Leica Microsystems Lithography Gmbh

Giesecke & Devrient Gmbh

Vistec Electron Beam Gmbh

Ines Stolberg

Rainer Plontke

Andreas Schubert

Michael Blume

Wittich Kaule

Marius Dichtl

Rainer Kaebsch

Matthias Zierbock

The invention relates to a device and a method for producing resist profiled elements. According to the invention, an electron beam lithography system is used to produce an electron beam, the axis of the beam being essentially perpendicular to a resist layer in which the resist profiled element is to be produced. The electron beam can be adjusted in terms of the electron surface dose in such a way that a non-orthogonal resist profiled element can be produced as a result of the irradiation by the electron beam.

Device and method for producing resist profiled elements

In a method for forming, with the aid of an electron beam ( ), a polyline on a substrate ( ) coated with a radiation-sensitive resist, the electron beam ( ) is directed onto a surface of the substrate ( ) in the direction of a Z coordinate, and the substrate ( ) is displaced relative to the electron beam ( ) in an X-Y plane in individual steps. After each individual step of the displacement, the electron beam ( ) acts with a predefined energy input on the substrate ( ) during a halt in the displacement motion. The energy input for each individual step is determined as a function of the shape of the polyline ascertained from several preceding individual steps. Also described is a corresponding apparatus with which, using electron beam lithography, it is possible to form polylines with a very uniform line width. The method and apparatus are particularly suitable for writing curved polylines.

Method and apparatus for forming a curved polyline on a radiation-sensitive resist

Method for directing an electron beam onto a target position on a substrate surface

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Jena, Germany

Ines Stolberg