Tokyo Electron Limited

Isamu Miyamoto

Yoshifumi Amano

Satoshi Morita

Ryoji Ikebe

Keigo Satake

Kenji Nakamizo

Takashi Nakazawa

Nobuhiro Ogata

Mikio Nakashima

Akinori Tanaka

A measurement processing process Sof measuring a cut width of a film based on an image obtained by imaging, with an imaging unit, a peripheral portion of a substrate which is processed based on a substrate processing recipe; a creation process Sof creating a management list in which a set value of the cut width of the film, a measurement value of the cut width of the film measured through the measurement processing process and time information at which the measurement result is obtained are correlated; an analysis process S(S) of analyzing a state of the processed substrate based on the created management list; and a notification process S(S, S) of making a preset notification to a user based on an analysis result obtained through the analysis process are provided.

Substrate processing system

A substrate processing apparatus includes: a mixer configured to mix sulfuric acid as a first component and a second component different from the first component to prepare an etchant; a nozzle configured to eject the etchant to a substrate; a first component supplier including a first flow path that supplies the first component to the mixer, a first instantaneous flowmeter and a first flow rate controller provided in the first flow path; a second component supplier including a second flow path different from the first flow path and configured to supply the second component to the mixer, a second instantaneous flowmeter and a second flow rate controller provided in the second flow path; and a controller configured to control the first and second flow rate controllers using average flow rates of the first component and the second component during the ejection of the etchant to the substrate.

Substrate processing method

Substrate processing method and substrate processing apparatus

A substrate liquid processing apparatus includes: at least one liquid pipe through which a processing liquid flows; a discharge nozzle configured to discharge the processing liquid supplied via the at least one liquid pipe; a valve mechanism configured to regulate a flow of the processing liquid in the at least one liquid pipe; and a liquid detection sensor configured to detect presence or absence of the processing liquid in the at least one liquid pipe, wherein in a state in which the valve mechanism is operating so that the processing liquid in the at least one liquid pipe is located at an upstream of a first pipe measurement site of the at least one liquid pipe, the liquid detection sensor detects the presence or absence of the processing liquid at the first pipe measurement site located at a first measurement point.

Substrate liquid processing apparatus and substrate liquid processing method

Whether a film on a peripheral portion of a substrate is appropriately removed is rapidly determined without depending on a kind of the film on the peripheral portion to be removed. An acquisition process Sof acquiring information upon the kind of the film of the substrate; a selection process Sof selecting a measurement setting corresponding to the acquired kind of the film from a table for measurement settings previously stored in a storage unit; a control process Sof controlling an imaging unitto image the peripheral portion of the substrate by using the measurement setting selected in the selection process are provided.

Substrate processing apparatus, control method of substrate processing apparatus and substrate processing system

Imaging can be performed well even when an imaging device is disposed at a position facing a peripheral portion of a substrate. A substrate processing apparatuswhich performs a processing of removing a film on a peripheral portion of a substrate W includes a rotating/holding unitconfigured to hold and rotate the substrate; a first processing liquid supply unitA configured to supply a first processing liquid for removing the film onto the peripheral portion of the substrate while the substrate is being rotated in a first rotational direction Rby the rotating/holding unit; and an imaging unitprovided at a position in front of an arrival regionof the first processing liquid on the substrate with respect to the first rotational direction R, and configured to image the peripheral portion of the substrate.

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Koshi, Japan

Isamu Miyamoto