Nitto-Denko Corporation

Hitoshi Ishizaka

Atsushi Hino

Hirofumi Fujii

Eiji Toyoda

Yoshio Terada

Makoto Namikawa

Kei Nakamura

Kazuo Ouchi

Masao Nakamura

Kanji Nishida

Yasuhiro Amano

Daisuke Uenda

Masayuki Kaneto

Gosei Uemura

Chiaki Harada

Jirou Nukaga

Tokio Fujita

Toshihiko Tomita

Toshio Nakajima

Nobuaki Maruoka

Toshiaki Iwamoto

Tadanori Michimoto

Taizo Sasaki

Mamoru Hondo

Yoshihisa Mori

Asami Funatsu

A cleaning sheet for cleaning foreign matters away from the interior of the substrate processing equipment is provided. The cleaning sheet includes a cleaning layer having substantially no tackiness and having a tensile modulus of not lower than 0.98 N/mmas determined according to JIS K7127. Alternatively, the cleaning sheet includes a cleaning layer having a Vickers hardness of not lower than 10 MPa.

Cleaning sheet, conveying member using the same, and substrate processing equipment cleaning method using them

The present invention provides, as a separator for fuel cell which is lightweight, can be easily made thin, and which has superior corrosion resistance and shape stability, a fuel cellcontaining a separator for fuel cell, wherein a conductor patternis formed on one principal planeA of an insulation layerto form a groove for a gas flow pathsectioned by the conductor patternon this principal plane, a conductor terminalis formed on the other principal planeB of the insulation layer, and this conductor terminaland the conductor patternare electrically connected by a via holepenetrating the insulation layer, and a membrane electrode assembly (complex having an electrolyte membrane and an electrode (fuel electrode, oxygen electrode) laminated thereon)having the separator for fuel cell disposed on both surfaces.

Separator for fuel cell and fuel cell using the same

A wired circuit board is provided having a high-reliability conductive pattern formed thereon and mounting an electronic component thereon with high accuracy, and a method is provided for manufacturing the wired circuit board and mounting the electronic component thereon. An insulating layer including a mounting portion is formed on a metal supporting layer having a specular gloss of 150 to 500% at an incidence angle of 45&#xb0;. A conductive pattern is formed on the insulating layer. By a reflection-type optical sensor, a defective shape of the conductive pattern is inspected. Then, an opening is formed by etching the portion of the metal supporting layer which is overlapping the mounting portion such that the mounting portion of the insulating layer exposed by etching has a haze value of 20 to 50%, whereby a TAB tape carrier is obtained. Thereafter, an electronic component is aligned with the mounting portion by a reflection-type optical sensor such that the electronic component is mounted on the mounting portion.

Wired circuit board and method for manufacturing wired circuit board and mounting electronic component thereon

A striped tape carrier for TAB includes a plurality of mounting parts. In the respective mounting parts, wiring patterns to bond electrodes of electronic components are formed. Each of exposure regions includes a predetermined number of mounting parts. On both sides of each of the exposure regions, alignment marks and identification marks are formed. The alignment marks are used for alignment during the exposure. The identification marks are used for specifying positions of the respective exposure regions on the tape carrier.

Tape carrier for TAB

In a separate process from a boring process, the prealignment is performed beforehand on the circuit board, employing an alignment device, to create the positional data indicating the position of boring the hole in a pattern within the circuit board. In the boring process, the circuit board is carried into the working apparatus. The panel alignment is made on the circuit board. The positional data for positioning the circuit board on a table of the working apparatus is created. The synthesis of the positional data created by the prealignment and the positional data created by the panel alignment is performed to calculate the boring position of the circuit board on the table. The hole is bored at the calculated position in the circuit board, employing a boring machine of the working apparatus. Thereafter, the circuit board is carried out from the working apparatus.

Boring method for circuit board

An ultraviolet beam with high energy density is applied for forming an opening in an electric conductor layer in a flexible wiring board whereas an ultraviolet beam with low energy density is applied for forming an opening in an electrically insulating layer in the flexible wiring board. As a result, excessive heat energy applied for forming a via hole can be reduced, so that the problems can be reduced. In this manner, high quality of the via hole and delicate and accurate processability due to use of the ultraviolet laser beam can be combined to achieve formation of fine patterns densely in the flexible wiring board.

Method for forming a via hole, flexible wiring board using the method, and method for producing the flexible wiring board

A flexible wiring board that can bridge wires and also can prevent production of conductive foreign materials in use, to secure good performance of a magnetic head. The flexible wiring board for connecting therethrough a suspension substrate having mounted thereon a magnetic head of a hard disk drive and a control circuit substrate for actuating the magnetic head includes a short-circuit forming portion for forming a shorting portion for bridging wires to prevent electrostatic destruction of the magnetic head; and a cut for removing the shorting portion. When the flexible wiring board is cut along the cut, the shorting portion can be removed without producing conductive foreign material resulting from the cutting off of the shorting portion.

Flexible wiring board

A method is disclosed for removing a decomposition residue and/or a processing residue, of a material of a resin layer, which is attached to the periphery and inside of holes formed in the resin layer of a printed board. The method provides shooting a laser beam having a wavelength for laser ablation at the holes to thereby remove the decomposition residue and/or the processing residue; reshaping the sectional shape perpendicular to the direction of advance of the laser beam by beam reshaping optics; and shooting the reshaped laser beam to shoot simultaneously all the holes formed in the resin layer and vicinity thereof, wherein the total irradiated area on the printed board is 200%-10,000% of the total sectional area of the holes formed in the printed board. Also disclosed is a method for producing a printed board having holes that provides for: forming holes in a resin layer of a printed board by laser processing and removing a decomposition residue and/or a processing residue, of a material of the resin layer, which is attached to the periphery and inside of the holes.

Method for removing residue and method for production of printed board having hole

A method for fabrication of a probe structure comprising a circuit substrate comprising a circuit pattern formed on one side or inside of an insulating substrate and a positioning member formed on either side of said insulating substrate, said positioning member being capable of positioning and retaining a test target at a testing position of the probe structure, and the circuit pattern and the positioning member being in a positional relationship which establishes a continuity between the circuit pattern and a bump contact, which method comprises determining, on the same side of the substrate on which the positioning member has been formed, the position of the bump contact according to the position of the positioning member as a reference position, and forming the bump contact capable of establishing continuity with the circuit pattern. According to the method of the present invention, a probe structure can be obtained which is capable of positioning bump contacts and test target highly accurately as compared to conventional methods. In addition, since conventional production method can be applied to the manufacture of positioning member and bump contacts, highly precise products can be produced economically. The circuit substrate of the present invention which comprises a positioning member can be beneficially used for the production of the probe structure of the present invention.

Method for fabrication of probe structure and circuit substrate therefor

Composite tubular article and process for producing the same

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Ibaraki, Japan

Hitoshi Ishizaka