E Ink Holdings Inc.

National Yang Ming Chiao Tung University

Corning Incorporated

United Microelectronics Corp.

Hsiao-Wen Zan

Hsin-Fei Meng

Chuang-Chuang Tsai

Wei-Tsung Chen

Mingqian He

Cheng-Hang Hsu

Yu-Chiang Chao

Hung-Chuan Liu

Zong-Xuan Li

Robert George Manley

Sheng-Fu Horng

Karan Mehrotra

Yu-Nung Mao

Po-Sheng Shih

Ting-Chang Chang

Yu-Chi Lin

Chun-Hung Liao

Wu-Wei Tsai

Chao-Hsuan Chen

Pei-Chen Yu

Ming-Zhi Dai

Shang-Yu Yu

Hao-Wen Chang

Hsin Chiao

Ting-Wei Tung

Yi-Chu Wu

Ching-Fu Lin

Chun-Cheng Yeh

Lei Zhang

Chia-Chun Yeh

Henry Wang

Xue-Hung Tsai

Ming-Yen Chuang

Chien-Lung Wang

Yu-Fan Chang

Bing-Shu Wu

Yi-Chun Lai

Liang-Hao Chen

Yen-Chu Chao

Kai-Ruei Wang

Yung-Hsuan Hsu

Hao-Wu Lin

Yu-Chian Chiu

Chun-Chih Chen

Yi-Ting Chou

Chia-Wei Chou

Pin-Hsuan Li

Hsuan Chu

Wei-Lun Chen

Ting-Hsuan Huang

Po-Yi Chang

Chang-Chiang Chen

Shao-Fu Peng

A gas sensor includes a first electrode, a gas detecting layer disposed on the first electrode, and an electric-conduction enhanced electrode unit being electrically connected to the first electrode and the gas detecting layer. The electric-conduction enhanced electrode unit includes an electric-conduction enhancing layer and a second electrode electrically connected to the electric-conduction enhancing layer. The electric-conduction enhancing layer is electrically connected to the gas detecting layer and is made of an electrically conductive organic material.

Gas sensor

A device for analyzing gas emitted from skin includes: an enclosure for collecting the gas emitted from skin, the enclosure having: an inlet through which a carrier gas is flown; and an outlet through which the carrier gas and the gas emitted from skin is flown into a vertical gas sensor, such that the vertical gas sensor has: a substrate; a collector layer; an emitter layer positively biased relative to the collector; a metal grid with a metal layer having openings, the metal grid located in between, but not in direct contact with, the collector and emitter; and an organic semiconductor (OSC) layer located in between the collector and emitter.

Devices include a substrate, a collector layer, and an emitter layer positively biased relative to the collector. Devices further include a semiconductor layer located between the collector and the emitter. The semiconductor layer includes an organic semiconductor polymer with a donor-acceptor structure.

High current OTFT devices with vertical designed structure and donor-acceptor based organic semiconductor materials

A gas sensor for sensing a gas in a humid environment includes a first electrode layer, a second electrode layer that is spaced apart from the first electrode layer, and a gas sensing layer that electrically interconnects the first electrode layer and the second electrode layer. The gas sensing layer is made of a hygroscopic electrically insulating material.

Described herein are electronics that incorporate heterocyclic organic compounds. More specifically, described herein are organic electronics systems that are combined with donor-acceptor organic semiconductors, along with methods for making such devices, and uses thereof.

A sensitive device includes a plurality of first conductive nanostructures, a conductive layer and at least one electrode. The conductive layer covers the first conductive nanostructures. An intrinsic melting point of the conductive layer is higher than that of the first conductive nanostructures. At least one of the conductive layer and the first conductive nanostructures is sensitive to gas. The electrode is electrically connected to at least one of the first conductive nanostructures and the conductive layer.

