Samsung Electronics Co., Ltd.

Kpx Chemical Co., Ltd.

Hyunseop Shin

Taeyoung Kim

Hoon Hee Han

Yunseok Choi

Moonyoung Kim

Jinhye Bae

Hyojin Yun

Seungwon Kim

Woojung Park

Mintae Lee

Moonchang Kim

Cheolmo Yang

A photoresist-removing composition includes a polar organic solvent, an alkyl ammonium hydroxide, an aliphatic amine not including a hydroxy group, and a monovalent alcohol. To manufacture a semiconductor device, a photoresist pattern may be formed on a substrate, and the photoresist-removing composition may then be applied to the photoresist pattern. To manufacture a semiconductor package, a photoresist pattern including a plurality of via holes may be formed on a substrate. A plurality of conductive posts including a metal may be formed inside the plurality of via holes, and the photoresist pattern may be removed by applying a photoresist-removing composition of the inventive concept to the photoresist pattern. A semiconductor chip may be adhered to the substrate between the respective conductive posts.

Compositions for removing photoresists and methods of manufacturing semiconductor devices and semiconductor packages using the compositions

Growing community of inventors

Yongin-si, South Korea

Hyunseop Shin