International Business Machines Corporation

Jeffery Burton Maxson

Anthony K Stamper

Huilong Zhu

Kenneth John Giewont

Cung D Tran

Daniel Scott Vanslette

Scott R Stiffler

Mohammed Fazil Fayaz

Aurelia A Suwarno-Handayana

Shamas M Ummer

Keith Kwong Hon Wong

Yun-Yu Wang

Richard Anthony Conti

Michael F Lofaro

Daewon Yang

Thomas F Houghton

Ann H McDonald

Methods and structures for controlling wafer curvature during fabrication of integrated circuits caused by stressed films. The methods include controlling the conductor density of wiring levels, adding compensating stressed film layers and disturbing the continuity of stress films with the immediately lower layer. The structure includes integrated circuits having compensating stressed film layers.

Methods for controlling wafer curvature

Methods and structures for controlling wafer curvature

The semiconductor structure is provided that has entirely self-aligned metallic contacts. The semiconductor structure includes at least one field effect transistor located on a surface of a semiconductor substrate. The at least one field effect transistor includes a gate conductor stack comprising a lower layer of polysilicon and an upper layer of a first metal semiconductor alloy, the gate conductor stack having sidewalls that include at least one spacer. The structure further includes a second metal semiconductor alloy layer located within the semiconductor substrate at a footprint of the at least one spacer. The structure also includes a first metallic contact comprising a metal from Group VIII or IB of the Periodic Table of Elements and at least one of W, B, P, Mo and Re located on, and self-aligned to the first metal semiconductor alloy layer and a second metallic contact comprising a metal from Group VIII or IB of the Periodic Table of Elements and at least one of W, B, P, Mo and Re located on, and self-aligned to the second metal semiconductor alloy layer.

Structure and method of creating entirely self-aligned metallic contacts

An embodiment of the invention provides a method of creating local metallization in a semiconductor structure, and the use of local metallization so created in semiconductor structures. In one respect, the method includes forming an insulating layer on top of a semiconductor substrate; creating a plurality of voids inside the insulating layer, with the plurality of voids spanning across a predefined area and being substantially confined within a range of depth below a top surface of the insulating layer; creating at least one via hole in the insulating layer, with the via hole passing through the predefined area; and filling the via hole, and the plurality of voids inside the insulating layer through at least the via hole, with a conductive material to form a local metallization. A semiconductor structure having the local metallization is also provided.

Local metallization and use thereof in semiconductor devices

The present invention relates to a bilayer cap structure for interconnect structures that comprise copper metallization or other conductive metallization. Such bilayer cap structure includes a first cap layer formed by an unbiased high density plasma (HDP) chemical vapor deposition process, and a second cap layer over the first cap layer, where the second cap layer is formed by a biased high density plasma (bHDP) chemical vapor deposition process. During the bHDP chemical vapor deposition process, a low AC bias power is applied to the substrate to increase the ion bombardment on the substrate surface and to induce resputtering of the capping material, thereby forming a seamless second cap layer with excellent reactive ion etching (RIE) selectivity.

Bilayer cap structure including HDP/bHDP films for conductive metallization and method of making same

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New Windsor, NY, United States of America

Jeffery Burton Maxson