Motorola Corporation

James A Grootegoed

James F Vanell

Laura John

A wafer carrier ( ) for a CMP tool is adjustable to provide center fast to edge fast material removal from a semiconductor wafer. The wafer carrier ( ) holds the semiconductor wafer without vacuum. The semiconductor wafer is held by a carrier ring ( ). An elastically flexed wafer support structure ( ) is a support surface for the semiconductor wafer. Elastically flexed wafer support structure ( ) can be bowed outward or bowed inward in an infinite number of different contours. The semiconductor wafer conforms to the contour of the elastically flexed wafer support structure ( ) when a down force is applied to the wafer carrier ( ) during a polishing process. Changing the contour is used to produce different material removal rates across the radius of the semiconductor wafer to increase wafer planarity in a polishing process.

Wafer carrier and method of material removal from a semiconductor wafer

A dilution tool ( ) and a method to prepare a solution by mixing of two fluids in a filter ( ) to form a desired solution. Sealless pumps ( ) are driven by a common motor ( ) to pump the fluids at a constant ratio of their respective flow rates while the flow rate of the solution varies. The conductivity or resistivity of the solution is measured with a measurement device ( ) to determine the concentration.

Point of use dilution tool and method

A dilution tool (100) and a method prepare a solution of two fluids for removing residue from a semiconductor wafer. The fluids are combined in a filter (130) to form the desired solution. Sealless pumps (141, 142) are driven by a common motor (143) to pump the fluids at a constant ratio of their respective flow rates while the flow rate of the solution varies. The conductivity of the solution is measured with a conductivity meter (166) to determine the concentration.

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Chandler, AZ, United States of America

James A Grootegoed