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Infineon Technologies Ag

Infineon Technologies Austria Ag

Jan Fuhrmann

Thomas Basler

Hans-Guenter Eckel

Dethard Peters

Hans-Günter Eckel

Quang Tien Tran

Felix Kayser

Florian Stoermer

Hans-Günther Eckel

In an example, a semiconductor device includes an insulated gate transistor cell, a first region (e.g., a drain region and/or a drift region), a cathode region, a second region (e.g., an anode region and/or a separation region), and a source electrode. The insulated gate transistor cell includes a source region and a gate electrode. The source region and the cathode region are in a silicon carbide body. The gate electrode and the cathode region are electrically connected. The cathode region, the source region, and the first region have a first conductivity type. The second region has a second conductivity type and is between the cathode region and the first region. The source electrode and the source region are electrically connected. The source electrode and the second region are in contact with each other. A rectifying junction is electrically coupled between the source electrode and the cathode region.

Semiconductor device with insulated gate transistor cell and rectifying junction

A method for operating an IGBT includes determining a maximum stationary reverse bias required for operation of the IGBT, determining a first removal charge, the removal of which at the gate of the IGBT causes an electric field strength that enables the IGBT to accept the maximum stationary reverse bias during stationary blocking, determining a second removal charge, the removal of which at the gate causes an electric field strength that leads to a dynamic avalanche, and, when the IGBT is switched off, removing from the gate during a charge removal duration a removal charge that is greater than the first removal charge and smaller than the second removal charge.

Operating a bipolar transistor having an insulated gate electrode

In accordance with an embodiment, at least one switching circuit includes a voltage clamping element, and a half-bridge with a high-side switch and a low side-switch, wherein the high-side switch and the low-side switch each comprise a control node and a load path, and wherein the load paths of the high-side switch and the low side switch are connected in series. The voltage clamping element is connected in parallel with the half-bridge such that a first overall inductance of first conductors connecting the high-side switch and the low-side switch and connecting the voltage clamping element with the half-bridge is less than 20 nH.

Electronic circuit with a half-bridge circuit and a voltage clamping element

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Rostock, Germany

Jan Fuhrmann