Cheil Industries Inc.

Samsung Sdi Co., Inc.

Hyo-Young Kwon

Ran Namgung

Hwan-Sung Cheon

Yoo-Jeong Choi

Dominea Rathwell

Seung-Hyun Kim

Soo-Hyoun Mun

Hyeon-Il Jung

Yu-Mi Heo

Yun-Jun Kim

Jun-Ho Lee

Hyun-Ji Song

Youn-Jin Cho

Chung-Heon Lee

Youn-Hee Nam

Young-Min Kim

Sung-Hwan Kim

Tae-ho Kim

Yong-Woon Yoon

Seulgi Jeong

Yu-Shin Park

Min-Gyum Kim

Sang-Kyun Kim

Dong-Geun Lee

Hea-Jung Kim

You-Jung Park

Sun-Hae Kang

Byeri Yoon

A polymer including a moiety represented by Chemical Formula 1, an organic layer composition including the polymer, an organic layer manufactured from the organic layer composition, and a method of forming patterns using the organic layer composition are provided. The definitions of the Chemical Formula 1 are the same as defined in the detailed description.

Polymer, organic layer composition, organic layer, and method of forming patterns

An organic layer composition, an organic layer, and associated methods, the composition including a polymer that includes a moiety represented by Chemical Formula 1, a monomer represented by Chemical Formula 2, and a solvent, 

Organic layer composition, organic layer, and method of forming patterns

A polymer includes a structural unit represented by Chemical Formula 1 and an organic layer composition including the same. wherein in Chemical Formula 1, A is a carbon cyclic group including at least one hetero atom, B is one of groups in Group 1, where Arto Ar, Rto R, L and m are as defined in the specification and * is a linking point. When the carbon cyclic group includes at least two hetero atoms when the carbon cyclic group includes a pentagon cyclic moiety and the pentagon cyclic moiety includes a nitrogen atom (N) as a hetero atom, and the at least two hetero atoms are the same or different: 

A monomer, a polymer, an organic layer composition, an organic layer and associated methods, the monomer being represented by Chemical Formula 1: 

Monomer, polymer, organic layer composition, organic layer, and method of forming patterns

A polymer, an organic layer composition, an organic layer, and a method of forming patterns, the polymer including a moiety represented by the following Chemical Formula 1: 

Disclosed are a monomer for a hardmask composition represented by the following Chemical Formula 1, a hardmask composition including the monomer, and a method of forming a pattern using the same. In Chemical Formula 1, A, A', L and n are the same as in the detailed description.

Monomer for a hardmask composition, hardmask composition comprising the monomer, and method for forming a pattern using the hardmask composition

Disclosed is a resist underlayer composition including a compound including a moiety represented by the following Chemical Formula 1 and a solvent. In the above Chemical Formula 1, Ato A, X, X, L, L, Z, and m are the same as defined in the specification.

Resist underlayer composition, method of forming patterns, and semiconductor integrated circuit device including the pattern

A polymer, an organic layer composition including the polymer, an organic layer formed from the organic layer composition, and a method of forming patterns using the organic layer composition, the polymer including a moiety represented by Chemical Formula 1:*-A-AA-A*.&#x2003;&#x2003;[Chemical Formula 1]

Disclosed are a monomer represented by the following Chemical Formula 1 for a hardmask composition, a hardmask composition including the monomer, and a method of forming patterns using the hardmask composition.  In the above Chemical Formula 1, Ato A, Xto X, L, L, n and m are the same as described in the detailed description.

Monomer, hardmask composition including monomer, and method for forming pattern by using hardmask composition

Disclosed are a monomer for a hardmask composition represented by the Chemical Formula 1, a hardmask composition including the monomer, and a method of forming a pattern.

Monomer for hardmask composition, hardmask composition including monomer, and pattern forming method using hardmask composition

Disclosed are a positive photosensitive resin composition including (A) a polybenzoxazole precursor including a functional group at a terminal end thereof, wherein the functional group is dissociated by light of about 400 nm to about 550 nm wavelength region and is acidified; (B) a photosensitive diazoquinone compound; and (C) a solvent, and a photosensitive resin film and a display device using the same.

Positive photosensitive resin composition, photosensitive resin film prepared by using the same, and display device

A resist underlayer composition, a method of forming patterns, and semiconductor integrated circuit device, the composition including a solvent; and a compound including a moiety represented by the following Chemical Formula 1: 

Resist underlayer composition, method of forming patterns and semiconductor integrated circuit device including the patterns

Disclosed is a positive photosensitive resin composition that includes (A) at least one dissolution controlling agent selected from a compound including a repeating unit represented by the following Chemical Formula 1, a compound including a repeating unit represented by the following Chemical Formula 2, or a combination thereof, (B) a polybenzoxazole precursor, (C) a photosensitive diazoquinone compound, and (D) a solvent. An organic insulator film for a display device manufactured using the same and a display device are also disclosed.  In Chemical Formulae 1 and 2, each substituent is the same as defined in the detailed description.

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Suwon-si, South Korea

Hyo-Young Kwon