Samsung Electronics Co., Ltd.

Jae-Sun Cho

Chang-Hoon Lee

Byung-Am Lee

Byung-Seol Ahn

Sung-man Lee

Joo-Woo Kim

Young-Kyu Lim

Sung-Man Lee

Jung-Lan Lee

A method and apparatus of classifying repetitive defects on a substrate is provided. Defects of dies on the substrate are sequentially compared with a predetermined reference die. Sets of coordinates are marked on the reference die which are corresponding to the position of the defects on the dies on the substrate. Then, repetitive defects are classified which are repeatedly marked in a specified region on the reference die.

Method and apparatus for classifying repetitive defects on a substrate

A wafer pattern inspecting apparatus and method are disclosed. The apparatus comprises an image sensor to acquire image data from a reference die and a sample die, an external memory to store the image data, an encoder to compress the data, a decoder to decompress the data, an internal memory device to store the compressed image data of the reference die, an arithmetic module to process the image data for the reference dies to extract a reference image data, a reference storage memory to store compressed reference image data, and a comparison module to compare the sample die image data with the reference image data to an extract defect data for the sample die.

Apparatus and method for inspecting patterns on wafers

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Gyeonggi-do, South Korea

Jae-Sun Cho