Growing community of inventors

Portland, OR, United States of America

Il-Seok Son

Average Co-Inventor Count = 4.68

ph-index = 3

The patent ph-index is calculated by counting the number of publications for which an author has been cited by other authors at least that same number of times.

Forward Citations = 20

Il-Seok SonPatrick R Morrow (11 patents)Il-Seok SonKimin Jun (11 patents)Il-Seok SonPaul B Fischer (6 patents)Il-Seok SonDonald W Nelson (3 patents)Il-Seok SonColin T Carver (3 patents)Il-Seok SonMauro J Kobrinsky (2 patents)Il-Seok SonM Clair Webb (2 patents)Il-Seok SonDon W Nelson (2 patents)Il-Seok SonRajashree Raji Baskaran (1 patent)Il-Seok SonIl-Seok Son (11 patents)Patrick R MorrowPatrick R Morrow (189 patents)Kimin JunKimin Jun (74 patents)Paul B FischerPaul B Fischer (110 patents)Donald W NelsonDonald W Nelson (28 patents)Colin T CarverColin T Carver (15 patents)Mauro J KobrinskyMauro J Kobrinsky (96 patents)M Clair WebbM Clair Webb (10 patents)Don W NelsonDon W Nelson (4 patents)Rajashree Raji BaskaranRajashree Raji Baskaran (39 patents)
..
Inventor’s number of patents
..
Strength of working relationships

Company Filing History:

1. Intel Corporation (11 from 54,814 patents)


11 patents:

1. 12100761 - Wrap-around source/drain method of making contacts for backside metals

2. 12100762 - Wrap-around source/drain method of making contacts for backside metals

3. 11594452 - Techniques for revealing a backside of an integrated circuit device, and associated configurations

4. 11264493 - Wrap-around source/drain method of making contacts for backside metals

5. 10896847 - Techniques for revealing a backside of an integrated circuit device, and associated configurations

6. 10797139 - Methods of forming backside self-aligned vias and structures formed thereby

7. 10490449 - Techniques for revealing a backside of an integrated circuit device, and associated configurations

8. 10367070 - Methods of forming backside self-aligned vias and structures formed thereby

9. 10236282 - Partial layer transfer system and method

10. 9721898 - Methods of forming under device interconnect structures

11. 9490201 - Methods of forming under device interconnect structures

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