International Business Machines Corporation

Jason Michael Norman

Sebastian Theodore Ventrone

Kenneth Joseph Goodnow

Serafino Bueti

Igor Arsovski

Joseph Andrew Iadanza

Gregory John Mann

Adam J Courchesne

Francis A Kampf

Hemen R Shah

Stanley B Stanski

Scott T Vento

Riyon W Harding

Todd Edwin Leonard

Charles Joseph Masenas

Jesse Ethan Craig

Hayden C Cranford, Jr

Clarence Rosser Ogilvie

Peter Anthony Sandon

Charles S Woodruff

Mark Steven Styduhar

Nancy H Pratt

Peter Joel Jenkins

Gary R Doyle

Michael J Boudreaux

Methods and systems initiate a simulation of an integrated circuit design. The simulation produces data that will exist in latches of the integrated circuit design when a device manufactured according to the integrated circuit design is operating. The methods and systems evaluate same-state latches associated with different portions of the simulation. If two of the same-state latches have the same state, given the same inputs and environmental conditions, the method and systems terminate a first portion of the simulation associated with a first of the same-state latches, but allow a second portion of the simulation associated with a second of the same-state latches to proceed.

Functional simulation redundancy reduction by state comparison and pruning

A design structure including universal peripheral processor architecture on an integrated circuit (IC) includes a first data bus and a second data bus communicating with first and second ternary content addressable memory (TCAM) devices configured as state machines. First and second processors are coupled to the first bus interface logic and the second bus interface logic. First and second data storage devices communicate with the first and second processors and are coupled to the first and second data buses and communicate with each other. The TCAM devices are configured as state machines and are coupled to and adapted to interface with the processors, the data storage devices, and the bus interface logic using predefined protocols.

Structure for hardware assisted bus state transition circuit using content addressable memories

Cross-die connection structure and method for a die or chip includes buffer elements having a buffer driver and bypass, and control lines coupled to the buffer elements in order to select one of the buffer driver and bypass for each respective buffer element. A logic network is arranged with the buffer elements to form functional paths, a test unit is structured and arranged to test the functional paths and to be coupled to the control lines, and a configuration storage register to set the selected one of the buffer driver and bypass for each passing functional path.

Critical path redundant logic for mitigation of hardware across chip variation

A system and method for verifying system-on-chip interconnect includes a first linear feedback shift register coupled to an output interface of a first system-on-chip component, a second linear feedback shift register instantiated in a second system-on-chip component, and a comparator coupled to the second linear feedback shift register and the input interface of the second system-on-chip. Another method for verifying includes generating a pseudo-random number sequence with the first linear feedback shift register and the second linear feedback shift register using an identical first initial state, and comparing an output of the first linear feedback shift register with an output of the second linear feedback shift register and reporting a miss-compare.

System and method for system-on-chip interconnect verification

An embodiment of a design structure is shown for noise reduction comprising synthesizing blocks of sequential latches, e.g., a pipeline circuit architecture or clocking domain, which comprises combinational logic, synthesizing a root or a master clock and at least one phase-shifted sub-domain clock for each block, assigning primary inputs and primary outputs of the block to the root clock, assigning non-primary inputs and non-primary outputs of the block to the sub-domain clock, splitting root clock inputs into root clock inputs and phase-shifted sub-domain clock inputs, assigning each of the blocks a different phase-shifted sub-domain clock phase offset, creating a clock generation circuitry for the root clocks and the phase-shifted sub-domain clocks.

Transition balancing for noise reduction/Di/Dt reduction during design, synthesis, and physical design

A method, system and computer program product reducing clock noise generated by clock signals in an integrated circuit (IC) are disclosed. Conventional IC design attempts to ensure coincident clock active edge arrival times for all clocked elements. The coincident active clock edges generate coincident noise currents, which elevates the total noise current. The current invention assigns clock arrival times for clocked elements of an IC based on a desired clock arrival time distribution such that active clock edges are not coincident. As a consequence, the total noise would be spread over a large portion of the clock cycle, thus reducing the noise magnitude substantially.

Assigning clock arrival time for noise reduction

A method for noise comprising synthesizing blocks of sequential latches, e.g., a pipeline circuit architecture or clocking domain, which comprises combinational logic, synthesizing a root or a master clock and at least one phase-shifted sub-domain clock for each block, assigning primary inputs and primary outputs of the block to the root clock, assigning non-primary inputs and non-primary outputs of the block to the sub-domain clock, splitting root clock inputs into root clock inputs and phase-shifted sub-domain clock inputs, assigning each of the blocks a different phase-shifted sub-domain clock phase offset, creating a clock generation circuitry for the root clocks and the phase-shifted sub-domain clocks.

