Other

Mitsubishi Denki Kabushiki Kaisha

Izumi Oya

Masaki Kuzumoto

Makoto Miyamoto

Seiji Noda

Tatsuo Kataoka

Masashi Ohmori

Hideo Horibe

Tetsuji Oishi

A photoresist film removing apparatus includes a reacting chamber, an ozonizer producing a gas supplied to the reacting chamber, and an exhaust system that exhausts the gas from the reacting chamber. A source of a photoresist film-remover is located opposite a stage carrying a substrate covered with photoresist. Photoresist film-remover and the gas are supplied to the substrate through apertures. An electric field may be generated between the source of the photoresist film-remover and the substrate. Alternatively, a centrally located feed tube supplies only one of the gas and the photoresist film-remover through a single aperture and a reservoir discharges the other through apertures. The reservoir surrounds and is sealed to the feed tube. The apparatus may include a container holding a liquid photoresist film-remover and a mixture of the gas and remover is supplied from outside the reacting chamber to the substrate.

Apparatus for removing photoresist film

A substrate treatment apparatus includes a substrate heating device for maintaining a substrate at a temperature higher than room temperature, a wetting device for producing a wet ozone-containing gas by wetting an ozone-containing gas with a treatment solution, and a supply device for supplying the wet ozone-containing gas from the wetting device to a work object on a surface of the substrate. The supply device includes a gas disperser including apertures aligned in rows in a width direction of the work object. The apertures in adjacent rows are not aligned with each other in a direction perpendicular to the rows. At least one of the gas disperser and the substrate is movable in a direction perpendicular to the rows. A gas conduit connects the wetting device to the supply device. A wet ozone-containing gas heating device heats the wet ozone-containing gas to a temperature at least equal to the temperature of the substrate.

Substrate treatment apparatus

An apparatus for removing a photoresist film includes a substrate cassette for fixing a substrate having a surface covered with a photoresist film, an ozone feed tube for supplying ozone, a liquid feed tube for supplying a liquid photoresist film removing solution, and a processing tank for recovering and processing at least one of ozone and the liquid photoresist film removing solution, wherein the liquid photoresist film removing solution is supplied through the liquid feed tube as a liquid or mist, at least one of ozone and the photoresist film removing solution being continuously supplied.

A substrate treatment assembly for treating a work object on a surface of a substrate by supplying to the work object a wet ozone-containing gas wetted with a treatment solution includes a substrate heating device for maintaining a substrate at a temperature higher than room temperature, a wetting device for producing a wet ozone-containing gas by wetting an ozone-containing gas with a treatment solution, a supply device for supplying the wet ozone-containing gas to a work object on a surface of the substrate, a gas conduit connecting the wetting device to the supply device, and a heating device for heating the wet ozone-containing gas to a temperature approximately equal to or greater than the temperature of the substrate.

Substrate treatment method

A method of removing a photoresist film with high efficiency of removal and friendliness with the environment while reducing material consumption and cost for a ventilation facility, and an apparatus used for the method. The method of removing a photoresist film in a sealed system, includes supplying a photoresist film-removal mixture containing an ozonized gas and a photoresist film-remover to a photoresist film on a surface of a substrate through a photoresist film-remover supplier opposed to the photoresist film.

Method for removing photoresist film and apparatus used therefor

A method of removing photoresist film with high efficiency of removal and friendliness with the environment while reducing the material consumption and the cost for the ventilation facility, and an apparatus used for the method are provided. Particularly the present invention provides a method of removing a photoresist film provided on a surface of a substrate, comprising steps of in a sealed system, disposing the substrate surface having the photoresist film to contact with a photoresist film removing solution, making ozone exist in gas phase and/or solution phase in the vicinity of the liquid surface of the photoresist film removing solution, and changing a relative position between the surface of the substrate and the liquid surface of the solution to decompose or remove the photoresist film from the substarate, characterized in that the relative position is changed continuously or intermittently within a range between a position where a bottom edge of the substrate is present above the liquid surface of the solution, and another position where a top edge of the substrate is present below the liquid surface of the solution. The present invention also provides an apparatus used for the method.

Growing community of inventors

Tokyo, Japan

Izumi Oya