Air Products and Chemicals, Inc.

Versum Materials Us, LLC

James Matthew Henry

Xiaobo Shi

Hongjun Zhou

Krishna P Murella

Joseph D Rose

Dnyanesh Chandrakant Tamboli

James Allen Schlueter

Daniel Hernandez Castillo, Ii

Maitland Gary Graham

Savka I Stoeva

Savaka I Stoeva

Chemical Mechanical Planarization (CMP) polishing compositions comprising abrasive particles and additives to boost removal rates of films comprising elemental silicon such as poly-silicon and Silicon-Germanium.

Chemical mechanical planarization of films comprising elemental silicon

Chemical-mechanical polishing (CMP) compositions containing chemical additives and methods of using the CMP compositions are disclosed. The CMP composition comprises abrasive; chemical additive; liquid carrier; optionally an oxidizing agent; a pH buffering agent and salt; a surfactant and a biocide. The CMP compositions and the methods provide enhanced removing rate for 'SiC', SiN' and 'SiCN&#x201d; films; and tunable removal selectivity for &#x201c;SiC&#x201d; in reference to SiO, &#x201c;SiN&#x201d; in reference to SiO, &#x201c;SiC&#x201d; in reference to &#x201c;SiN&#x201d;, or &#x201c;SiCN&#x201d; in reference to SiO; wherein x ranges from 0.1 wt % to 55 wt %, y ranges from 0.1 wt % to 32 wt %.

Chemical mechanical polishing composition having chemical additives and methods for using same

An effective chemical mechanical planarization (CMP) method is provided for forming vias in silicon wafers for the fabrication of stacked devices using TSV (through-silicon via) technology. The method affords high removal rates of both metal (e.g., copper) and silicon such that a need for a grinding step prior to CMP processing may not be necessary. The method affords an approximately 1:1 Cu:Si selectivity for removal of silicon and copper under appropriate conditions and the Cu:Si selectivity is tunable by adjustment of levels of some key components.

Method for forming through-base wafer vias for fabrication of stacked devices

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Mesa, AZ, United States of America

James Matthew Henry