Intel Corporation

James C Meyer

Ebrahim Andideh

Dilan Seneviratne

Daniel N Sobieski

Deepak Arora

Embodiments of the present disclosure are directed towards techniques and configurations for formation of a dielectric with a smooth surface. In one embodiment, a method includes providing a dielectric with first and second surfaces, a conductive feature formed on the first surface, and a laminate applied to the second surface, curing the second surface while the laminate remains applied, and removing the laminate. Other embodiments may be described and/or claimed.

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Tualatin, OR, United States of America

James C Meyer