International Business Machines Corporation

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James Patrick Doyle

Praveen Chaudhari

James Andrew Lacey

Shui-Chih Alan Lien

Eileen Ann Galligan

Minhua Lu

Gareth Geoffrey Hougham

Xiao Hu Liu

Steven Alan Cordes

Alessandro Cesare Callegari

Uttam Shymalindu Ghoshal

James L Speidell

Sampath Purushothaman

Christopher Vincent Jahnes

Paul Stephen Andry

Hiroki Nakano

S Jay Chey

Michael Joseph Rooks

Matthew J Farinelli

David R DiMilia

Paul Alfred Lauro

Nancy C LaBianca

Chandler Todd McDowell

Li Shi

Snigdha Ghoshal

Robert J Von Gutfeld

Kei-Hsiung Yang

James Henry Glownia

Richard Allen John

Chung H Lam

Alan Edward Rosenbluth

Griselda Bonilla

Fuad Elias Doany

Thomas M Shaw

Stephen Mark Rossnagel

Dennis Merton Newns

Howard Smith Landis

Bruce Gordon Elmegreen

Mahesh Govind Samant

Michael Wayne Lane

Lia Krusin-Elbaum

Jerry E Hurst, Jr

Christy Sensenich Tyberg

Eric Gerhard Liniger

John J Ritsko

Joachim Stohr

John J Donelon

Shui-Chin Alan Lien

Xio Hu Liu

Bruce Bennett Doris

Kevin K Chan

Robert Dennis Miller

Russell Alan Budd

Jon Alfred Casey

Willi Volksen

Emanuel Israel Cooper

Teddie Peregrino Magbitang

Brian Richard Sundlof

George L Chiu

Nicholas C Fuller

Geraud J Dubois

Modest M Oprysko

C Richard Guarnieri

Ronald Wayne Nunes

James Vichiconti

Michael James Cordes

Kenneth D Murray

George Liang-Tai Chiu

Joseph Zinter, Jr

Yoshimine Kato

Vaughn P Gross

Steven Allen Cordes

Chen Cai

Shuichi Odahara

Rick J Heh

Yuhichi Momoi

Andrew Bessy

Robin Altman Wanner

Hiro Nakano

Lyle J Rudolph

David Dimilia

A process comprises insulating a porous low k substrate with an organic polymer coating where the polymer does not penetrate or substantially penetrate the pores of the substrate, e.g., pores having a pore diameter of about one nm to about 5 nm, thereby completely or substantially mitigating the potential for capacitance increase of the substrate. The substrate comprises porous microcircuit substrate materials with surface pores optionally opening into subsurface pores. The organic polymer has a molecular weight greater than about 5,000 to greater than about 10,000 and a glass transition temperature greater than about 200&#xb0; C. up to about the processing temperature required for forming the imaging layer and antireflective layer in a microcircuit, e.g., greater than about 225&#xb0; C. The invention includes production of a product by this process and an article of manufacture embodying these features.

Enhanced via fill material and processing for dual damscene integration

A method for fabricating a negative thermal expanding system device includes coating a wafer with a thermally decomposable polymer, patterning the decomposable polymer into repeating disk patterns, releasing the decomposable polymer from the wafer and forming a sheet of repeating patterned disks, suspending the sheet into a first solution with seeding compounds for electroless decomposition, removing the sheet from the first solution, suspending the sheet into a second solution to electrolessly deposit a first layer material onto the sheet, removing the sheet from the second solution, suspending the sheet into a third solution to deposit a second layer of material having a lower TCE value than the first layer of material, separating the patterned disks from one another, and annealing thermally the patterned disks to decompose the decomposable polymer and creating a cavity in place of the decomposable polymer.

Negative thermal expansion system (NTES) device for TCE compensation in elastomer composites and conductive elastomer interconnects in microelectronic packaging

In a liquid crystal display device, a method for creating desirable pretilt angle by means of topography of the substrates, such as a surface that is sloped with respect to the surface of the electrodes. In combination with a low pretilt but highly photo-stable alignment layer, which may be very resistant to high levels of ultraviolet radiation, a high pretilt and photo-stable alignment structure is generated, by essentially combining two incompatible technical approaches. The ever more stringent requirements for projection displays are met. The methods for producing such sloped surfaces and the considerations related to design of the sloped surfaces are disclosed.

