Taiwan Semiconductor Manufacturing Comp. Ltd.

Hsuan Jung Chang

Chih-Wei Wen

Jen-Ti Wang

Kun-Lung Hsieh

Kuo-Fong Chuang

Ting-Hsien Ko

Chao-Hsiung Yeh

Chin-Tsan Chen

A dis-pellicle tool or pellicle removal tool that includes one or more clamp structures that each include a respective group of pins. The respective pins of the groups of pins of the one or more clamp structures are configured to, in operation, be inserted into holes that are present within a pellicle frame of a pellicle. Once the respective pins of the groups of pins are inserted into the holes of the pellicle frame, a removal force may be applied to the pellicle frame to remove the pellicle from a photomask to which the pellicle is coupled to by an adhesive, glue, or some other similar type of coupling material.

Pellicle, pellicle removal tool, and method of utilizing pellicle and pellicle removal tool

A wafer processing tool is capable of detecting wafer warpage. The wafer processing tool includes a wafer holder on which a wafer is held and at least one sensor set. The at least one sensor set is disposed above the wafer or under the wafer, and a projection of each of the at least one sensor set on the wafer radially extending from a center of the wafer to an edge of the wafer. The at least one sensor set is configured to scan an entire surface of the wafer so as to measure warpage of the wafer while the wafer holder and the at least one sensor set are rotatable relative to each other.

Wafer processing tool capable of detecting wafer warpage and method for detecting wafer warpage

Growing community of inventors

Hsinchu, Taiwan

Hsuan Jung Chang