Kla Tencor Corporation

Jagjit Sandhu

Hidong Kwak

Torsten Rudolf Kaack

Ning-Yi Neil Wang

Ward RDell Dixon

Torsten Kaack

A local purging tool for purging a portion of a surface of a wafer with purging gas is disclosed. The purging tool includes a purging chamber configured to contain purging gas within a cavity of the purging chamber, a permeable portion of a surface of the purging chamber configured to diffuse purging gas from the cavity of the chamber to a portion of a surface of a wafer, and an aperture configured to transmit illumination received from an illumination source to a measurement location of the portion of the surface of the wafer and further configured to transmit illumination reflected from the measurement location to a detector.

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Fremont, CA, United States of America

Jagjit Sandhu