Panasonic Intellectual Property Management Co., Ltd.

Honami Nawa

Hirohisa Hino

Arata Kishi

Kazuhiro Nishikawa

Yasuhiro Suzuki

Atsushi Tanaka

Naomi Nishiki

Hidenori Miyakawa

Hidetoshi Kitaura

Naomichi Ohashi

Kimiaki Nakaya

Keisuke Kawashima

A photocurable composition contains: a component (A): (meth)acrylic acid ester having 2 to 6 (meth)acryloyl groups in one molecule, a component (B): a thiol compound having 2 to 4 thiol groups in one molecule, and a component (C): a photobase generator, in which a mass ratio of the component (A) to the component (B) is 66:34 to 33:67, inclusive, a functional group equivalent of the component (A) is 96 g/eq to 180 g/eq, inclusive, a functional group equivalent of the component (B) is 95 g/eq to 190 g/eq, inclusive, and a content of the component (C) is 0.5 parts by mass to 2 parts by mass with respect to 100 parts by mass of a total of the component (A), the component (B), and the component (C).

Photocurable composition

Provided is a heat-dissipating resin composition including: a rubber material having an average emissivity of 80% or higher in a wavelength range from 5 &#x3bc;m to 20 &#x3bc;m; and a filler having a grain diameter of 15 &#x3bc;m or smaller and an aspect ratio of 3 to 10, wherein the heat-dissipating resin composition has an emissivity of 90% or higher in the wavelength range from 5 &#x3bc;m to 20 &#x3bc;m.

Heat-dissipating resin composition, and component and electronic device including the same

Provided herein is a resin structure having high heat dissipation, and desirable adhesion at the interface with a heat generating device. The resin structure is provided on a substrate to dissipates heat of the substrate to outside, and includes: a water-based coating material layer provided on the substrate and including a water-based coating material, and fillers having an average particle size of 30 &#x3bc;m to 150 &#x3bc;m; and a resin layer provided on the water-based coating material layer and containing a thermosetting resin. The fillers have a far-infrared emissivity of 0.8 or more, and an average aspect ratio of 1 to 12 as measured as a ratio of lengths along the long axis and the short axis through the center of gravity of the fillers. At least 80% of the total number of fillers has a length that is at least 1.7 times longer than the total thickness of the water-based coating material of the water-based coating material layer and the thermosetting resin of the resin layer, as measured along the long axis through the center of gravity of the fillers.

Resin structure, and electronic component and electronic device using the structure

An object of the present invention is to provide an anisotropic heat conductive composition comprising: resin; and graphite fillers dispersed into the resin, wherein the graphite fillers each have a maximum diameter A in parallel with a basal plane of each of the graphite fillers and a maximum length C perpendicular to the basal plane, an average of the maximum diameters A ranges from 1 &#x3bc;m to 300 &#x3bc;m, an average ratio of the maximum diameter A to the maximum length C represented by A/C is at least 30, a content of the graphite fillers is 20 mass % to 40 mass %, and an average of a smaller angle made by the basal plane and a sheet surface of the sheet anisotropic heat conductive composition is less than 15&#xb0;.

Anisotropic heat conductive composition

A cooling structure can efficiently reduce heat, thereby suppressing temperature elevation in heat-producing electronic apparatuses, without using a heat sink or water-cooling jacket, and which can achieve their downsizing or weight reduction. The cooling structure includes: a heat conduction layer which is formed by coating a first paste on a surface of a heat-producing object; and a heat radiation layer which is formed by coating a second paste on a surface of the heat conduction layer. The heat conduction layer includes a first resin and a first filler, and a heat conductivity &#x3bb; of the heat conduction layer is 1.0 W/(m&#xb7;K) or more. The heat radiation layer includes a second resin and a second filler, and an infrared emissivity &#x3b5; of the heat radiation layer is 0.7 or more.

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Osaka, Japan

Honami Nawa