Texas Instruments Corporation

Reflectivity, Inc.

Google Inc.

Waymo LLC

Microdisplay Corporation

Hongqin Shi

James C Dunphy

Satyadev R Patel

Gregory P Schaadt

Andrew Gerrit Huibers

Dmitri Simonian

Yeh-Jiun Tung

Jonathan Clayton Doan

Sandeep Kumar Giri

Douglas B MacDonald

Jianglong Zhang

Cesar Gensoli

Mark B Spitzer

Peter W Richards

Mary Lou Jepsen

Terry Alan Bartlett

David Neil Hutchison

Steve S Chiang

John Stuart Fitch

Ozan Cakmakci

John D Porter

Robert M Duboc

Dietrich A Dehlinger

Andrew Gerritt Huibers

Oscar A Martinez

Regis Grasser

Peter Heureux

Niles MacDonald

Nao Sugawara Chuei

Omar Negrete

Amir Torkaman

Hung Nan Chen

Jamie Nam

Eric Copenhaver

Yeh Tung

Satayadev R Patel

Thomas J Grobelny

Anthony Sun

The present application relates to contact immersion lithography exposure units and methods of their use. An example contact exposure unit includes a container configured to contain a fluid material and a substrate disposed within the container. The substrate has a first surface and a second surface, and the substrate includes a photoresist material on at least the first surface. The contact exposure unit includes a photomask disposed within the container. The photomask is optically coupled to the photoresist material by way of a gap comprising the fluid material. The contact exposure unit also includes an inflatable balloon configured to be controllably inflated so as to apply a desired force to the second surface of the substrate to controllably adjust the gap between the photomask and the photoresist material.

Systems and methods for contact immersion lithography

The present application relates to contact immersion lithography systems and methods of their use. An example immersion lithography system includes a photomask substrate and at least one sensor disposed along a surface of the photomask substrate. The immersion lithography system also includes a controller having at least one processor and a memory. The at least one processor is configured to execute program instructions stored in the memory so as to carry out operations. The operations include receiving, from the at least one sensor, information indicative of an electric field proximate to the at least one sensor. The operations also include determining, based on the received information, at least one of: a thickness of a liquid layer adjacent to the photomask substrate or a distance to a further substrate adjacent to the photomask substrate.

Systems and methods for verifying photomask cleanliness

Systems and methods for lithography

Techniques and mechanisms for fabricating an eyepiece from a lens blank including blank bodies that are bonded to each other. In an embodiment, the blank bodies are formed by injection molding and adhered to one another. Fabrication of the eyepiece includes variously machining the blank bodies to shape respective lens bodies of the eyepiece. One or more blocking structures are coupled to reinforce the lens blank during at least part of such machining. In another embodiment, any blocking structures that are to resist forces of a particular machining process are coupled only indirectly to one of the blank bodies.

Method for fabricating a curved eyepiece

Techniques and mechanisms for generating a laminate structure. In an embodiment, a layer of adhesive material is disposed on a surface of a glass plate or other constituent layer for a laminate. Prior to an application of another constituent layer, the adhesive layer is selectively cured to form in the adhesive layer at least a first portion which adjoins a second portion of the layer of adhesive material. In some embodiments, a level of cure of the first portion is greater than a level of cure of the second portion.

Method, apparatus and system for providing a uniform laminate structure

An eyepiece includes a first lens body having a first interface side and a second lens body having a second interface side. At least one of the first and second interface sides includes a recess. The first and second lens bodies are mated together along the first and second interface sides to form a cavity at the recess. A lightguide insert is provided that has a shape and a size to fit within the cavity. The lightguide insert includes an in-coupling region to receive display light into the lightguide insert and an out-coupling region to direct the display light out of the lightguide insert through the first lens body.

Lens with lightguide insert for head wearable display

The present disclosure provides methods and systems for bonding multiple wafers. An example system may include a sealable chamber with a first and second substantially vertical post positioned inside of the sealable chamber. The system may also include a first latch connected to the first post via a first pin, wherein the first pin allows the first latch to rotate about the first pin. The system may also include a second latch similarly configured to the first latch. The system may also include a base plate positioned between the first and second posts. The base plate is arranged such that when a first wafer rests on the base plate and a second wafer rests on the first and second latches, moving the base plate from a first position to a second position causes a top surface of the first wafer to contact a bottom surface of the second wafer.

Methods and systems for bonding multiple wafers

An eyepiece for a head wearable display includes a first lens body having a first interface side in which a first recess is disposed and a second lens body having a second interface side in which a second recess is disposed. The first and second lens bodies are mated together along the first and second interface sides and the first and second recesses are aligned to form a cavity. A lightguide insert is provided that has a shape and a size to fit within the cavity defined by the first and second recesses. The lightguide insert includes an in-coupling region to receive display light into the lightguide insert and an out-coupling region to direct the display light out of the lightguide insert through the first lens body.

A releasing and post-releasing method for making a micromirror device and a micromirror array device are disclosed herein. The releasing method removes the sacrificial materials in the micromirror and micromirror array so as to enabling movements of the movable elements in the micromirror and micromirror array device. The post-releasing method is applied to improve the performance and quality of the released micromirrors and micromirror array devices.

Releasing and post-releasing processes in fabrications for micromirror array devices

Speckle effect in display system is reduced by utilizing the instability of phase-coherent light and the transmission of the instable phase-coherent light through a multi-mode optical fiber with a suitable length.

Speckle reduction in display systems that employ coherent light sources

The present invention provides a method for removing sacrificial materials in fabrications of microstructures using a selected spontaneous vapor phase chemical etchants. During the etching process, an amount of the etchant is fed into an etch chamber for removing the sacrificial material. Additional amount of the etchant are fed into the etch chamber according to a detection of an amount or an amount of an etching product so as to maintaining a substantially constant etching rate of the sacrificial materials inside the etch chamber. Accordingly, an etching system is provided for removing the sacrificial materials based on the disclosed etching method.

Methods and apparatus of etch process control in fabrications of microstructures

Disclosed herein is a micromirror device having in-plane deformable hinge to which a deflectable and reflective mirror plate is attached. The mirror plate rotates to different angles in response to an electrostatic field established between the mirror plate and an addressing electrode associated with the mirror plate.

Micromirror device and method for making the same

A method for making a micromirror device comprises is disclosed herein.

Micromirror devices and methods of making the same

A projection system, a spatial light modulator, and a method for forming a MEMS device is disclosed. The spatial light modulator can have two substrates bonded together with one of the substrates comprising a micromirror array. The two substrates can be bonded at the wafer level after depositing a getter material andlor solid or liquid lubricant on one or both of the wafers. The wafers can be bonded together hermetically if desired, and the pressure between the two substrates can be below atmosphere.

Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates

Growing community of inventors

San Jose, CA, United States of America

Hongqin Shi