Huawei Technologies Co., Limited

Fluke Corporation

Micron Technology Incorporated

Honeywell International Inc.

Semiconductor Manufacturing International (shanghai) Corporation

Integrated Device Technology, Inc.

Chinese Academy of Sciences

International Business Machines Corporation

Microsoft Technology Licensing, LLC

Sap Se

Alcatel Lucent

Lear Corporation

Semiconductor Manufacturing International (beijing) Corporation

Tyco Electronics (shanghai) Co., Ltd.

Baoshan Iron & Steel Co., Ltd.

Hui Wang

Jian Wang

Fuping Chen

Xi Wang

Zhaowei Jia

Xiaoyan Zhang

Liangzhi Xie

Yinuo Jin

Hongchao Yang

Shena Jia

Jun Wu

Fufa Chen

Jun Wang

Wenjun Wang

Xuejun Li

Yue Ma

Junping Wu

Pinpin Zhu

Lei Shen

Bo Liang

Yunwen Huang

Sunny Voha Nuch

Zhifeng Gao

Ya Qun Liu

Hong Min Huang

Zhijun Chen

Chuan He

Cheng Cheng

Dan Qiu

Tao Miao

Yuning Wang

Zhiyou Fang

Shibin Ge

Matthew B Marzynski

Xiaoyan Bi

Yajun Ha

Minjian Wu

Shu Qing Yang

Shounan Luo

Voha Nuch

Yiyong Sun

Yinhong Yang

Mei Wang

Liang Zeng

Songnan Fan

Daiping Tang

Bright Zhang

Fang Sun

Yang Liu

Liang Zhang

Yan Wang

Huangping Jin

Xiaofeng Tao

Gang Wang

Yong Wang

Feng Liu

Hao Sun

Yong Qing Lu

Ling Chen

He Wang

Peng Gao

Lei Yu

Meng Hou

Hui Chen

Ling Shen

Peng Shang

Yingyu Chen

Jun Shen

Jie Wang

Bin Dong

Li Fan

Jiang Chen

Shanqing Li

Zheng Long Wei

Jian Sun

Wei Jun Wang

Liqiang Zhang

Liping Yang

Tao Zhao

Xinyan Jin

Hao Xu

XiaoZhong Wu

Yongyuan Shen

Fei Huang

Bing Yang

Yuhan Sun

Lixin Jiang

Qiuliang Xu

Ting Yao

Yiling Yuan

Zhihao Li

Jun Tang

Xinzhe Liu

Weiwei Zhu

Guanzhong Lu

Qi Deng

Zhang Wu

Nicolaas Deodorus Peelen

Yueming Zhou

Xiaofei Xia

Disclosed is a substrate processing method, which comprises the following steps: S: transferring a substrate plated with a first metal layer from a first plating chamber to a second plating chamber; S: after transferring the substrate to the second plating chamber, forming a water film layer on the front side of the substrate; S: electroplating a second metal layer on the first metal layer. By means of a step of forming a water film layer before electroplating in a plating chamber, the present invention has advantages of preventing delamination between two metal layers and solving product recess abnormality.

Substrate processing method

The present invention provides a substrate supporting apparatus having a spin chuck and a plurality of locating pins. The spin chuck configured to support and rotate a substrate has a supporting surface. The locating pins are disposed at the periphery of the supporting surface for limiting the substrate horizontal displacement. The supporting surface defines a first annular region. The first annular region is divided into a plurality of pin regions and a plurality of non-pin regions. The pin regions and the non-pin regions are arranged alternatively in a circumferential direction of the first annular region. Each of the pin regions is corresponding to one locating pin. A plurality of Bernoulli holes are set in the first annular region and is configured as an uneven structure in the first annular region so as to supply stronger gas flow in the pin regions than in the non-pin regions.

