Arizona State University

California Institute of Technology

University of Southern California

Hugh Barnaby

Hongyu Yu

Yuji Zhao

Philippe C Adell

Xuanqi Huang

Blayne Tolleson

Ivan Sanchez Esqueda

Runchen Fang

Jonathon Keith Oiler

A steep-slope (SS) field effect transistor (FET) including a FET having a source region and a drain region, and a threshold switching device in direct contact with the source region or the drain region of the FET. Fabricating the steep-slope (SS) field effect transistor (FET) includes fabricating an AlGaN/GaN metal-insulator-semiconductor high electron mobility transistor (MIS-HEMT) having a source region and a drain region, depositing a first electrode layer directly on the source region or the drain region, depositing a threshold switching layer directly on the first electrode layer, and depositing a second electrode layer directly on the threshold switching layer.

Steep slope transistors with threshold switching devices

The disclosure describes a method for modeling excess base current in irradiated bipolar junction transistors (BJTs). The method includes quantifying defect-related electrostatic effects of a BJT device to help improve accuracy in predicting an irradiated excess base current of the BJT device. The method can be adapted to model the excess base current of a lateral P-type-N-type-P-type (LPNP) BJT device in depleted and/or accumulated surface potential states. The predicted excess base current may be used to qualify or disqualify the BJT device or an electrical circuit including the BJT device for use in a space system(s) as a commercial-off-the-shelf (COTS) component. By modeling the excess base current based on quantifying and utilizing the defect-related electrostatic effects, it may be possible to accurately predict a total-ionizing-dose (TID) response of the BJT device, thus enabling faster and lower-cost qualification of a COTS component(s) for use in the space system(s).

Method for modeling excess current in irradiated bipolar junction transistors

This disclosure relates generally to systems and methods for simulating physical active semiconductor components using in silico active semiconductor components. To simulate charge degradation effect(s) in a circuit simulation, a simulated defect signal level is produced. More specifically, the simulated defect signal level simulates at least one charge degradation effect in the in silico active semiconductor component as a function of simulation time and a simulated input signal level of a simulated input signal. As such, the charge degradation effect(s) are simulated externally with respect to the in silico active semiconductor component. In this manner, the in silico active semiconductor component does not need to be reprogrammed in order to simulate charge degradation effects.

Physics-based reliability model for large-scale CMOS circuit design

The present invention relates generally to the detection of high energy radiation. The present invention relates more particularly to the film bulk acoustic wave resonator-based devices, and their use in the detection of high energy radiation. One aspect of the invention is a method for detecting high energy radiation, the method comprising providing a film bulk acoustic wave resonator having a zinc oxide piezoelectric layer in substantial contact with a dielectric layer; exposing the film bulk acoustic wave resonator to the high energy radiation; determining the resonant frequency of the film bulk acoustic wave resonator; and determining the dose of high energy radiation using the resonant frequency of the film bulk acoustic wave resonator.

Film bulk acoustic wave resonator-based high energy radiation detectors and methods using the same

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Tempe, AZ, United States of America

Hugh Barnaby