Lam Research Corporation

Jeffrey G Gasparitsch

Mark Henry Wilcoxson

Jason A Ryder

Andrew D Bailey, Iii

Fritz C Redeker

Hyungsuk Alexander Yoon

John P Parks

Ji Zhu

Charles N Ditmore

Stephan Hoffmann

Randy Johnson

An apparatus, system and method for cleaning a substrate edge include a bristle brush unit that cleans bevel polymers deposited on substrate edges using frictional contact in the presence of cleaning chemistry. The bristle brush unit is made up of a plurality of outwardly extending vanes and is mounted on a rotating shaft. An abrasive material is distributed throughout and within the outwardly extending vanes of the bristle brush unit to provide the frictional contact. The bristle brush unit cleans the edge of the substrate by allowing frictional contact of the plurality of abrasive particles with the edge of the substrate in the presence of fluids, such as cleaning chemistry, to cut, rip and tear the bevel polymer from the edge of the substrate.

Apparatus for isolated bevel edge clean and method for using the same

An apparatus, system and method for cleaning a substrate edge include a composite applicator that cleans bevel polymers deposited on wafer edges using frictional contact in the presence of fluids. The composite applicator includes a support material and a plurality of abrasive particles distributed within and throughout the support material. The composite applicator cleans the edge of the wafer by allowing frictional contact of the plurality of abrasive particles with the edge of the wafer in the presence of fluids, such as liquid chemicals, to cut, rip and tear the bevel polymer from the edge of the wafer.

Apparatus for cleaning edge of substrate and method for using the same

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Fremont, CA, United States of America

Jeffrey G Gasparitsch