Samsung Sdi Co., Inc.

Cheil Industries Inc.

Ja Young Hwang

Ji Yeon Kim

Kyoung Soo Park

Kyoung Ku Kang

Jae Sun Han

Kwang Jin Jung

Young Ju Shin

Young Woo Park

Byeong Geun Son

Kyoung Hun Shin

Soon Young Kwon

Ji Eun Kim

Ha Na Kim

Dong Seon Uh

Young Hoon Kim

Tae Hyun Lee

Hyoun Young Kim

Gun Young Heo

Jeong Ku Kang

Hyun Joo Seo

Woo Jung Shin

Gyu Ho Lee

Youn Jo Ko

An anisotropic conductive film composition, an anisotropic conductive film prepared using the same, and a connection structure using the same, the anisotropic conductive film including a binder resin; a curable alicyclic epoxy compound; a curable oxetane compound; a quaternary ammonium catalyst; and conductive particles, wherein the anisotropic conductive film has a heat quantity variation rate of about 15% or less, as measured by differential scanning calorimetry (DSC) and calculated by Equation 1:Heat quantity variation rate (%)=[()/]&#xd7;100&#x2003;&#x2003;Equation 1

Composition for anisotropic conductive film, anisotropic conductive film, and connection structure using the same

A semiconductor device connected by an anisotropic conductive film, the anisotropic conductive film having a differential scanning calorimeter onset temperature of 60&#xb0; C. to 85&#xb0; C., and a elastic modulus change of 30% or less, as calculated by Equation 1, below,Elastic modulus change(%)={()/}&#xd7;100&#x2003;&#x2003;[Equation 1] wherein Mis an initial elastic modulus in kgf/cmof the anisotropic conductive film as measured at 25&#xb0; C., and Mis a elastic modulus in kgf/cmof the anisotropic conductive film as measured at 25&#xb0; C. after the film is left at 25&#xb0; C. for 170 hours.

Semiconductor device connected by anisotropic conductive film

A semiconductor device connected by an anisotropic conductive film. The anisotropic conductive film includes a composition for an anisotropic conductive film including a first epoxy resin having an exothermic peak temperature of about 80&#xb0; C. to about 110&#xb0; C. and a second epoxy resin having an exothermic peak temperature of 120&#xb0; C. to 200&#xb0; C., as measured by differential scanning calorimetry (DSC). The first epoxy resin and the second epoxy resin are present in combined amount of about 30 wt % to about 50 wt % based on a total weight of the composition in terms of solid content. The second epoxy resin is present in an amount of about 60 to about 90 parts by weight based on 100 parts by weight of the first and second epoxy resins.

An anisotropic conductive film includes a conductive adhesive layer including conductive particles and insulating particles, and an insulating adhesive layer not including conductive particles. In the anisotropic conductive film, the conductive particles and the insulating particles of the conductive adhesive layer have a total particle density of 7.0&#xd7;10/dto 10.0&#xd7;10/d(particles) per square millimeter (mm) (where d is a diameter of the conductive particles in &#x3bc;m).

Anisotropic conductive film including conductive adhesive layer and semiconductor device connected by the same

Provided is a semiconductor device, including an anisotropic conductive film connecting the semiconductor device, the anisotropic conductive film having a maximum stress of 0.4 kgf/mmor more; and a stress-strain curve having a slope (A) of greater than 0 and less than or equal to 0.2 kgf/(mm&#xb7;%) as represented by the following equation 1:slope()=(&#xbd;)/&#x2003;&#x2003;(1),

A semiconductor device connected by an anisotropic conductive film including a first insulation layer, a conductive layer, and a second insulation layer one above another, wherein the conductive layer has an expansion length of 20% or less in a width direction thereof, and the second insulation layer has an expansion length of 50% or more in a width direction thereof, the expansion length is calculated according to Equation 1, below, after glass substrates are placed on upper and lower sides of the anisotropic conductive film respectively, followed by compression at 110&#xb0; C. to 200&#xb0; C. for 3 to 7 seconds under a load of 1 MPa to 7 MPa per unit area of a sample,Increased ratio of expansion length (%)=[(length of corresponding layer in width direction after compression&#x2212;length of corresponding layer in width direction before compression)/length of corresponding layer in width direction before compression]&#xd7;100.&#x2003;&#x2003;[Equation 1]

An anisotropic conductive film composition includes a polymer resin, a first epoxy resin including at least one of a bisphenol epoxy resin, a novolac epoxy resin, a glycidyl epoxy resin, an aliphatic epoxy resin, and an alicyclic epoxy resin, a second epoxy resin including an acetal epoxy resin, an epoxy resin curing agent, and conductive particles.

Anisotropic conductive film composition, anisotropic conductive film including the same, and associated methods

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Suwon-si, South Korea

Ja Young Hwang