Advanced Micro-fabrication Equipment, Inc. Asia

James Yang

Zhaohui Xi

Stanley Liu

A reactive correction to chamber impedance changes without the need to change the process recipe is disclosed. The reactive correction may be done automatically and repeatedly during processing. A control of RF power application to a plasma processing chamber is performed, so as to minimize reflected power and efficiently apply the RF power to the plasma. Autotuning of the RF power application is enabled without modifying a qualified process recipe. The autotuning can be applied using frequency matching and RF matching network tuning.

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Union City, CA, United States of America

James Yang