Shin-etsu Handotai Co., Ltd.

Fujikoshi Machinery Corp.

Rodel Nitta Company

Hisashi Masumura

Hideo Kudo

Kiyoshi Suzuki

Teruaki Fukami

Tadahiro Kato

Fumio Suzuki

Kouichi Okamura

Hiromasa Hashimoto

Masami Nakano

Hiromi Kishida

Kouji Morita

Satoru Arakawa

Naotaka Toyama

Kouzi Morita

Koji Kitagawa

Noboru Tamai

Sunao Shima

Makoto Kobayashi

Junichi Ueno

Kazuya Tomii

Sadayuki Okuni

Tsutomu Takaku

Kouichi Tanaka

Shingo Sumie

Kouji Kitagawa

Norimichi Tanaka

Noritaka Morioka

Shigeyoshi Netsu

Mamoru Okada

Hidetoshi Tsunaki

Hideki Munakata

Yasuharu Ariga

Takahiro Matsuda

Yuji Hirao

Kouzi Kitagawa

Syunichi Ogasawara

Toshimasa Kubota

Shigenao Ito

Atsuto Sakata

Teppei Nakata

Kenichi Anzai

Yuhei Fukazu

Kenichi Inoue

Takashi Matsuoka

An epitaxial wafer cleaning method for cleaning a wafer having an epitaxial film formed on a front surface thereof, including: a first cleaning step of supplying a cleaning solution containing Oto all surfaces, including front, back, and end surfaces, of the wafer to perform spin cleaning; a second cleaning step of supplying a cleaning solution to the back and end surfaces of the wafer to perform cleaning with a roll brush after the first cleaning step; a third cleaning step of supplying a cleaning solution containing Oto the front surface of the wafer to perform spin cleaning after the second cleaning step; and a fourth cleaning step of supplying a cleaning solution containing HF to the front surface of the wafer to perform spin cleaning after the third cleaning step.

Epitaxial wafer cleaning method

The present invention provides a polishing head including: an annular rigid ring; an elastic film bonded to the rigid ring; and an upward and downward movable mid-plate, the mid-plate defining a first sealed space together with the rigid ring and the elastic film; an incompressible fluid enclosed in a sealed space; and a mid-plate positioning device for adjusting vertical position of the mid-plate, to hold a back surface of a workpiece on a lower surface of the elastic film and polish a front surface by bringing the front surface into contact with a polishing pad attached to a turn table, wherein the mid-plate can adjust a shape of the lower surface of the elastic film by adjusting the vertical position of the mid-plate. The polishing head polishes a workpiece without generating surface defects on the workpiece surface and easy detachment of the workpiece from a polishing pad after polishing.

Polishing head and polishing apparatus

A polishing head for holding a workpiece when a surface of the workpiece is polished and a polishing apparatus provided with the polishing head, and more particularly a polishing head for holding the workpiece on a rubber film and a polishing apparatus provided with the polishing head. The polishing head and the polishing apparatus provided with the polishing head that can adjust the polishing profile on the basis of the shape of the workpiece before polishing and can stably obtain good flatness.

A polishing head having a disklike carrier in which an annular projecting portion and a carrier-engagement portion are formed in a peripheral portion, a disklike head body in which a head-body-engagement portion is formed outside, a diaphragm for connecting the head body with the carrier, a spacer located between the carrier-engagement portion and the head-body-engagement portion in a part of the carrier-engagement portion and/or the head-body-engagement portion, in which the spacer abuts on the carrier-engagement portion and/or the head-body-engagement portion at the time of lifting the head body so that the workpiece is demounted from the polishing pad by lifting the carrier with it inclined. As a result, there is provided a polishing head in which the workpiece can be easily, safely and surely demounted from the polishing pad by lifting the polishing head holding the workpiece without overhanging the polishing head from the turn table and the like.

