Tokyo Electron Limited

Isao Kono

Yutaka Akaike

Haruhiko Yoshioka

Satoshi Sano

Chiaki Mochizuki

Isamu Inomata

A probing method for inspecting electrical characteristics of an object by probes, including mounting the object on a main chuck having an X-axis, a Y-axis and a Z-axis which are driven by X-axis, Y-axis, and Z-axis driving mechanisms, moving the main chuck in X-, Y-, and Z-directions by driving the X-axis, Y-axis and Z-axis by the X-axis, Y-axis, and Z-axis driving mechanisms such that each of electrode pads of the object mounted on the main chuck is brought into contact with each of probes of a probe card above the main chuck, and overdriving the main chuck by simultaneously and collectively controlling the X-axis, Y-axis, and Z-axis driving mechanisms such that the X-axis, Y-axis, and Z-axis driving mechanisms simultaneously overdrive the main chuck to keep a tip portion of each of the probes within a surface area of the electrode pad of the object.

Probing method and probing system

An aligner (,) according to the present invention is an apparatus in which a wafer chuck (,), wafer (W), and contactor (,) are aligned with one another, and these three elements are then united to form a shell (S), and the shell (S) is reduced to the three elements. A identification code (,) is attached to the contactor (,). A reader (,) reads the identification code (,). The identification code (,) read by means of the reader (,) is associated with the position of the main chuck (,) reached when first and second valve mechanisms (,) are connected, and is loaded into a control device (,). When the shell (S) is disassembled, the position of the main chuck (,) is retrieved in the control device (,) in accordance with the identification code (,) read by means of the reader (,). The main chuck (,) is moved according to the result of the retrieval.

Aligner

An aligner according to the present invention is constituted by integrating a wafer chuck, a wafer and a contactor, which are aligned with one another, into one piece by vacuum adsorptivity. A vacuum exhaust apparatus for generating the vacuum adsorptivity, includes first and second valve mechanisms, a valve operation mechanism for opening/closing these valve mechanisms, first and second solenoid valves connected to the valve operation mechanism through a vacuum exhaust line, and a vacuum leak detecting pressure gauge interposed between the first solenoid valve and the valve operation mechanism.

Aligner and method for inspecting semiconductor wafer using shell

A probe apparatus comprising an apparatus body fitted with a probing card having a probe connected electrically with an electrode of an object of inspection, a test head operatively mounted on the apparatus body and electrically continuous with the probe of the probing card, rotating mechanism for rotating the test head, and vertical moving mechanism for vertically raising or lowering the test head.

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Higashiyamanashi-gun, Japan

Isao Kono