a slope adapted to be moved with the respective link over a respective bearing means of the door body to force the door body inwards against the wafer transport module, keeping the wafer transport module well sealed.

Door for wafer container having rotatable cammed member and movable links

A wafer container is constructed to include a shell, a holder frame, two retaining blocks, and a handle. The shell has a coupling unit at the periphery. The retaining blocks are fastened to the holder frame, forming first pivot structure. The handle is provided with second pivot structure adapted for coupling to the first pivot structure for enabling the handle to be turned relative to the holder frame through an angle between the operative position convenient for carrying by hand, and the collapsed, non-operative position to minimize space occupation.

Wafer container with retractable handle

The present invention relates to a nozzle and adjust module of chemicals when wafers are processed during the IC manufacturing process. After wafers are loaded on a chuck of a reaction chamber, five chemicals required for the manufacturing process are transported into the passages, and are sprayed on the surfaces of rotating wafers via different nozzles. The centrifugal effect due to the rotation of a main motor is exploited to coat the chemicals on the whole wafer quickly and uniformly. The present invention can apply to both closed and open reaction chambers. The spray head of the present invention has a specially designed angle, and has level adjusting and height adjusting functions so that high flexibility in the manufacturing process can be obtained.

Nozzle and adjust module

A wafer backside protection apparatus includes a motor, a vacuum chuck, an annular seat and a top cover. The motor has an output shaft upon which the chuck is mounted. The chuck has a front surface to suck and hold a wafer from its backside. The chuck has a backside in which a water guard ring and a plurality of slant bores are formed. The slant bores run from the water guard ring through the wafer front surface. The annular seat is located below the chuck and has two symmetrical slant nozzles projecting toward motor rotating direction for ejecting protection liquid to the water guard ring. Protection liquid may be spun and splashed out through the slant bores to form a protection liquid film between the chuck and the wafer backside due to centrifugal force resulting from chuck and wafer rotation driven by the motor. The protection liquid film may protect wafer backside from chemical erosion and contamination resulting from wafer production process.

Growing community of inventors

Hsinchu, Taiwan

Jen-Rong Huang