Substrate supporting apparatus

Exemplary methods, apparatuses, and systems include a performance throttling manager for controlling performance levels of a memory subsystem using input voltages. The performance throttling manager monitors input voltages to a memory device to determine a current input voltage value, while the memory device is operating at a first performance level. The performance throttling manager detects that the current input voltage value satisfies a threshold voltage value. The performance throttling manager selects a second performance level that is lower than the first performance level and throttles the performance of the memory device in response to detecting that the current input voltage value satisfies a threshold voltage value.

Voltage-triggered performance throttling

The present invention discloses a plating apparatus and plating methods for plating metal layers on a substrate. In an embodiment, a plating method comprises: step 1: immersing a substrate into plating solution of a plating chamber assembly including at least a first anode and a second anode; step 2: turning on a first plating power supply applied on the first anode, setting the first plating power supply to output a power value Pand continue with a period T; step 3: when the period Tends, adjusting the first plating power supply applied on the first anode to output a power value Pand continue with a period T, at the same time, turning on a second plating power supply applied on the second anode, and setting the second plating power supply to output a power value Pand continue with a period T; and step 4: when the period Tends, adjusting the second plating power supply applied on the second anode to output a power value Pand continue with a period T; wherein step 2 to step 4 are performed periodically.

Plating apparatus and plating method

A strain gauge (), a pressure sensor (), and an interventional medical catheter. The strain gauge () comprises a substrate () and at least two sensitive gages () provided on the substrate (), the at least two sensitive gages () being arranged along two mutually perpendicular directions and sharing one ground port (). The pressure sensor () comprises an elastic body () and the strain gauge () provided on the elastic body (). The interventional medical catheter comprises a catheter distal end and the pressure sensor () provided at the catheter distal end. The present application not only saves the trace space for mounting and using the strain gauge () on the interventional medical catheter, facilitating the successful mounting and use of the strain gauge () on the interventional medical catheter, improving the adaptability of the strain gauge (), but also reduces the size of the strain gauge (), thereby shortening the length of the elastic body () of the pressure sensor () and reducing the size of the interventional medical catheter.

Strain gauge, pressure sensor, and interventional medical catheter

This application relates to a signal transfer apparatus. In the apparatus, one of a plurality of switches is connected in series between a first end of each of first terminals in a first terminal group and a first end of each of second terminals in a second terminal group; a control module determines, from the plurality of switches based on apparatus connection setting, a plurality of target switches that need to be turned on, and sends a control signal for turning on the plurality of target switches to a drive circuit; and the drive circuit is connected to both the plurality of switches and the control module, and drives, based on the received control signal, the plurality of target switches to be turned on, so that signal paths between the first terminals and the second terminals that are connected to the target switches are connected.

Turning on switches based on apparatus connection setting a hardware-in-loop test system

Embodiments of this application provide an update method and a communications apparatus. The method includes: generating space domain vector update information, where the space domain vector update information is for updating a first group of space domain vectors to obtain a second group of space domain vectors, the space domain vector update information includes a plurality of groups of space domain vector coefficients, and each group of space domain vector coefficients is for performing weighted combination on the first group of space domain vectors, to obtain one space domain vector in the second group of space domain vectors; and sending the space domain vector update information.

Update method and communications apparatus

Case for an electrical meter

This application relates to the technical field of electric vehicles, and in particular, to charging systems and methods. An example charging system includes: a low-voltage battery capable of supplying power to a low-voltage electrical device of a vehicle; a power battery module; a direct current-to-direct current (DC-DC) converter capable of receiving a voltage supplied by the power battery module in response to at least that a positive relay and a negative relay of the power battery module are closed, and converting the voltage into a charging voltage of the low-voltage battery to charge the low-voltage battery; and a DC-DC controller electrically connected to the low-voltage battery and capable of monitoring a voltage of the low-voltage battery in response to at least that the vehicle is in a dormant state.

