Hermes Microvision Inc.

Asml Netherlands B.v.

Hermes Microvision, Inc. (taiwan)

Jack Jau

Wei Fang

Zhongwei Chen

Hong Xiao

Yan Zhao

Zhao-Li Zhang

Weiming Ren

Joe Wang

Xuedong Liu

Zhong-wei Chen

Yi-Xiang Wang

Fei Wang

Kevin Liu

Shuai Li

Van-Duc Nguyen

Yi Xiang Wang

Zhaohui Guo

Chang Chun Yeh

Chang-Chun Yeh

Yixiang Wang

Feng Cao

Chiyan Kuan

Chung-Shih Pan

Zhaoli Zhang

Kuo-Shih Liu

Futang Peng

Chuan Li

Xiaoli Guo

Edward Tseng

Frederick Y Zhao

Chad Liao

Alina Wang

Chang-Chun (Roland) Yeh

Zhong Wei Chen

An inspection method includes the following steps: identifying a plurality of patterns within an image; and comparing the plurality of patterns with each other for measurement values thereof. The above-mentioned inspection method uses the pattern within the image as a basis for comparison; therefore, measurement values of the plurality of pixels constructing the pattern can be processed with statistical methods and then compared, and the false rate caused by variation of a few pixels is decreased significantly. An inspection system implementing the above-mentioned method is also disclosed.

Inspection method and system

Disclosed herein is a method comprising: generating a plurality of probe spots on a sample by a plurality of beams of charged particles; while scanning the plurality of probe spots across a region on the sample, recording from the plurality of probe spots a plurality of sets of signals respectively representing interactions of the plurality of beams of charged particles and the sample; generating a plurality of images of the region respectively from the plurality of sets of signals; and generating a composite image of the region from the plurality of images.

Methods of inspecting samples with multiple beams of charged particles

A multi-beam apparatus for observing a sample with oblique illumination is proposed. In the apparatus, a new source-conversion unit changes a single electron source into a slant virtual multi-source array, a primary projection imaging system projects the array to form plural probe spots on the sample with oblique illumination, and a condenser lens adjusts the currents of the plural probe spots. In the source-conversion unit, the image-forming means not only forms the slant virtual multi-source array, but also compensates the off-axis aberrations of the plurality of probe spots. The apparatus can provide dark-field images and/or bright-field images of the sample.

Apparatus of plural charged-particle beams

A calibration method for calibrating the position error in the point of interest induced from the stage of the defect inspection tool is achieved by controlling the deflectors directly. The position error in the point of interest is obtained from the design layout database.

Local alignment point calibration method in die inspection

The present invention provides apparatuses to inspect small particles on the surface of a sample such as wafer and mask. The apparatuses provide both high detection efficiency and high throughput by forming Dark-field BSE images. The apparatuses can additionally inspect physical and electrical defects on the sample surface by form SE images and Bright-field BSE images simultaneously. The apparatuses can be designed to do single-beam or even multiple single-beam inspection for achieving a high throughput.

Charged particle beam apparatus

A method and system for inspecting defects saves scanned raw data as an original image so as to save time for repeated scanning and achieve faster defect inspection and lower false rate by reviewing suspicious defects and other regions of interest in the original image by using the same or different image-processing algorithm with the same or different parameters.

Method and system for fast inspecting defects

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Los Altos Hills, CA, United States of America

Jack Jau