Air Products and Chemicals, Inc.

James Richard Thurmond

Robert Sam Zorich

David A Roberts

John Anthony Thomas Norman

Morteza Farnia

This invention relates to copper(+1)(&#x3b2;-diketonate)(L) and related copper complexes such as copper (+1)(&#x3b2;-ketoiminate)(L) represented by the formula:wherein X represents O or NR, Rand Rare each independently comprised of the group Calkyl, Cfluoroalkyl, aryl, Calkoxy, and Calkyl ethers and Ris H, Calkyl, Calkoxy, and halogen, Ris Calkyl, Cfluoroalkyl, phenyl, alkylphenyl, trialkylsilyl, and L represents a ligand having the structure:(R)(R)C&#x2550;(R)(R) or R&#x2014;C&#x2261;C&#x2014;Rwherein R, is comprised of the group Calkanol, Calkoxyalkanol, Cunsaturated alkoxyalkanol, trialkylsilanol, Caalkylamine, phenylamine; R, R, and Rare comprised of the group H, Calkyl, triakylsilyl, alkoxy or phenyl.

Copper CVD precursors with enhanced adhesion properties

This invention relates to an improvement in a purification process for producing those liquid copper based complexes of &bgr;-diketones and, particularly the monovalent copper complexes of &bgr;-diketones, which are suited for application by chemical vapor deposition in the electronics industry. In the basic process for preparing a copper based complex, a reactive copper compound is reacted with a fluorinated &bgr;-diketonate and an organo source such as an olefinic source or one having acetylenic unsaturation. Purification is effected by contacting reaction product with a double deionized deoxygenated water source and preferably an acid/water source. An aqueous layer and an organic layer are formed with the aqueous layer containing byproducts and the organic phase containing product.

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Temecula, CA, United States of America

James Richard Thurmond