Average Co-Inventor Count = 9.51
ph-index = 9
The patent ph-index is calculated by counting the number of publications for which an author has been cited by other authors at least that same number of times.
Company Filing History:
1. Pdf Solutions, Incorporated (92 from 203 patents)
2. Intermolecular, Inc. (16 from 726 patents)
3. Kla-tencor Technologies Corporation (3 from 641 patents)
4. Tivra Corporation (3 from 3 patents)
5. Elpida Memory, Inc. (2 from 1,458 patents)
6. Kla Tencor Corporation (1 from 1,787 patents)
115 patents:
1. 12431333 - Systems, devices, and methods for aligning a particle beam and performing a non-contact electrical measurement on a cell and/or non-contact electrical measurement cell vehicle using a registration cell
2. 12429520 - Systems, devices, and methods for performing a non-contact electrical measurement on a cell, non-contact electrical measurement cell vehicle, chip, wafer, die, or logic block
3. 12038476 - Systems, devices, and methods for performing a non-contact electrical measurement on a cell, non-contact electrical measurement cell vehicle, chip, wafer, die, or logic block
4. 12020897 - Systems, devices, and methods for aligning a particle beam and performing a non-contact electrical measurement on a cell and/or non-contact electrical measurement cell vehicle using a registration cell
5. 11668746 - Systems, devices, and methods for performing a non-contact electrical measurement on a cell, non-contact electrical measurement cell vehicle, chip, wafer, die, or logic block
6. 11605526 - Systems, devices, and methods for aligning a particle beam and performing a non-contact electrical measurement on a cell and/or non-contact electrical measurement cell vehicle using a registration cell
7. 11340293 - Methods for performing a non-contact electrical measurement on a cell, chip, wafer, die, or logic block
8. 11328899 - Methods for aligning a particle beam and performing a non-contact electrical measurement on a cell using a registration cell
9. 11107804 - IC with test structures and e-beam pads embedded within a contiguous standard cell area
10. 11081476 - IC with test structures and e-beam pads embedded within a contiguous standard cell area
11. 11081477 - IC with test structures and e-beam pads embedded within a contiguous standard cell area
12. 11075194 - IC with test structures and E-beam pads embedded within a contiguous standard cell area
13. 11018126 - IC with test structures and e-beam pads embedded within a contiguous standard cell area
14. 10978438 - IC with test structures and E-beam pads embedded within a contiguous standard cell area
15. 10854522 - Method for processing a semiconductor wafer using non-contact electrical measurements indicative of at least one tip-to-side short or leakage, at least one corner short or leakage, and at least one via open or resistance, where such measurements are obtained from non-contact pads associated with respective tip-to-side short, corner short, and via open test areas