Sandisk Corporation

Sandisk Technologies Inc.

Jack Chang Chien

Hem P Takiar

Chin-Tien Chiu

Cheemen Yu

Chih-Chin Liao

Ning Ye

Chien-Ko Liao

Ning Liu

Cheeman Yu

Che-Jung Chang

Li Ping Wang

Shrikar Bhagath

Ken Jian Ming Wang

Han-Shiao Chen

Weili Wang

King Hoo Ong

XingZhi Liang

Shicai Ma

A semiconductor die substrate panel is disclosed including a minimum kerf width between adjoining semiconductor package outlines on the panel, while ensuring electrical isolation of plated electrical terminals. By reducing the width of a boundary between adjoining package outlines, additional space is gained on a substrate panel for semiconductor packages.

Two-sided substrate lead connection for minimizing kerf width on a semiconductor substrate panel

A system is disclosed for ejecting a semiconductor die from a tape to which the die is affixed during the wafer dicing process. In embodiments, the system includes an ejector tool including a support table, ejector pins and a pick-up arm. The support table is connected to a vacuum source for creating a negative pressure at an interface between the tape and support table. The support table further includes an aperture with one or more chamfered sidewalls. The vacuum source is connected to the aperture so that, upon placement of the tape on the support table with a die centered over the aperture, the vacuum source pulls a portion of the tape around the edges of the semiconductor die away from the die and into the space created by the chamfered edges.

System for separating a diced semiconductor die from a die attach tape

A flash memory card and methods of manufacturing same are disclosed. The card includes a semiconductor package fabricated to receive a single-sided or double-sided lid. A surface of the semiconductor package may be formed with holes, trenches and/or pockmarks. After the holes, trenches and/or pockmarks are formed, a lid may be attached to the package surface in an injection molding process. During the injection molding process, the molten plastic flows into the holes, trenches and/or pockmarks to interconnect with the surface of the semiconductor package. Thus, when the molten plastic hardens, the holes, trenches and/or pockmarks ensure that the lid remains firmly attached to semiconductor package.

Methods of promoting adhesion between transfer molded IC packages and injection molded plastics for creating over-molded memory cards

A semiconductor device having a redistribution layer, and methods of forming same, are disclosed. After fabrication of semiconductor die on a wafer, a tape assembly is applied onto a surface of the wafer, in contact with the surfaces of each semiconductor die on the wafer. The tape assembly includes a backgrind tape as a base layer, and a film assembly adhered to the backgrind tape. The film assembly in turn includes an adhesive film on which is deposited a thin layer of conductive material. The redistribution layer pattern is traced into the tape assembly, using for example a laser. Thereafter, the unheated portions of the tape assembly may be removed, leaving the heated redistribution layer pattern on each semiconductor die.

Semiconductor die having a redistribution layer

A semiconductor package having a low profile is disclosed. In embodiments, a surface mounted component may be mounted directly to the core of the semiconductor package substrate, so that there is no conductive layer, plating layers or solder paste between the component and the substrate core. The surface mounted component may be any type of component which may be surface mounted on a substrate according to an SMT process, including for example passive components and various packaged semiconductors.

Padless substrate for surface mounted components

A portable memory card and methods of manufacturing same are disclosed. The portable memory includes a substrate having a plurality of holes formed therein. During the encapsulation process, mold compound flows over the top surface of the substrate, through the holes, and down into a recessed section formed in the bottom mold cap plate to form a projection of mold compound on the bottom surface of the substrate.

Semiconductor package having through holes for molding back side of package

Method of fabricating a semiconductor package having through holes for molding back side of package

Method of fabricating a semiconductor die having a redistribution layer

Semiconductor die having a distribution layer

Method of minimizing kerf width on a semiconductor substrate panel

Growing community of inventors

Kaoshiung, Taiwan

Jack Chang Chien