Kulicke and Soffa Industries, Inc.

Sv Probe Pte. Ltd.

Ilan Hanoon

Edward T Laurent

Edward Lambert Malantonio

Dan Mironescu

Lich Thanh Tran

A probe configured for use in the testing of integrated circuits includes a first end portion terminating in a foot (), the foot defining a substantially flat surface configured to be connected to a substrate (), a second end portion terminating in a tip (), the tip being configured to contact an integrated circuit during testing of the integrated circuit, and a curved body portion () extending between the first end portion and the second end portion.

Probes for a wafer test apparatus

A method and apparatus for producing a substrate having a plurality of substantially co-planar bonding pads is provided. The substrate is employed in a probe apparatus used in wafer testing of wafer-mounted semiconductor integrated circuits. The bonding pads are formed by applying a plurality of bumps of electrically conductive material to a mounting surface of the substrate using a dispensing mechanism. The bumps are subsequently deformed into a plurality of substantially co-planar bonding pads using a flattening tool. The bonding pads provide a planar surface to which probes may be mounted, improving the accuracy and precision of positioning of tips of the probes.

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Glenside, PA, United States of America

Ilan Hanoon