Other

Shin-etsu Quartz Products Ltd.

Itsuo Araki

Kyoichi Inaki

A member for a plasma etching device, comprising a coating film of yttrium oxide or YAG having a coating film thickness of 10 &#x3bc;m or more, a coating film thickness variance of 15% or less, preferably a surface roughness (Ra) of 1 &#x3bc;m or less, formed on a surface of a member, comprising quartz glass which contains 1 to 10% by weight of yttrium oxide or YAG. The member for a plasma etching device has high plasma resistance, is not subjected to an abnormal etching on the basis of a partial change of electric properties and, accordingly, can be used for a long period of time. Even when the member is large enough to handle 12-inch Si wafers, the above-described advantageous properties are maintained and the member can be used for a long period of time.

Member for plasma etching device and method for manufacture thereof

In a vertical type wafer supporting jig, a ring-like support plate is fixed to support pillars by a simple structure without conventional welding and without risk of the ring-like support plate falling off. The vertical type wafer supporting jig is configured for mounting many wafers onto many support plates stacked in a vertical direction and fixed to support pillars with a predetermined wafer mounting interval between the support plates. Support groove portions into which the support plates are inserted and supported are formed in the support pillars with a predetermined interval in the vertical direction between them. A fixing rod is provided adjoining at least one of the support pillars. A peripheral part of the support plate has at least one receiving groove corresponding to the fixing rod, and the support plate is fixed to and supported by the support pillars by inserting the support plate into the support groove part, in which it is supported, and fitting the fixing rod into the receiving groove of the support plate.

Vertical type wafer supporting jig

An object of the present invention is to provide a fluororesin-coated quartz glass jig free from peeling off of fluororesin coating on using hydrofluoric acid or from generating particles due to the etching of quartz glass, while yet preventing the generation of chipping by relaxing the impact imposed on the quartz glass by silicon wafers. It also is an object of the present invention to provide a production method of the fluororesin-coated quartz glass jig. The object above is achieved by a fluororesin-coated quartz glass jig the surface thereof is wholly covered with a pinhole-free fluororesin coating, and by a method for producing the same.

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Kikuchi, Japan

Itsuo Araki