Samsung Electronics Co., Ltd.

Hyun-Geun Byun

Choong-Keun Kwak

Woo-Yeong Cho

Yun-Seung Shin

Du-Eung Kim

Beak-Hyung Cho

Sang-beom Kang

Young-Ho Suh

Kwang-Jin Lee

Jong-Cheol Lee

Uk-rae Cho

Su-Chul Kim

Uk-Rae Cho

A magnetic memory device includes a common line; a first write-in diode, a readout diode and a second write-in diode being connected to the common line in parallel. The magnetic memory device further includes a magnetic tunnel junction structure connected to the readout diode, first and second write-in conductors disposed at both sides of the magnetic tunnel junction structure and connected to the first and second write-in diodes, respectively and a first write-in line, a readout line and a second write-in line, which are connected to the first write-in conductor, the magnetic tunnel injection structure, and the second write-in conductor, respectively.

Magnetic memory device and method of fabricating the same

Phase change memory devices may include a semiconductor substrate of a first conductivity type and a plurality of parallel word lines disposed on the semiconductor substrate. The word lines may have a second conductivity type different from the first conductivity type and substantially flat top surfaces. First and second semiconductor patterns may be sequentially stacked on each word line, and an insulating layer may be provided to fill gap regions between the word lines, gap regions between the first semiconductor patterns and gap regions between the second semiconductor patterns. A plurality of phase change material patterns may be two-dimensionally arrayed on the insulating layer and electrically connected to the second semiconductor patterns.

Phase change memory devices employing cell diodes and methods of fabricating the same

Phase change memory devices having cell diodes and related methods are provided, where the phase change memory devices include a semiconductor substrate of a first conductivity type and a plurality of parallel word lines disposed on the semiconductor substrate, the word lines have a second conductivity type different from the first conductivity type and have substantially flat top surfaces, a plurality of first semiconductor patterns are one-dimensionally arrayed on each word line along a length direction of the word line, the first semiconductor patterns have the first conductivity type or the second conductivity type, second semiconductor patterns having the first conductivity type are stacked on the first semiconductor patterns, an insulating layer is provided on the substrate having the second semiconductor patterns, the insulating layer fills gap regions between the word lines, gap regions between the first semiconductor patterns and gap regions between the second semiconductor patterns, a plurality of phase change material patterns are two-dimensionally arrayed on the insulating layer, and the phase change material patterns are electrically connected to the second semiconductor patterns, respectively.

Integrated circuit memory devices include a first column of memory cells electrically coupled to a first pair of bit lines and a bit line precharge and selection circuit. This bit line precharge and selection circuit includes at least one stacked arrangement of thin-film transistors. These thin-film transistors include a first PMOS thin-film pull-up transistor and a first NMOS thin-film pass transistor. These thin-film transistors are electrically coupled to one of the first pair of bit lines. The first column of memory cells includes a column of TFT SRAM cells.

Integrated circuit memory devices having hierarchical bit line selection circuits therein

A generic wafer includes memory units separated by scribe lanes. Memory chips of different storage capacities can be produced from different numbers of memory units on the generic wafer by forming one or more interconnect layer specialized according to a desired storage capacity and cutting the wafer using a sawing pattern according to the desired storage capacity. The specialized layer can be formed using different masks sets that form a different conductive pattern for each storage capacity or forming a generic interconnect structure with fuses that are cut to select the storage capacity of the memory chips

Memory architecture permitting selection of storage density after fabrication of active circuitry

An SRAM, which includes a plurality of bit line pairs, a memory cell connected between each pair of the bit lines, and an address transition detection circuit for detecting transition of the externally applied address signal to generate a detection pulse signal, is provided with an improved bit line precharge circuit requiring only two transistors per bit line pair. The new precharge circuit is controlled by a bit line precharge control signal generator for generating a control signal determined by a ratio of impedances connected between a source voltage and ground voltage.

Growing community of inventors

Yongin-si, South Korea

Hyun-Geun Byun