Sensitive device and method of forming the same

A proximity sensor includes a substrate, a light source, a finger electrode, an active layer, and a transparent electrode layer. The substrate has opposite top and bottom surfaces. The light source faces toward the bottom surface of the substrate. The finger electrode is located on the top surface of the substrate, and has finger portions and gaps between every two adjacent finger portions. The active layer covers the finger electrode, and is located in the gaps. The transparent electrode layer is located on the active layer. When the light source emits light, the light through the gaps sequentially passes through the active layer and the transparent electrode layer onto a reflective surface. The light is reflected by the reflective surface to form reflected light, and the reflected light passes through the transparent electrode layer and is received by the active layer.

Proximity sensor and operation method thereof

An active device is disposed on a substrate and includes a gate, an organic active layer, a gate insulation layer, a plurality of crystal induced structures, a source and a drain. The gate insulation layer is disposed between the gate and the organic active layer. The crystal induced structures distribute in the organic active layer and directly contact with the substrate or the gate insulation layer. The source and the drain are disposed on two opposite sides of the organic active layer, wherein a portion of the organic active layer is exposed between the source and the drain.

Active device

A memory structure includes a substrate, a gate electrode, a first isolation layer, a thin metal layer, indium gallium zinc oxide (IGZO) particles, a second isolation layer, an IGZO channel layer, and a source/drain electrode. The gate electrode is located on the substrate. The first isolation layer is located on the gate electrode. The thin metal layer is located on the first isolation layer, and has metal particles. The IGZO particles are located on the metal particles. The second isolation layer is located on the IGZO particles. The IGZO channel layer is located on the second isolation layer. The source/drain electrode is located on the IGZO channel layer.

Memory structure and manufacturing method thereof

A sensing element includes a conductive substrate, a zinc oxide seed layer, a plurality of zinc oxide nanorods, a film with an electrical double layer, and an organic sensing layer. The zinc oxide seed layer is located on the conductive substrate. The zinc oxide nanorods extend from the zinc oxide seed layer. The film with the electrical double layer covers the zinc oxide nanorods. The organic sensing layer is located on the film with the electrical double layer.

Sensing element

A transistor including a substrate, a source, a drain, an active portion, a fin-shaped gate, and an insulation layer is provided. The source is located on the substrate. The drain is located on the substrate. The active portion connects the source and the drain. The fin-shaped gate wraps the active portion. A first portion of the insulation layer separates the fin-shaped gate from the active portion, a second portion of the insulation layer separates the fin-shaped gate from the substrate, a third portion of the insulation layer separates the fin-shaped gate from the source and from the drain, and a fourth portion of the insulation layer is located on a surface of the fin-shaped gate facing away from the active portion. Here, the insulation layer is integrally formed.

Transistor

An organic thin film transistor includes a substrate, a hydrophobic layer, an oxide layer, a hydrophilic layer, a semiconductor layer, and a source/drain layer. The hydrophobic layer covers a surface of the substrate. The oxide layer is located on the hydrophobic layer and has plural segments. The hydrophilic layer is located on the segments of the oxide layer, and the oxide layer is located between the hydrophilic layer and the hydrophobic layer. The semiconductor layer is located on the hydrophilic layer, and the hydrophilic layer is located between the semiconductor layer and the oxide layer. The source/drain layer connects across the semiconductor layer on the segments of the oxide layer.

Organic thin film transistor and manufacturing method thereof

A transistor including a substrate, a gate layer, a first insulating layer, an active layer, a source and a drain is provided. The gate layer is disposed on the first insulating layer, and has a plurality of first through holes. The first insulating layer covers the gate layer and a part of the substrate exposed by the first through holes, and forms a plurality of recesses respectively corresponding to the first through holes. The active layer is disposed on the first insulating layer, and has a plurality of second through holes. The second through holes communicate with the recesses, respectively. The source is disposed on a part of the active layer. The drain is disposed on another part of the active layer. A manufacturing method of the transistor is also provided.

Transistor including active layer having through holes and manufacturing method thereof

Growing community of inventors

Hsinchu, Taiwan

Hsiao-Wen Zan