International Business Machines Corporation

Jeffrey Scott Brown

Robert J Gauthier, Jr

Steven H Voldman

Wagdi William Abadeer

William R Tonti

Jed Hickory Rankin

Randy William Mann

Steven J Holmes

Robert K Leidy

Edward J Nowak

Kiran V Chatty

David Michael Fried

Terence B Hook

James Stuart Dunn

Stephen Scott Furkay

Chung H Lam

Andres Bryant

John Atkinson Fifield

Matthew Joseph Breitwisch

Albert Manhee Chu

James Albert Slinkman

Minh H Tong

Eric Adler

Edward W Sengle

Faye D Baker

Jonathan M McKenna

Carl John Radens

David V Horak

James William Adkisson

Christopher Stephen Putnam

Cuc Kim Huynh

Dale Warner Martin

Jeffery Howard Oppold

Paul William Pastel

Michael J Hauser

Beth Ann Rainey

Xiaowei Tian

Bryant C Colwill

Dennis Hoyniak

Mohammad I Younus

Arne Watson Ballantine

Jeffrey D Gilbert

Anthony C Speranza

James J Quinlivan

Jeffrey H Oppold

Xiaowei Tlan

Robert J Gauthler, Jr

Disclosed are embodiments for modeling semiconductor device performance using a single compact model despite changes in performance attribute to model parameter dependency of a single semiconductor device that occur during fitting and/or re-centering due to local layout effects (LLEs) and despite variations in this dependency across multiple related semiconductor devices due to LLEs. In one embodiment, the actual performance attribute to model parameter dependence of a single semiconductor device is fit to a reference dependence so that changes to the compact model are not required even when changes occur in the performance attribute to model parameter dependency during fitting and/or re-centering. In another embodiment, the actual performance attribute to model parameter dependence of each of multiple related semiconductor devices are fit to a reference dependence so that changes to the compact model are not required even when the performance attribute to model parameter dependency varies across the devices.

Modeling semiconductor device performance

Disclosed is a method of executing an electrical function, such as a fusing operation, by activation through a chip embedded photodiode through spectrally selected external light activation, and corresponding structure and circuit. The present invention is based on having incident light with specific intensity/wave length characteristics, in conjunction with additional circuit elements to an integrated circuit, perform the implementation of repairs, i.e., replacing failing circuit elements with redundant ones for yield and/or reliability. Also to perform disconnection of ESD protection device from input pad one the packaged chip is placed in system. No additional pins on the package are necessary.

On demand circuit function execution employing optical sensing

A semiconductor structure and a system for fabricating an integrated circuit chip. The semiconductor structure includes: a buried oxide layer on a semiconductor wafer; a thin fin structure on the buried oxide layer, wherein the thin fin structure includes a first hard mask on a semiconductor fin, wherein the semiconductor fin is disposed between the first hard mask and a surface of the buried oxide layer; and a thick mesa structure on the buried oxide layer, and wherein the thick mesa structure includes a semiconductor mesa. The system for fabricating an integrated circuit chip enables: providing a buried oxide layer on and in direct mechanical contact with a semiconductor wafer; and concurrently forming at least one fin-type field effect transistor and at least one thick-body device on the buried oxide layer.

Semiconductor structure and system for fabricating an integrated circuit chip

A design structure for an integrated circuit that includes at least one tunneling device voltage detection circuit for generating a trigger flag signal. The tunneling device voltage detection circuit includes first and second voltage dividers receiving a supply voltage and having corresponding respective first and second internal node output voltages. The first and second voltage dividers are configured so the first output voltage is linear relative to the supply voltage and so that the second output voltage is nonlinear relative to the supply voltage. As the supply voltage ramps up, the profiles of the first and second output voltage cross at a particular voltage. An operational amplifier circuit senses when the first and second output voltages become equal and, in response thereto, outputs a trigger signal that indicates that the supply voltage has reached a certain level.

Structure for a voltage detection circuit in an integrated circuit and method of generating a trigger flag signal

An integrated circuit that includes at least one tunneling device voltage detection circuit for generating a trigger flag signal. The tunneling device voltage detection circuit includes first and second voltage dividers receiving a supply voltage and having corresponding respective first and second internal node output voltages. The first and second voltage dividers are configured so the first output voltage is linear relative to the supply voltage and so that the second output voltage is nonlinear relative to the supply voltage. As the supply voltage ramps up, the profiles of the first and second output voltage cross at a particular voltage. An operational amplifier circuit senses when the first and second output voltages become equal and, in response thereto, outputs a trigger signal that indicates that the supply voltage has reached a certain level.

Voltage detection circuit in an integrated circuit and method of generating a trigger flag signal

The disclosure describes an integrated circuit with multiple semiconductor fins having different widths and variable spacing on the same substrate. The method of forming the circuit incorporates a sidewall image transfer process using different types of mandrels. Fin thickness and fin-to-fin spacing are controlled by an oxidation process used to form oxide sidewalls on the mandrels, and more particularly, by the processing time and the use of intrinsic, oxidation-enhancing and/or oxidation-inhibiting mandrels. Fin thickness is also controlled by using sidewalls spacers combined with or instead of the oxide sidewalls. Specifically, images of the oxide sidewalls alone, images of sidewall spacers alone, and/or combined images of sidewall spacers and oxide sidewalls are transferred into a semiconductor layer to form the fins. The fins with different thicknesses and variable spacing can be used to form a single multiple-fin FETs.

Method and structure to process thick and thin fins and variable fin to fin spacing

Disclosed is a method of executing an electrical function, such as a fusing operation, by activation through a chip embedded photodiode through spectrally selected external light activation, and corresponding structure and circuit. The present invention is based on having incident light with specific intensity/wave length characteristics, in conjunction with additional circuit elements to an integrated circuit, perform the implementation of repairs, i.e., replacing failing circuit elements with redundant ones for yield and/or reliability. Also to perform disconnection of ESD protection device from input pad once the packaged chip is placed in system. No additional pins on the package are necessary.

