Carl-zeiss-smt Ag

Carl Zeiss Smt Gmbh

Carl-zeiss-stiftung

Carl Zeiss Laser Optics Gmbh

Other

Carl Zeiss Semiconductor Manufacturing Technologies Ag

Carl-zeiss-stiftung Trading As Carl Zeiss

Carl Zelss Smt Ag

Hubert Holderer

Alexander Kohl

Ulrich Weber

Wolfgang Hummel

Bernhard Gellrich

Christian Wagner

Jochen Becker

Jochen Weber

Rudolf Von B&uuml;nau

Jens Kugler

Stefan Xalter

Johannes Lippert

Erich Merz

Juergen Fischer

Thorsten Rassel

Karl-Eugen Aubele

Klaus Rief

Payam Tayebati

Raoul Reiner

Markus Neumaier

Armin Schoeppach

Thomas Petasch

Michael Muehlbeyer

Stefan Schoengart

Stefan Hembacher

Michael Trunz

Winfried M Kaiser

Thomas Ittner

Markus Holz

Klaus Guenther Beck

Baerbel Schwaer

Baerbel Trossbach

Cornelia Roesch

Dirk Rexhaeuser

Werner M&uuml;ller-Rissmann

Karl-Heinz Schimitzek

Toralf Gruner

Wolfgang Singer

Karl-Heinz Schuster

Manfred Maul

Markus Hauf

Boris Bittner

Sascha Bleidistel

Matthias Manger

Rudolf Von Buenau

Markus Weiss

Frank Melzer

Olaf Conradi

Ulrich Mueller

Ulrich Bingel

Arif Kazi

Willi Anderl

Andreas Seifert

Daniel Runde

Martin Brunotte

Juergen Baier

Erwin Gaber

Andreas Heisler

Joachim Welker

Ulrich Haag

Chris Reed

Dragos Pariza

Mike Meehan

Christian Hembd-Soellner

Heinz Mann

Jürgen Hartmaier

Frits Zernike

Wilhelm Ulrich

Michael Patra

Aurelian Dodoc

Johannes Ruoff

Bernhard Geuppert

Hans-Juergen Rostalski

Michael Gerhard

Susanne Beder

Ulrich Loering

Christoph Zaczek

Andreas Wurmbrand

Berndt Warm

Johannes Rau

Holger Kierey

Martin Weiser

Karl Heinz Schuster

Michel Le Maire

Thomas Fischer

Stephan Back

Reiner Garreis

Joerg Mallmann

Claudia Ekstein

Lars Wischmeier

Michael Mühlbeyer

Jens Ullmann

Hartmut Muenker

Albrecht Ranck

Stefan Dornheim

Arie Cornelis Scheiberlich

Werner Lang

Björn Liebaug

Stefan Seitz

Josef Distl

A facet mirror for an illumination optical unit of a projection exposure apparatus has a large number of displaceable individual facets with a facet main body and a reflection surface arranged on it. At least some of the individual facets have a displacement range such that they come into contact with a stop surface in one or more displacement positions.

Facet mirror for an illumination optical unit of a projection exposure apparatus

A measurement illumination optical unit guides illumination light into an object field of a projection exposure apparatus for EUV lithography. The illumination optical unit has a field facet mirror with a plurality of field facets and a pupil facet mirror with a plurality of pupil facets. The latter serve for overlaid imaging in the object field of field facet images of the field facets. A field facet imaging channel of the illumination light is guided via any one field facet and any one pupil facet. A field stop specifies a field boundary of an illumination field in the object plane. The illumination field has a greater extent along one field dimension than any one of the field facet images. At least some of the field facets include tilt actuators which help guide the illumination light into the illumination field via various field facets and one and the same pupil facet.

Measurement illumination optical unit for guiding illumination light into an object field of a projection exposure system for EUV lithography

A beam-forming and illuminating system for a lithography system, such an EUV lithography system, includes an optical element and an adjusting device. The adjusting device is configured so that, during a heat-up phase of the beam-forming and illuminating system, the adjusting device measures a field position and/or a pupil position of the beam-forming and illuminating system and adjusts the orientation and/or position of the optical element based on the measured field position and/or pupil position to keep the optical element in a desired position.

