Mirae Corporation

Hyun Joo Hwang

Ji Hyun Hwang

Do Hyun Kim

Jang Sung Chun

Chan Ho Park

Young Geun Park

Ho Keun Song

Jae Bong Seo

Byeng Gi Lee

Seung Hwan Kim

A method for recognizing working position in a semiconductor test handler is disclosed. The method includes the steps of: (a) obtaining necessary information through image input unit while moving device transfer unit to upper portion of tray and in horizontal and vertical directions; (b) obtaining image information of identifiers attached to respective change kits through the image input unit while moving the device transfer unit to the respective change kits and moving the device transfer unit in one direction, and simultaneously obtaining origin of the change kit; (c) comparing kinds of semiconductor devices inputted into control unit of the handler with information of the identifiers which are obtained in the step of (b), and determining whether or not the kinds of the semiconductor devices accords with those of the change kits; and (d) calculating the working position of the device transfer unit using the image information obtained through the steps a) to c) in the image processor and the control unit.

Method for recognizing working position of a device transfer apparatus in semiconductor test handler

An apparatus for transferring semiconductor devices in a semiconductor device handler is provided which simplifies set up procedures when a species of device to be tested, and the associated change kit, is changed. A reference picker and three variable pickers are positioned within the framing structure of the handler, with the motion of the third variable picker synchronized relative to the motion of the first and second variable pickers. A plurality of sensors determine an initial position of the variable pickers, and then motion of the variable pickers is monitored by respective scanning heads and linear scales until a new setup position which corresponds to the new device species is attained. In this manner, the procedure and structure for varying position and pitch of the various pickers can be simplified, thus reducing processing time and cost.

Apparatus for transferring semiconductor device in handler

An index head assembly for a semiconductor device test handler is provided which allows for precise positioning of a device in a test socket, as well as accurate testing of the device once properly positioned in the test socket. The head portion of the index head assembly includes a holding part which absorbs and holds the device using a vacuum force, a heating part which generates heat to maintain the device at the appropriate temperature, and a compliance part which accurately aligns and positions the index head relative to the test socket so that the device may be properly connected to the test socket. The downward force used to connect the semiconductor device to the test socket is controlled by a force transducer, and the temperature of the semiconductor device is accurately controlled through direct heat transfer from an electric heater provided within the head portion of the index head assembly. A plurality of ball plungers and guide members, as well as the particular installation of various parts of the head portion relative to one another ensure proper alignment of the device within the test socket.

Index head in semicondcutor device test handler

A device for compensating for heat generation in a modular IC test handler is provided which includes at least one supporting member positioned adjacent to a press unit of the handler, and having a cooling fluid flow passage formed therein for flow of cooling fluid, and a plurality of cooling fluid spraying units for spraying the cooling fluid supplied through the cooling fluid flow passage toward faces of modular ICs in an oblique direction from a position between adjacent push bars of the press unit, thereby spraying cooling fluid directly onto ICs attached to a surface of modular ICs during testing and enhancing an efficiency of heat compensation.

Device for compensating for heat deviation in a modular IC test handler

Index head in semiconductor device test handler

An apparatus and method are provided for recognizing a working height of a device transfer system in a semiconductor device test handler which allows the working height of the device transfer system to be quickly measured and/or precisely reset. The device transfer system moves horizontally and vertically on a handler body of the semiconductor device test handler, and moves horizontally and vertically, and includes a plurality of pickers which pick up the semiconductor devices. An elevating block installed at one side of the device transfer system moves upward and downward, and a touch probe installed vertical relative to the elevating block moves upward and downward based on contact with a target object. A detector detects ascendance of the touch probe upon contact with the target object, and a working position is determined based on an initial position, a measured position, and a series of offset values.

Apparatus for recognizing working height of device transfer system in semiconductor device test handler and method thereof

An apparatus and method is provided for recognizing a working position of a device transfer system in a semiconductor device test handler. The working position of a transfer unit of the handler is adjusted based on tray and change kit positions to allow components to be quickly and precisely loaded and transferred when various kinds of semiconductor devices are tested in the handler. A laser sensor which detects a color change of an object is provided with the transfer unit, and scans corners of the tray and change kits to acquire position information related to the tray and change kits. The working position of the transfer unit is calculated using basic handler information contained in the control unit of the handler and the acquired information.