Transition balancing for noise reduction /Di/Dt reduction during design, synthesis, and physical design

Disclosed are embodiments of a manufacturing method that establishes a library of pre-made and pre-qualified masks for patterning different blocks of circuitry that meet established performance and timing requirements. The embodiments of the method use stepped exposures of multiple masks, including at least one mask selected from this library, to pattern a chip design onto a silicon wafer, where the chip design is made up of two or more interconnected blocks of circuitry. Consequently, for a given integrated circuit design, pre-made/pre-qualified mask(s) can be selected from the library to pattern one, some or all blocks of circuitry for the design. Optionally, additional masks can be specially made and qualified to pattern other block(s) of circuitry (e.g., application specific logic) within the design. The blocks of circuitry patterned in this manner can be electrically connected via generic or customized interfaces in order to complete the chip design.

Method of manufacturing integrated circuits using pre-made and pre-qualified exposure masks for selected blocks of circuitry

A design verification method, comprising providing a circuit design; creating a stimulus tree diagram for the circuit design, wherein the stimulus tree diagram comprises L stimuli, M checkpointed splits, and N non-checkpointed splits; and executing the stimulus tree diagram, wherein said executing the stimulus tree diagram comprises, for i=1, . . . , M, executing an icheckpointed split of the M checkpointed splits, wherein said executing the icheckpointed split comprises (a) saving an icontext of an isimulation environment in which said executing the stimulus tree diagram is performed; and (b) after said saving the icontext is performed, executing from the icontext along Pi paths of the stimulus tree diagram branching from the icheckpointed split, wherein the icheckpointed split is a Pi-way split, Pi being an integer greater than 1.

Circuit design verification using checkpointing

Disclosed is an integrated circuit comprising a plurality of cores attached to at least one transmitter and receiver, an optical transmission network embedded within the wire levels of the integrated circuit, and wherein the transmitter and receivers send and receive data on the network. Also disclosed is a method of transmitting signals within an integrated circuit comprising an integrated circuit comprising a plurality of cores and optical paths, selecting an optical path from the plurality of optical paths for transmitting data, and transmitting the data on the selected optical path. Also disclosed is an integrated circuit comprising an optical transmission network, a plurality of cores, and a plurality of controllers, all three being operatively attached to each other.

Fiber optic transmission lines on an SOC

An apparatus for monitoring the temperature of an integrated circuit device includes a conductive wiring pattern formed on the integrated circuit device, extending into areas of the device to be monitored. A deterministic signal source is configured to generate a deterministic signal along the conductive wiring pattern, with one or more return paths tapped from selected locations along the pattern. A temperature change determination circuit is coupled to the one or more return paths and to a reference signal taken from the deterministic signal source. The circuit is configured to determine a delay between the reference signal and a delay signal traveling through at least a portion of the wiring pattern and a corresponding one of the return paths.

Method and apparatus for monitoring integrated circuit temperature through deterministic path delays

A communication system for transmitting data between cores embedded in an integrated circuit on a silicon chip. Communication system includes transmitter circuitry for wirelessly transmitting data between cores and receiver circuitry for wirelessly receiving the transmission of data from other cores. Both transmitter circuitry and receiver circuitry may include of a phase-locked loop circuit having a voltage-controlled oscillator. Each core may transmit and receive data on a unique frequency with respect to other cores embedded in an integrated circuit on a silicon chip or transmit and receive data on the same frequency as other cores embedded in an integrated circuit on a silicon chip. Groups of cores may share transmitter and receiver circuitry.

Wireless communication system within a system on a chip

A structure and associated method of transfer data on a semiconductor device, comprising: a plurality of systems within the semiconductor device. Each system comprises at least one processing device and a local memory structure. Each processing device is electrically coupled to each local memory structure within each system. Each local memory structure is electrically coupled to each of the other said local memory structures. Each local memory structure is adapted to share address space with each of the processing devices. Each processing device is adapted to transmit data and instructions to each local memory structure.

Semiconductor device comprising a plurality of memory structures

A communication system () for transmitting data between cores () embedded in an integrated circuit on a silicon chip (). Communication system () includes transmitter circuitry () for wirelessly transmitting data between cores () and receiver circuitry () for wirelessly receiving the transmission of data from other cores. Both transmitter circuitry () and receiver circuitry () may include of a phase-locked loop circuit () having a voltage-controlled oscillator (). Each core () may transmit and receive data on a unique frequency with respect to other cores embedded in an integrated circuit on a silicon chip () or transmit and receive data on the same frequency as other cores embedded in an integrated circuit on a silicon chip (). Groups of cores () may share transmitter and receiver circuitry (and).

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Essex Junction, VT, United States of America

Jason Michael Norman