Samsung Electronics Co., Ltd.

Hyun-gi Kim

Hui-Jung Kim

Hyun-Woo Chung

Kang-Uk Kim

Yong-Chul Oh

Jae-man Yoon

Yongchul Oh

Cheol-Ju Yun

Seung-hee Ko

Bo-Young Song

Chae-Ho Lim

Hye-won Kim

Hyeon-Kyu Lee

Jin-A Kim

Jina Kim

Sang-moo Jeong

Seon-ju Kim

A method of manufacturing an integrated circuit device includes forming multilayered stack structures that extend parallel to and separated from one another on a substrate, followed by forming a buried conductive layer including a plurality of conductive line patterns that extend parallel to an extending direction of the multilayered stack structures and alternate with the multilayered stack structures; removing portions of the buried conductive layer to thereby separate the plurality of conductive line patterns of the buried conductive layer from one another as a plurality of contact plugs and, at the same time, form a plurality of insulating fence spaces that alternate with the plurality of contact plugs in the extending direction of the multilayered stack structures; and forming a plurality of insulating fences that fill the plurality of insulating fence spaces and include a plurality of insulating line patterns extending parallel to one another.

Method of manufacturing integrated circuit device

First dopant regions and second dopant regions are provided at both sides of the gate structures. Conductive lines cross over the gate structures and are connected to the first dopant regions. Each of the conductive lines includes a conductive pattern and a capping pattern disposed on the conductive pattern. Contact structures are provided between the conductive lines and are connected to the second dopant regions. Each of the contact structures includes a lower contact pattern disposed on the second dopant region and an upper contact pattern disposed on the lower contact pattern. A bottom surface of the upper contact pattern is lower than a top surface of the conductive pattern.

Semiconductor device and method of forming the same

A method of manufacturing a semiconductor device includes forming a plurality of conductive lines separated from one another in a first direction via a slender hole and extending in a second direction perpendicular to the first direction, forming a first insulation layer filling the slender hole between the plurality of conductive lines, forming a plurality of first isolated holes separated from one another between the plurality of conductive lines in the first direction and the second direction by patterning the first insulation layer, forming a liner layer in the first isolated holes, filling a second insulation layer having an etching selectivity with respect to the first insulation layer, in the first isolated holes on the liner layer and forming a plurality of second isolated holes between the conductive lines by removing the first insulation layer using the etching selectivity between the second insulation layer and the first insulation layer.

Method of manufacturing a semiconductor device

A semiconductor device includes a substrate structure including a first substrate and a second substrate, and a buried wiring interposed between the first substrate and the second structure, where the buried wiring is in direct contact with the second substrate. The semiconductor device further includes a vertical transistor located in the second substrate of the substrate structure. The vertical transistor includes a gate electrode and a semiconductor pillar, and the buried wiring is one of source electrode or a drain electrode of the vertical transistor.

Substrate structures including buried wiring, semiconductor devices including substrate structures, and method of fabricating the same

A semiconductor device includes a first transistor, a second transistor, an insulation interlayer pattern and a capacitor. The first transistor is formed in a first region of a substrate. The first transistor has a pillar protruding upwardly from the substrate and an impurity region provided in an upper portion of the pillar. The second transistor is formed in a second region of the substrate. The insulation interlayer pattern is formed on the first region and the second region to cover the second transistor and expose an upper surface of the pillar. The insulation interlayer pattern has an upper surface substantially higher than the upper surface of the pillar in the first region. The capacitor is formed on the impurity region in the upper portion of the pillar and is electrically connected to the impurity region.

Method of manufacturing a semiconductor device including a capacitor electrically connected to a vertical pillar transistor

In a semiconductor device and associated methods, the semiconductor device includes a substrate, an insulation layer on the substrate, a conductive structure on the insulation layer, the conductive structure including at least one metal silicide film pattern, a semiconductor pattern on the conductive structure, the semiconductor pattern protruding upwardly from the conductive structure, a gate electrode at least partially enclosing the semiconductor pattern, the gate electrode being spaced apart from the conductive structure, a first impurity region at a lower portion of the semiconductor pattern, and a second impurity region at an upper portion of the semiconductor pattern.