Apparatus for recognizing working position of device transfer system in semiconductor device test handler and method thereof

A heating and cooling apparatus is provided which employs a series of thermally conductive plates thermally coupled to heating and cooling devices to heat or cool a mounting plate loaded with semiconductor devices. The mounting plate is assembled on a heating plate, which is then assembled on a cooling plate. The heating plate includes upper and lower plates with a heater therebetween which can heat the heating plate to a desired temperature, which in turn heats the mounting plate and the semiconductor devices. The cooling plate has 'S' shaped flow grooves formed throughout. When cooling fluid is flowed through the flow grooves, the cooling plate is cooled, which cools the heating plate, which in turn cools the mounting plate and the semiconductor devices.

Apparatus for heating and cooling semiconductor device in handler for testing semiconductor device

The present invention relates to a cooling apparatus for an XY gantray, and more particularly to a cooling apparatus which cools an X-axis and Y-axis linear motors used when linear motors are employed for the XY gantry adapted to travel on the plane to perform works. The cooling apparatus for the XY gantry comprises: the X-axis and Y-axis linear motors having respective stator element and moving element, the stator element and moving element having through-holes formed in one side thereof so that external air is introduced therethrough to flow along surface of coil blocks included in the respective moving element of the X-axis and Y-axis linear motors, thereby cooling heat generated from the coil blocks. An advantage is provided in that heat generated from each of the coil blocks can be cooled by air flowing through the air passages provided by respective through-holes of the X- and Y-axis linear motors applied to the XY gantry.

Cooling apparatus for an XY gantry

A cooling apparatus for a linear motor is disclosed which effectively cools heat generated when the motor is driven and provides an accurately maintained motor characteristics. The cooling apparatus for the linear motor include a blower provided outside the linear motor, at least one or more supply pipes, the supply pipes being provided to predetermined locations of the stator, air guide holes coupled to the supply pipes, respectively, for guiding flow of an introduced air, and control valves provided to predetermined locations of the supply pipes, for controlling an amount of an introduced air.

Cooling apparatus for a linear motor

The present invention relates to a carrier handling apparatus for a module IC (integrated circuit) handler and method therefor, for performing effective tests while carrier having a plural module ICs therein are transferred between the processes. The present invention includes a base frame, a vertical frame being provided perpendicular to one side of the base frame, carrier units being fixed at a top of a carrier holder, the carrier holder being disposed parallel at upper portion surfaces of the base frame and provided to slide along LM guide rails, respective press units being provided, corresponding to respective carrier units, at one side of the vertical frame, and for connecting the module ICs contained in the carrier unit, and a driving motor providing with pulley provided at one side of the vertical frame so as to slidably move rightward and leftward the carrier unit connected thereto by means of a timing belt.

Carrier handling apparatus for a module IC handler, and method therefor

The present invention relates to a linear motor with an improved cooling structure for cooling heat generated from a coil block of the motor. The linear motor includes a stator element having a stator element frame, a movable element having a movable element frame, adapted to linearly move along the stator, and a heat dissipation plate mounted on the stator element frame and the movable element frame, for externally dissipating heat generated from a coil block. Such a structure can prevent over-heating of the linear motor by dissipating heat generated from the motor coil to thereby cool the motor.

Linear motor with an improved cooling structure

There is disclosed a system for preventing malfunction of a switching circuit for a linear motor capable of preventing malfunction of the switching circuit due to magnet flux from the permanent magnet mounted on the movable element, the system including sensing magnets provided at a longitudinal one side of a movable element having a plurality of permanent magnets mounted thereon, a plurality of Hall sensors mounted on the stator element and used for controlling current flow into a plurality of armature coils by turning on/off a switching circuit, based upon the sensing of magnet flux generated from the sensing magnets, and dummy sensing magnet provided at one side end of the sensing magnet in such a manner that its polarity is opposite to that of the sensing magnet, and for preventing magnets flux generated from the plural permanent magnets from introducing into the plural Hall sensors.

Growing community of inventors

Kyonggi-do, South Korea

Hyun Joo Hwang