Sensys Instruments Corporation

Ivelin A Anguelov

Adam Eales Norton

Fred E Stanke

Edric Tong

Michael Weber-Grabau

Badru D Hyatt

A wafer measurement apparatus ( ) and method for measuring a film thickness property of a wafer ( ) that does not require a water bath or complicated wafer handling apparatus. The apparatus includes a chuck ( ) having an upper surface ( ) for supporting the wafer, and a perimeter ( ). Also included is a metrology module ( ) for measuring one or more film thickness properties. The metrology module is arranged adjacent the chuck upper surface and has a measurement window ( ) with a lower surface ( ) arranged substantially parallel to the chuck upper surface, thereby defining an open volume ( ). The apparatus includes a water supply system in fluid communication with the open volume via nozzles ( ) for flowing water through and back-filling the volume in a manner that does not produce bubbles within the volume. A catchment ( ) surrounding the chuck may be used to catch water flowing out of the volume. Methods of performing measurements of one or more wafer film properties are also described.

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Sunnyvale, CA, United States of America

Ivelin A Anguelov