An integrated circuit chip and a semiconductor structure. The integrated circuit chip includes: a thick-body device containing a semiconductor mesa and a doped body contact; and a field effect transistor on a first sidewall of a semiconductor mesa, wherein the doped body contact is on a second sidewall of the semiconductor mesa, and wherein the semiconductor mesa is disposed between the field effect transistor and the doped body contact. The semiconductor structure includes: a buried oxide layer on a semiconductor wafer; a thin fin structure on the buried oxide layer, wherein the thin fin structure includes a first hard mask on a semiconductor fin, wherein the semiconductor fin is disposed between the first hard mask and a surface of the buried oxide layer; and a thick mesa structure on the buried oxide layer, and wherein the thick mesa structure includes a semiconductor mesa.

Concurrent fin-fet and thick body device fabrication

Voltage detection circuit and circuit for generating a trigger flag signal

Disclosed is an integrated circuit with multiple semiconductor fins having different widths and variable spacing on the same substrate. The method of forming the circuit incorporates a sidewall image transfer process using different types of mandrels. Fin thickness and fin-to-fin spacing are controlled by an oxidation process used to form oxide sidewalls on the mandrels, and more particularly, by the processing time and the use of intrinsic, oxidation-enhancing and/or oxidation-inhibiting mandrels. Fin thickness is also controlled by using sidewalls spacers combined with or instead of the oxide sidewalls. Specifically, images of the oxide sidewalls alone, images of sidewall spacers alone, and/or combined images of sidewall spacers and oxide sidewalls are transferred into a semiconductor layer to form the fins. The fins with different thicknesses and variable spacing can be used to form a single multiple-fin FET or, alternatively, various single-fin and/or multiple-fin FETs.

A method and structure is disclosed for a transistor having a gate, a channel region below the gate, a source region on one side of the channel region, a drain region on an opposite side of the channel region from the source region, a shallow trench isolation (STI) region in the substrate between the drain region and the channel region, and a drain extension below the STI region. The drain extension is positioned along a bottom of the STI region and along a portion of sides of the STI. Portions of the drain extension along the bottom of the STI may comprise different dopant implants than the portions of the drain extensions along the sides of the STI. Portions of the drain extensions along sides of the STI extend from the bottom of the STI to a position partially up the sides of the STI. The STI region is below a portion of the gate. The drain extension provides a conductive path between the drain region and the channel region around a lower perimeter of the STI. The drain region is positioned further from the gate than the source region.

Method of forming high voltage N-LDMOS transistors having shallow trench isolation region with drain extensions

An inverse-T transistor is formed by a method that decouples the halo implant, the deep S/D implant and the extension implant, so that the threshold voltage can be set by adjusting the halo implant without being affected by changes to the extension implant that are intended to alter the series resistance of the device. Formation of the inverse-T structure can be made by a damascene method in which a temporary layer deposited over the layer that will form the cross bar of the T has an aperture formed in it to hold the gate electrode, the aperture being lined with vertical sidewalls that provide space for the ledges that form the T. Another method of gate electrode formation starts with a layer of poly, forms a block for the gate electrode, covers the horizontal surfaces outside the gate with an etch-resistant material and etches horizontally to remove material above the cross bars on the T, the cross bars being protected by the etch resistant material.

MOSFET with decoupled halo before extension

The present invention provides methods for fabrication of fin-type field effect transistors (FinFETs) and thick-body devices on the same chip using common masks and steps to achieve greater efficiency than prior methods. The reduction in the number of masks and steps is achieved by using common masks and steps with several scaling strategies. In one embodiment, the structure normally associated with a FinFET is created on the side of a thick silicon mesa, the bulk of which is doped to connect with a body contact on the opposite side of the mesa. The invention also includes FinFETs, thick-body devices, and chips fabricated by the methods.

Concurrent Fin-FET and thick-body device fabrication

A method for detecting semiconductor process stress-induced defects. The method comprising: providing a polysilicon-bounded test diode, the diode comprising a diffused first region within an upper portion of a second region of a silicon substrate, the second region of an opposite dopant type from the first region, the first region surrounded by a peripheral dielectric isolation, a peripheral polysilicon gate comprising a polysilicon layer over a dielectric layer and the gate overlapping a peripheral portion of the first region; stressing the diode; and monitoring the stressed diode for spikes in gate current during the stress, determining the frequency distribution of the slope of the forward bias voltage versus the first region current at the pre-selected forward bias voltage and monitoring, after stress, the diode for soft breakdown. A DRAM cell may be substituted for the diode. The use of the diode as an antifuse is also disclosed.

Test structure and methodology for semiconductor stress-induced defects and antifuse based on same test structure

A method is described for fabricating and antifuse structure () integrated with a semiconductor device such as a FINFET or planar CMOS devise. A region of semiconducting material () is provided overlying an insulator () disposed on a substrate (); an etching process exposes a plurality of corners () in the semiconducting material. The exposed corners are oxidized to form elongated tips () at the corners; the oxide () overlying the tips is removed. An oxide layer (), such as a gate oxide, is then formed on the semiconducting material and overlying the corners; this layer has a reduced thickness at the corners. A layer of conducting material () is formed in contact with the oxide layer () at the corners, thereby forming a plurality of possible breakdown paths between the semiconducting material and the layer of conducting material through the oxide layer. Applying a voltage, such as a burn-in voltage, to the structure converts at least one of the breakdown paths to a conducting path ().

Integrated antifuse structure for FINFET and CMOS devices

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Middlesex, VT, United States of America

Jeffrey Scott Brown