Low-voltage battery charging system and method

Methods and an apparatus for removing particles or photoresist on substrates. In an embodiment, a method comprises the following steps: transferring one or more substrates into a DIOsolution accommodated in a DIObath; after the one or more substrates are processed in the DIObath, taking the one or more substrates out from the DIObath and transferring the one or more substrates into a SPM solution accommodated in a SPM bath; after the one or more substrates are processed in the SPM bath, taking the one or more substrates out from the SPM bath and rinsing the one or more substrates; and transferring the one or more substrates to one or more single chambers to perform single substrate cleaning and drying process. The method combines DIOand SPM in one cleaning sequence, which can remove particles or photoresist, especially remove photoresist treated by medium dose or high dose of ion implantation.

Method and apparatus for removing particles or photoresist on substrates

A system for analyzing movement of a joint includes: actual markers positioned around the joint, where space positions of the actual markers track space movement of virtual marker points; an optical tracking device that senses the space positions of the actual markers so as to obtain a space movement data of the actual markers; a data collection device that collects the space movement data of the actual markers and a relative space position data of the virtual marker points with respect to the actual markers; and a data analyzing device that obtains a space movement data of the space movement of the virtual marker points from the space movement data of the actual markers, and simulates and analyzes a movement of a bony structure of the joint according to the space movement data of the virtual marker points.

Analysis system and method of joint movement

Apparatuses, systems, and methods for using defrag levels to reduce data loss are provided herein. In a number of embodiments of the present disclosure, a method can include setting a first defrag level for a memory device, determining if a buffer is full while performing defrag operations on the memory device according to the first defrag level, setting a second defrag level for the memory device in response to determining the buffer is full while performing defrag operations according to the first defrag level.

Defrag levels to reduce data loss

This application provides a channel state information (CSI) feedback method including: a terminal device selects B complex coefficients from K complex coefficients according to a preset priority rule, and provides feedback, where K is a quantity of complex coefficients that the terminal device is allowed to feed back, and the preset priority rule is related to at least one of the following: an index value of each complex coefficient in the K complex coefficients, an index value of a reference signal port corresponding to each complex coefficient in the K complex coefficients in S reference signal ports, or an index value of each complex coefficient in the K complex coefficients in a plurality of complex coefficients that are allowed to be selected for a corresponding reference signal port, where S is a quantity of reference signal ports that the terminal device is allowed to select.

Channel information feedback method and communication apparatus

A method for cleaning substrates includes rotating a substrate; delivering deionized water on a surface of the substrate for pre wetting the surface of the substrate; delivering chemical solution with high temperature on the surface of the substrate for cleaning the surface of the substrate; changing the rotation speed of the substrate to a low rotation speed, and moving a ultra/mega sonic device. The method further includes turning on the ultra/mega sonic device and supplying a constant or pulse working power in a first cleaning cycle; turning off the ultra/mega sonic device, and delivering a high temperature chemical solution or deionized water. The method further includes turning on the ultra/mega sonic device and supplying a constant or pulse working power in a second cleaning cycle; turning off the ultra/mega sonic device, and delivering rinse chemical solution or deionized water on the surface of the substrate; and drying the substrate.

Method and apparatus for cleaning substrates using high temperature chemicals and ultrasonic device

An antenna switching circuit, electronic device and method. The switching circuit includes a radio frequency processor, a radio frequency front-end, a first switch, and an antenna system with a plurality of antennas. The radio frequency processor receives a first radio frequency signal, generates a second radio frequency signal based on a loss value of the first switch, and transmits the second radio frequency signal to the first switch. The first switch selects, from a plurality of radio frequency channels in the radio frequency front-end, a radio frequency channel coupled with the radio frequency processor, and transmits the second radio frequency signal to a radio frequency channel. The radio frequency front-end receives and processes the second radio frequency signal to generate a third radio frequency signal and transmits it to the antenna system, which outputs the third radio frequency signal.

Antenna switching circuit and electronic device

Growing community of inventors

Shanghai, China

Hui Wang