Taiwan Semiconductor Manufacturing Comp. Ltd.

Lite-on Technology Corporation

Nova Measuring Instruments Ltd.

Guan Technologies, LLC

James Chen

Kuo-Wei Lin

Kenneth Lin

Wei Ti Lee

Heath A Pois

Chiou-Shian Peng

Laxmi Warad

Parker Lund

Benny Tseng

Dmitry Kislitsyn

Gilbert Fane

Alex Fahn

Saurabh Singh

Eugene Chu

Fu-Jier Fahn

Euegene Chu

Gilbert Fan

Eugene Cheu

Chien-Shian Peng

A system to characterize a film layer within a measurement box is disclosed. The system obtains a first mixing fraction corresponding to a first X-ray beam, the mixing fraction represents a fraction of the first X-ray beam inside a measurement box of a wafer sample, the measurement box represents a bore structure disposed over a substrate and having a film layer disposed inside the bore structure. The system obtains a contribution value for the measurement box corresponding to the first X-ray beam, the contribution value representing a species signal outside the measurement box that contributes to a same species signal inside the measurement box. The system obtains a first measurement detection signal corresponding to a measurement of the measurement box using the first X-ray beam. The system determines a measurement value of the film layer based on the first measurement detection signal, the contribution value, and the first mixing fraction.

Characterizing and measuring in small boxes using XPS with multiple measurements

The present invention relates to a method for displaying the location of a cellular phone caller. In the present method, a caller's cellular phone transmits a short message preset by a cellular base station to the base station through an Unstructured Supplementary Service Data (USSD) function by using a cellular phone and selects to start or stop a function for informing the location of a caller to a phone answerer. When a phone call is made and the location informing function is stopped, the base station transmits no caller location information to an answerer's cellular phone. If the location informing function is activated, the base station uses a positioning technology to calculate position coordinates of the caller. And then, the base station compares the position coordinates with a location data stored in a position coordinate data base of the base station and transforms the location to a closest address so as to display the caller's address in the answerer's phone by a Class 0 SMS (short message system).

Method for displaying location of cellular phone caller

A far end remote control method and system by a short message and Bluetooth function operation are used to control output/input devices at a far end. The system mainly comprises a cellular phone, controlling device and controlled devices. Here, the method comprises the following steps: first, a cellular phone transmits a short message control command to a controlling device through a cellular phone network; the controlling device searches a controlled device appointed in the command; the controlling device builds a Bluetooth Serial Port Profile connection with the controlled device after the appointed controlled device is found; the controlling device transmits the short message control command to the controlled device through the connection; the controlled device controls an output or input device after receiving the command; the controlled device transmits an execution result back to the controlling device; the controlling device reports the execution result back to the cellular phone by a short message; the controlling device disconnects the connection with the controlled device and waits for a next control command after the report is completed. Thereby, the control range can be expanded to the all places in the world that the cellular phone is applicable. And, the controlled device can built a temporary network with the controlling device, the structure will not be changed even if the number of the controlled devices is increased or decreased.

Far end remote control method and system by short message and bluetooth function operation

A fast connection establishment method for a bluetooth device is used to establish a connection between two bluetooth devices in order to provide a wireless transmission function. A bluetooth module, bluetooth address memory, CPU and connection interface for outside device are installed in each bluetooth device. The method first connects the three signal contacts of a bluetooth device to the three signal contacts of another bluetooth device to interchange the bluetooth addresses with each other. Then, the bluetooth address memory of the bluetooth device is used to store the bluetooth address of the opposite bluetooth device. After this, the bluetooth address is sent out after the power source of the bluetooth device is on. Finally, a bluetooth connection procedure is started if the bluetooth address of the opposite device is received by it in a specific time. Thereby, a wireless transmission can be established between two bluetooth devices.

Fast connection establishment method for bluetooth device

A method for warning abnormal connection between two bluetooth devices allows a user to adjust a distance between two connected bluetooth devices and to take an average obtained from several quality values read at that distance as a comparison value. Thereafter, a CPU of any one of the devices gets link quality value periodically by a host controller interface (HCI) command. The CPU will send out a warning message to mention the user of the bluetooth device when the quality value is lower than the comparison value, i.e. the connection is abnormal. And then, the user can handle it immediately, for example, pulls the two devices closer to lower the probability of the connection termination. The invention can reach the abnormal connection warning requirements for different users, and allows different users to have abnormal connection warning establishment for different distances.

Method for warning abnormal connection between two bluetooth devices

A method of making electrically conductive bumps of improved height on a semiconductor device. The method includes steps of depositing an under bump metallurgy over a semiconductor device onto a contact pad; depositing and patterning a photoresist layer to provide an opening over the under bump metallurgy; depositing a first electrically conductive material into the opening in the photoresist layer; depositing a second electrically conductive material over the first electrically conductive material; removing the photoresist layer and the excess under bump metallurgy; applying a flux agent to the top surface of the second electrically conductive material; hard baking the semiconductor device to remove any oxide; dipping a portion of the semiconductor device in an electroless plating solution; removing the semiconductor device from the electroless plating solution; and reflowing the electrically conductive materials to provide a bump of improved height on the semiconductor device.

Method of making tall flip chip bumps

Within a method for forming a microelectronic fabrication there is first provided a substrate. There is then formed over the substrate a patterned conductor layer having a topographic variation at a periphery of the patterned conductor layer. There is then formed over the substrate and passivating the topographic variation at the periphery of the patterned conductor layer a planarizing passivation layer formed of a thermally reflowable material. There is then formed upon the planarizing passivation layer a dimensionally stabilizing layer. Finally, there is then thermally annealed the microelectronic fabrication to form from the planarizing passivation layer a thermally annealed planarizing passivation layer. By employing formed upon the planarizing passivation layer the dimensionally stabilizing layer, there is attenuated within the thermally annealed planarizing passivation layer replication of the topographic variation at the periphery of the patterned conductor layer.

Patterned conductor layer pasivation method with dimensionally stabilized planarization

A method for removing a multiplicity of solder bodies connected to a semiconductor wafer through a copper wetting layer from the semiconductor wafer is disclosed. In the method, a semiconductor wafer that has on a top surface a multiplicity of solder bodies electrically connected to a multiplicity of bond pads through a multiplicity of copper wetting layers is first provided. When the multiplicity of solder bodies is found out of specification or must be removed for any other quality reasons, the semiconductor wafer is exposed to an etchant that has an etch rate toward the copper wetting layer at least 5 times the etch rate toward a metal that forms the multiplicity of bond pads. The semiconductor wafer may be removed from the etchant when the multiplicity of copper wetting layers is substantially dissolved such that the multiplicity of solder bodies is separated from the multiplicity of bond pads. The multiplicity of solder bodies may be either solder bumps or solder balls. The etchant may be a solution that contains Ce (NH,),(NO,),in a concentration range between about 3 wt. % and about 30 wt. % in water. Ultrasonic vibration may further be used to facilitate the dissolution of the copper wetting layers in the etchant.

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Hsinchu, Taiwan

James Chen