Method of producing UV stable liquid crystal alignment

Negative thermal expansion system (NTEs) device for TCE compensation in elastomer compsites and conductive elastomer interconnects in microelectronic packaging

A negative coefficient of thermal expansion particle includes a first bilayer having a first bilayer inner layer and a first bilayer outer layer, and a second bilayer having a second bilayer inner layer and a second bilayer outer layer. The first and second bilayers are joined together along perimeters of the first and second bilayer outer layers and first and second bilayer inner layers, respectively. The first bilayer inner layer and the second bilayer inner layer are made of a first material and the first bilayer outer layer and the second bilayer outer layer are made of a second material. The first material has a greater coefficient of thermal expansion than that of the second material.

Negative coefficient of thermal expansion particles and method of forming the same

The present invention relates to a process for preparing a robust crack-absorbing integrated circuit chip comprising a crack trapping structure containing two metal plates and a via-bar structure sandwiched between said plates.

Crack trapping and arrest in thin film structures

A Negative Thermal Expansion system (NTEs) device for TCE compensation or CTE compensation in elastomer composites and conductive elastomer interconnects in microelectronic packaging. One aspect of the present invention provides a method for fabricating micromachine devices that have negative thermal expansion coefficients that can be made into a composite for manipulation of the TCE of the material. These devices and composites made with these devices are in the categories of materials called 'smart materials' or 'responsive materials.' Another aspect of the present invention provides microdevices comprised of dual opposed bilayers of material where the two bilayers are attached to one another at the peripheral edges only, and where the bilayers themselves are at a minimum stress conditions at a reference temperature defined by the temperature at which the bilayers are formed. These devices have the technologically useful property of volumetrically expanding upon lowering of the device temperature below the reference or processing temperature.

Negative thermal expansion system (NTEs) device for TCE compensation in elastomer composites and conductive elastomer interconnects in microelectronic packaging

An electrically re-programmable fuse (eFUSE) device for use in integrated circuit devices includes an elongated heater element, an electrically insulating liner surrounding an outer surface of the elongated heater element, corresponding to a longitudinal axis thereof, leaving opposing ends of the elongated heater element in electrical contact with first and second heater electrodes. A phase change material (PCM) surrounds a portion of an outer surface of the electrically insulating liner, a thermally and electrically insulating layer surrounds an outer surface of the PCM, with first and second fuse electrodes in electrical contact with opposing ends of the PCM. The PCM is encapsulated within the electrically insulating liner, the thermally and electrically insulating layer, and the first and second fuse electrodes.

Heat-shielded low power PCM-based reprogrammable eFUSE device

Method of forming crack trapping and arrest in thin film structures

Heat-shielded low power PCM-based reprogrammable EFUSE device

A liquid crystal display device includes an alignment layer with constituent materials. The constituent materials have a stoichiometric relationship configured to provide a given pretilt angle. Liquid crystal material is provided in contact with the alignment layer. A method for forming an alignment layer for liquid crystal displays includes forming the alignment layer on a substrate by introducing an amount of material to adjust a stoichiometric ratio of constituent materials wherein the amount is determined to provide a given pretilt angle to the alignment layer. Ions are directed at the alignment layer to provide uniformity of the pretilt angle.

Tilted vertical alignment of liquid crystals employing inorganic thin film composition and ion beam treatment

A method for preparing an alignment layer surface provides a surface on the alignment layer. The surface is bombarded with ions, and reactive gas is introduced to the ion beam to saturate dangling bonds on the surface. Another method for preparing an alignment layer surface provides a surface on the alignment layer. The surface is bombarded with ions and quenched with a reactive component to saturate dangling bonds on the surface.

Stability of ion beam generated alignment layers by surface modification

Multi-domain liquid crystal cells having twist angles less than 90 degrees, and LCDs containing such liquid crystal cells, are provided. Such liquid crystal cells are stable, particularly at zero and high fields, and provide wide viewing angles. Also provided are methods of using an adjustable particle beam in combination with a mask to generate multi-domains alignments. Such methods are useful for producing liquid crystal cells in general, and for producing the novel multi-domain low twist angle liquid crystal cells of the present invention in particular.

Multi-domain low twist angle liquid crystal cells and methods of production thereof

A scanning heat flow probe for making quantitative measurements of heat flow through a device under test is provided. In one embodiment the scanning heat flow probe includes an electric current conductor in a cantilever beam connected to a probe tip and coupled to two voltmeter leads. The probe also includes two thermocouple junctions in the cantilever beam electrically isolated from the electric current conductor and the two voltmeter leads. Heat flow is derived quantitatively using only voltage and current measurements. In other forms, the invention relates to the calibration of scanning heat flow probes through a method involving interconnected probes, and relates to the minimization of heat flow measurement uncertainty by probe structure design practices.

Scanning heat flow probe

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Bronx, NY, United States of America

James Patrick Doyle