Stats Chippac Pte. Ltd.

St Assembly Test Services Inc.

Jeffrey David Punzalan

Zigmund Ramirez Camacho

Henry Descaizo Bathan

Arnel Senosa Trasporto

Il Kwon Shim

Lionel Chien Hui Tay

Henry Descalzo Bathan

Jose Alvin Caparas

Jae Hun Ku

Jairus Legaspi Pisigan

Byung Tai Do

Byung Joon Han

Emmanuel Espiritu

Bartholomew Liao Chung Foh

Dao Nguyen Phu Cuong

Antonio Bambalan Dimaano, Jr

Soo Won Lee

Seng Guan Chow

Dioscoro A Merilo

KyungOe Kim

SeungYong Chai

Kyung Moon Kim

Abelardo Hadap Advincula, Jr

Keng Kiat Lau

Kwok Keung Szeto

Pandi Chelvam Marimuthu

Jong-Woo Ha

Jae Hak Yee

Kambhampati Ramakrishna

Sheila Marie L Alvarez

Koo Hong Lee

Hien Boon Tan

Leocadio Morona Alabin

Allan Pumatong Ilagan

Abelardo Jr Hadap Advincula

Zheng Zheng

Guruprasad Badakere Govindaiah

Robinson Quiazon

JuHyun Park

Amel Trasporto

Henry D Bathan, Jr

An integrated circuit packaging system, and a method of manufacture thereof, including: a substrate including: a first trace layer, an encapsulation on the first trace layer, the first trace layer having a surface exposed from the encapsulation with a rough texture characteristic of removal of a conductive carrier coating, a second trace layer on the encapsulation and over the first trace layer, the second trace layer connected to the first trace layer; and an integrated circuit die attached to the substrate.

Integrated circuit packaging system with substrate and method of manufacture thereof

A system and a method of manufacture thereof of integrated circuit packaging system, including: a pillar; a conductive buildup attached to the pillar; and a molded body encapsulating the conductive buildup, the pillar extending out of the molded body.

Integrated circuit packaging system with interposer structure and method of manufacture thereof

A semiconductor device is made by forming solder bumps over a copper carrier. Solder capture indentations are formed in the copper carrier to receive the solder bumps. A semiconductor die is mounted to the copper carrier using a die attach adhesive. The semiconductor die has contact pads formed over its active surface. An encapsulant is deposited over the copper carrier, solder bumps, and semiconductor die. A portion of the encapsulant is removed to expose the solder bumps and contact pads. A conductive layer is formed over the encapsulant to connect the solder bumps and contact pads. The conductive layer operates as a redistribution layer to route electrical signals from the solder bumps to the contact pads. The copper carrier is removed. An insulating layer is formed over the conductive layer and encapsulant. A plurality of semiconductor devices can be stacked and electrically connected through the solder bumps.

Semiconductor device and method of forming a wafer level package with top and bottom solder bump interconnection

An integrated circuit packaging system and method of manufacture thereof includes: discrete components coupled to a top trace; vias attached to the top trace separated from the discrete components; a dielectric layer on the top trace, the discrete components, and the vias, includes a component surface formed above the discrete components, with the top trace coplanar with the dielectric layer; and system interconnects coupled to the vias for electrically connecting the top trace, the discrete components, or a combination thereof to the system interconnects.

Integrated circuit packaging system with coreless substrate and method of manufacture thereof

A semiconductor device includes a semiconductor die having contact pads disposed over a surface of the semiconductor die, a die attach adhesive layer disposed under the semiconductor die, and an encapsulant material disposed around and over the semiconductor die. The semiconductor device further includes bumps disposed in the encapsulant material around a perimeter of the semiconductor die. The bumps are partially enclosed by the encapsulant material. The semiconductor device further comprises first vias disposed in the encapsulant. The first vias expose surfaces of the contact pads. The semiconductor device further includes a first redistribution layer (RDL) disposed over the encapsulant and in the first vias, and a second RDL disposed under the encapsulant material and the die attach adhesive layer. The first RDL electrically connects each contact pad of the semiconductor die to one of the bumps, and the second RDL is electrically connected to one of the bumps.

Semiconductor device with bump interconnection

An integrated circuit package system including: providing a die pad with a top, sides, and a bottom, the bottom having a relief with a flat surface and defining a wall and a center pad; mounting a barrier under the bottom of the die pad; mounting an integrated circuit die on the top of the die pad; encapsulating the integrated circuit die and the top and sides of the die pad with the wall preventing encapsulation from flowing along the barrier to reach the center pad; and mounting an external interconnect on the center pad.

Integrated circuit package system with relief

A method of manufacture of an integrated circuit packaging system includes: forming a lead-frame having a die attach paddle and a contact pad connected by a link; mounting an integrated circuit die over the die attach paddle; molding a package body on the lead-frame and the integrated circuit die including leaving portions of the die attach paddle, the contact pad, and the link exposed from the package body; forming an exposed edge by etching away the link between the contact pad, and the die attach paddle; and depositing a solder-resistant layer on the exposed edge.

Integrated circuit packaging system with protective coating and method of manufacture thereof

An integrated circuit package system provides a known good die module by providing a leadframe, providing a first die, attaching the first die to the leadframe, and encapsulating at least the first die. A second die is attached to the known good die module such that the known good die module is a substrate for the second die. The second die is electrically attached to the known good die module. At least the second die is additionally encapsulated.

Integrated circuit package system including wide flange leadframe

An integrated circuit package system includes: forming a flex bump over an integrated circuit device structure, the flex bump having both a base portion and an offset portion over the base portion; forming a first ball bond of a first internal interconnect over the offset portion; and encapsulating the integrated circuit device structure, the flex bump, and the first internal interconnect.

Integrated circuit package system with flex bump

A method of manufacture of an integrated circuit package system includes: forming a paddle, an outer lead, and an inner lead between the paddle and the outer lead; forming a non-vertical paddle edge of the paddle and a non-vertical lead edge of the inner lead facing the non-vertical paddle edge; and encapsulating an integrated circuit die over the paddle.

Integrated circuit package system with integral inner lead and paddle and method of manufacture thereof

An integrated circuit package system with laminate base includes: a base package including: a laminate substrate strip, an integrated circuit on the laminate substrate strip, a molded cover over the integrated circuit and the laminate substrate strip, and a strip test of the base package; a bare die on the base package; the bare die electrically connected to the laminate substrate strip; and the bare die and the base package encapsulated.

Integrated circuit package system with laminate base

An integrated circuit package system is provided forming a die support system from a padless lead frame having die supports with each substantially equally spaced from another, and attaching an integrated circuit die having a peripheral area on the die supports.

Padless die support integrated circuit package system

Growing community of inventors

Singapore, Singapore

Jeffrey David Punzalan