Cabot Microelectronics Corporation

Organic Display Technology

Northwestern University

Homer Z Chou

Shumin Wang

Kevin J Moeggenborg

Jeffrey P Chamberlain

Joseph D Hawkins

Tobin Jay Marks

Phillip W Carter

Mingming Fang

David Schroeder

Wuping Ma

A method and system for planarizing or polishing a substrate, particularly a memory or rigid disk, are provided. The method comprises abrading at least a portion of the surface with a polishing system comprising (i) a polishing composition comprising water, an oxidizing agent, and about 0.04 M or higher phosphate ion or phosphonate ion, and (ii) abrasive material. The present invention also provides a system for planarizing or polishing a substrate comprising (i) a polishing composition comprising water, an oxidizing agent, and about 0.04 M or higher phosphate ion or phosphonate ion, and (ii) silica particles.

Method for polishing a memory or rigid disk with a phosphate ion-containing polishing system

The invention provides a method of polishing a substrate containing a low-k dielectric layer comprising (i) contacting the substrate with a chemical-mechanical polishing system comprising (a) an abrasive, a polishing pad, or a combination thereof, (b) an amphiphilic nonionic surfactant, and (c) a liquid carrier, and (ii) abrading at least a portion of the substrate to polish the substrate.

CMP compositions for low-k dielectric materials

The invention provides methods of polishing a substrate comprising (i) contacting a substrate comprising at least one metal layer comprising copper with a chemical-mechanical polishing (CMP) system and (ii) abrading at least a portion of the metal layer comprising copper to polish the substrate. The CMP system comprises (a) an abrasive, (b) an amphiphilic nonionic surfactant, (c) a means for oxidizing the metal layer, (d) an organic acid, (e) a corrosion inhibitor, and (f) a liquid carrier. The invention further provides a two-step method of polishing a substrate comprising a first metal layer and a second, different metal layer. The first metal layer is polishing with a first CMP system comprising an abrasive and a liquid carrier, and the second metal layer is polished with a second CMP system comprising (a) an abrasive, (b) an amphiphilic nonionic surfactant, and (c) a liquid carrier.

CMP method utilizing amphiphilic nonionic surfactants

Electroluminescent devices and materials including an electroluminescent organo-siloxane polymer. The main chain of the organo-siloxane polymer comprises an organic component that can be alkenyl, alkynyl, aralkyl, aryl, heteroaralkyl, and heteroaryl which can be substituted optionally with hydrogen, alkyl, aryl, heteroalkyl, heteroaralkyl, nitro, cyano, hydroxy, alkoxy, aryloxy, thio, alkylthio, arylthio, amino, halogen, dialkylamino, diarylamino, diaralkylamino, arylamino, alkylamino, arylalkylamino, carbonyloxy, carbonylalkoxy, carbonylalkyloxy, alkylcarbonyloxy, arylcarbonyloxy, alkoxylcarbonyloxy, sulfonyl, or sulfonyloxy. The organic component includes at least two covalent bonds coupling the organic component to the main chain of the organo-siloxane polymer. Such devices provide superior performance and mechanical stability compared with conventional organic electroluminescent materials and devices made from such materials.

Organic electroluminescent materials and device made from such materials

Organic electroluminescent materials having desirable efficiency, weight, and durability properties, as well as devices made from such materials. In one aspect, an organic electroluminescent material is electroluminescently conductively coupled directly with an anode and cathode such that the organic electroluminescent material emits light upon the application of a voltage across the anode and cathode. The organic electroluminescent material includes an organo-siloxane polymer having a main chain comprising anthracene and/or pentacene. The anthracene or pentacene can be substituted optionally with hydrogen, alkyl, aryl, heteroalkyl, heteroaralkyl, nitro, cyano, hydroxy, alkoxy, aryloxy, thio, alkylthio, arylthio, amino, halogen, dialkylamino, diarylamino, diaralkylamino, arylamino, alkylamino, arylalkylamino, carbonyloxy, carbonylalkoxy, carbonylalkyloxy, alkylcarbonyloxy, arylcarbonyloxy, alkoxylcarbonyloxy, sulfonyl, sulfonyloxy, alkyl bonded to the adjacent silicon atom of the organo-siloxane polymer, aryl bonded to the adjacent silicon atom of the organo-siloxane polymer, or the adjacent silicon atom of said organo-siloxane polymer.

Organic electroluminescent materials and devices made from such materials

The present invention provides a method for chemically-mechanically polishing a substrate comprising tantalum and a conductive metal (other than tantalum). The method comprises (a) applying to the substrate a conductive metal-selective polishing composition and a metal oxide abrasive, (b) selectively removing at least a portion of the conductive metal as compared to the tantalum from the substrate, (c) applying to the substrate a tantalum-selective polishing composition and a metal oxide abrasive, and (d) removing at least a portion of the tantalum as compared to the conductive metal from the substrate. In one embodiment, the conductive metal-selective polishing composition is any such polishing composition, and the tantalum-selective polishing composition comprises a persulfate compound and a passivation film-forming agent for the conductive metal. In another embodiment, the conductive metal-selective polishing composition comprises a persulfate compound and optionally a passivation film-forming agent for the conductive metal, and the conductive metal-selective polishing composition or the polishing process is adjusted to render the conductive metal-selective polishing composition a tantalum-selective polishing composition, such as described above.

Chemical-mechanical polishing method

Precursor materials useful for making organic electroluminescent devices such as anthracene derivatives having the structure: ##STR1## R.sub.40 -R.sub.43 and R.sub.44 -R.sub.47 are selected independently from the group consisting of hydrogen, alkyl, aryl, heteroalkyl, heteroaralkyl, nitro, cyano, hydroxy, alkoxy, aryloxy, thio, alkylthio, arylthio, amino, halogen, dialkylamino, diarylamino, diaralkylamino, arylamino, alkylamino, arylalkylamino, carbonyloxy, carbonylalkoxy, carbonylalkyloxy, alkylcarbonyloxy, arylcarbonyloxy, alkoxylcarbonyloxy, sulfonyl, sulfonyloxy. R.sub.48 and R.sub.49 are selected independently from the group consisting of trialkoxysilyl, dialkoxysilyl, trichlorosilyl, dichlorosilyl, heptachlorotrisiloxy, and pentachlorodisiloxy.

Useful precursors for organic electroluminescent materials and devices

New organic light-emitting diodes and related electroluminescent devices and methods for fabrication, using siloxane self-assembly techniques.

Growing community of inventors

Schaumburg, IL, United States of America

Homer Z Chou