Beam-forming and illuminating system for a lithography system, lithography system, and method

An imaging optical unit for EUV microlithography is configured so that, when used in an optical system for EUV microlithography, relatively high EUV throughput and high imaging quality can achieved.

Imaging optical unit for EUV microlithography

The disclosure relates to a method for producing an illumination system for an EUV apparatus in and to an illumination system for an EUV apparatus.

Method for producing an illumination system for an EUV projection exposure system, and illumination system

An optical imaging device, in particular for use in microlithography, includes a mask device for receiving a mask having a projection pattern, a projection device with an optical element group, a substrate device for receiving a substrate and an immersion zone. The optical element group is adapted to project the projection pattern onto the substrate and includes a plurality of optical elements with an immersion element to which the substrate is at least temporarily located adjacent to during operation. During operation, the immersion zone is located between the immersion element and the substrate and is at least temporarily filled with an immersion medium. A thermal attenuation device is provided, the thermal attenuation device being adapted to reduce fluctuations within the temperature distribution of the immersion element induced by the immersion medium.

Optical imaging device with thermal attenuation

An imaging device in a projection exposure machine for microlithography has at least one optical element and at least one manipulator, having a linear drive, for manipulating the position of the optical element. The linear drive has a driven subregion and a nondriven subregion, which are movable relative to one another in the direction of a movement axis. The subregions are interconnected at least temporarily via functional elements with an active axis and via functional elements with an active direction at least approximately parallel to the movement axis.

Imaging device in a projection exposure facility

A holding arrangement for an optical element, in particular for a cylindrical lens, includes a basic structure surrounding an optical element and a mounting device by which the optical element is supported on the basic structure. The mounting device has two degrees of freedom so that the optical element can be supported by the mounting device in a manner that allows the optical element to rotate about both about an optical axis and an axis perpendicular to the optical axis. If the optical element is a cylindrical lens, the axis perpendicular to the optical axis can be an axis perpendicular to an axial direction of the cylindrical lens. The disclosure further relates to a manipulator unit for an optical system which includes a holding arrangement.

Holding arrangement for an optical element

A holding arrangement for an optical element includes a basic structure surrounding an optical element and a mounting device by which the optical element can be supported on the basic structure with two degrees of freedom for a rotational movement about an optical axis and a translational movement along a first axis which extends perpendicularly to the optical axis and intersects the optical axis in a center. The mounting device includes four joint locations arranged point-symmetrically with respect to the center and at least one parallel rocker which is displaceable parallel to the first axis. A manipulator unit includes a holding arrangement.

An optical system, such as an illumination system, includes an optical arrangement having at least one optical element and at least one heat dissipation element configured to at least partially dissipate thermal energy generated in the optical element(s) to the outside environment of the optical system. The heat dissipation element(s) is(are) arranged without direct contact with the optical element(s).

Optical system having heat dissipation arrangement

A reflective optical element for use in an EUV system is disclosed. The reflective optical element includes a base body, which is produced at least partly from a substrate material. At least one cooling channel through which a cooling medium can flow is arranged in the base body. A material having a thermal conductivity of greater than 50 W/mK is provided as substrate material. The reflective optical element also includes a polishing layer, which is applied on the substrate material. The polishing layer includes an amorphous material which can be processed via polishing.

Reflective optical element for use in an EUV system

A projection objective of a microlithographic projection exposure apparatus comprises a manipulator for reducing rotationally asymmetric image errors. The manipulator in turn contains a lens, an optical element and an interspace formed between the lens and the optical element, which can be filled with a liquid. At least one actuator acting exclusively on the lens is furthermore provided, which can generate a rotationally asymmetric deformation of the lens.

Projection objective of a microlithographic projection exposure apparatus

Growing community of inventors

Oberkochen, Germany

Hubert Holderer