A semiconductor device, comprising: a vertical pillar transistor (VPT) formed on a silicon-on-insulator (SOI) substrate, the VPT including a body that has a lower portion and an upper portion, a source/drain node disposed at an upper end portion of the upper portion of the body and a drain/source node disposed at the lower portion of the body; a buried bit line (BBL) formed continuously on sidewalls and an upper surface of the lower portion, the BBL includes metal sificide; and a word line that partially enclosing the upper portion of the body of the VPT, wherein the BBL extends along a first direction and the word line extends in a second direction substantially perpendicular to the first direction. An offset region is disposed immediately beneath the word line.

Semiconductor devices with buried bit lines and methods of manufacturing semiconductor devices

Provided are a vertical channel transistor and a method for fabricating a vertical channel transistor. The method includes forming an active layer on a substrate, forming a plurality of vertical channels on the active layer, forming a plurality of isolated gate electrodes to surround sidewalls of the plurality of vertical channels, forming a buried bitline to extend along the active layer between the plurality of vertical channels, forming a plug-in between the plurality of vertical channels to connect the plurality of isolated gate electrodes and forming a wordline on a location where the plug-in and the plurality of isolated gate electrodes are connected.

Vertical channel transistors and methods for fabricating vertical channel transistors

In a semiconductor device, the semiconductor device may include a first active structure, a first gate insulation layer, a first gate electrode, a first impurity region, a second impurity region and a contact structure. The first active structure may include a first lower pattern in a first region of a substrate and a first upper pattern on the first lower pattern. The first gate insulation layer may be formed on a sidewall of the first upper pattern. The first gate electrode may be formed on the first gate insulation layer. The first impurity region may be formed in the first lower pattern. The second impurity region may be formed in the first upper pattern. The contact structure may surround an upper surface and an upper sidewall of the first upper pattern including the second impurity region. Accordingly, the contact resistance between the contact structure and the second impurity region may be decreased and structural stability of the contact structure may be improved.

Semiconductor device and method of manufacturing the semiconductor device

Semiconductor memory devices and methods of forming the same are provided, the semiconductor memory devices include a first and a second buried gate respectively disposed on both inner sidewalls of a groove formed in an active portion and a device isolation pattern. The first and second buried gates are controlled independently from each other.

Semiconductor memory devices and methods of forming the same

A semiconductor device includes: an isolation layer for defining a plurality of active areas of a substrate, where the isolation layer is disposed on the substrate; a plurality of buried word lines having upper surfaces that are lower than the upper surfaces of the active areas, being surrounded by the active areas, and extending in a first direction parallel to a main surface of the substrate; a gate dielectric film interposed between the buried word lines and the active areas; and a plurality of buried bit lines having upper surfaces that are lower than the upper surfaces of the plurality of buried word lines and extending parallel to the main surface of the substrate in a second direction that differs from the first direction.

Semiconductor device comprising buried word lines

An integrated circuit device includes a device isolation pattern on a semiconductor substrate to define an active area therein. The active area includes a doped region therein. A conductive pattern extends on the active area and electrically contacts the doped region. The conductive pattern has a lower resistivity than the doped region. The conductive pattern may be disposed in a recessed region having a bottom surface lower than a top surface of the active area. A channel pillar electrically contacts to the doped region and extends therefrom in a direction away from the substrate. A conductive gate electrode is disposed on a sidewall of the channel pillar, and a gate dielectric layer is disposed between the gate electrode and the sidewall of the channel pillar.

Integrated circuit devices including low-resistivity conductive patterns in recessed regions

Methods of fabricating vertical channel transistors may include forming an active region on a substrate, patterning the active region to form vertical channels at sides of the active region, forming a buried bit line in the active region between the vertical channels, and forming a word line facing a side of the vertical channel.

Methods of fabricating vertical channel transistors

A semiconductor memory device includes first and second active pillar structures protruding at an upper part of a substrate, buried bit lines each extending in a first direction, and first gate patterns and second gate patterns each extending in a second direction. The first and second active pillar structures occupy odd-numbered and even-numbered rows, respectively. The first and the second active pillar structures also occupy even-numbered and odd-numbered columns, respectively. The columns of the second active pillar structures are offset in the second direction from the columns of the first active pillar structures. Each buried bit line is connected to lower portions of the first active pillar structures which occupy one of the even-numbered columns and to lower portions of the second active pillar structures which occupy an adjacent one of the odd-numbered columns.

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Hwaseong-si, South Korea

Hyun-gi Kim