Polishing head, polishing apparatus and method for demounting workpiece

A workpiece holder for polishing includes a workpiece holder body having multiple perforated holes to hold a workpiece by vacuum suction. A holding surface of the workpiece holder body may be coated with resin. A coefficient of thermal expansion of the resin coating on the holding surface may be 1&#xd7;10/K or less. The resin coating on the holding surface may be epoxy resin filled with silica particles.

Workpiece holder for polishing, workpiece polishing apparatus and polishing method

The present invention is a polishing head provided with an annular rigid ring, a rubber film bonded to the rigid ring with a uniform tension, a mid plate joined to the rigid ring and forming a space portion together with the rubber film and the rigid ring, and an annular template provided concentrically with the rigid ring in a peripheral portion on a lower face part of the rubber film and having an outer diameter larger than an inner diameter of the rigid ring, in which a pressure of the space portion can be changed by a pressure adjustment mechanism, a back face of a work is held on the lower face part of the rubber film, and a surface of the work is brought into sliding contact with the polishing pad attached onto a turn table for performing polishing, and an inner diameter of the template is smaller than an inner diameter of the rigid ring, and a ratio between an inner diameter difference between the rigid ring and the template and a difference between the inner diameter and an outer diameter of the template is 26% or more and 45% or less. Thereby, a polishing head and the like that can obtain constant flatness stably can be provided.

The present invention is a polishing head in which a rubber film is formed in a boot shape in such a manner that a position where the rubber film is held by a mid plate is distantly positioned from a work holding portion; an end portion of the boot shaped rubber film is formed in O-ring shape so that the rubber film is held by the mid plate with decreasing an area of contact between the mid plate and the rubber film as much as possible. As a result, there is provided a polishing head with rubber chuck method in which an occurrence of a surface defect, such as a scratch, on a surface of the work is suppressed as much as possible and the work can be uniformly and stably polished to the outer periphery.

Polishing head and polishing apparatus having the same

The present invention provides a polishing headcomprising a carrier, a guide ring, a dress ring, and a head body, wherein the head bodyis rotatable, and holds the carrier, the guide ring, and the dress ring; the head bodyhas a reversed-bowl shape and has a hollow; the dress ring, and at least the guide ring or the carrier are held by being coupled to a lower brim of the head body via a diaphragm; the hollow of the head body is sealed. During polishing, the pressure of the sealed hollow is adjusted with a pressure regulating mechanismcommunicating with the hollow, thereby elastically deforming the diaphragm. As a result, a wafer W can be polished while the wafer and the dress ring are pressed with a given pressing force against a polishing padon a turn tablewith rotating the wafer held by the carrier and the dress ring. Consequently, there is provided a polishing head or the like with which excessive polishing in the outer periphery of a semiconductor wafer can be prevented and generation of impressions or scratches in the edge portion of the wafer can be prevented effectively.

Polishing head, polishing apparatus and polishing method for semiconductor wafer

A method for polishing a wafer effectively preventing a sag in an outer peripheral portion of a wafer and a polishing pad for polishing a wafer preferably used in the method for polishing a wafer are provided. The method for polishing a wafer comprises the step of: mirror-polishing a wafer with a main surface of the wafer being in contact with a polishing pad of non-woven fabric impregnated with resin, wherein a ratio of surface roughness of the polishing pad to compressibility thereof {surface roughness Ra (&#x3bc;m)/compressibility (%)} is 3.8 or more.

Method and pad for polishing wafer

The present invention provides a wafer manufacturing method and a wafer polishing apparatus which enable control of sags in a periphery of a wafer and improvement of nanotopology values thereof that is strongly required recently, and a wafer. In a polishing process for making a mirror surface of the wafer, a back surface of the wafer is polished to produce a reference plane thereof.

Wafer manufacturing method, polishing apparatus, and wafer

The present invention is a workpiece holder for polishing comprising at least a workpiece holder body having multiple perforated holes for holding a workpiece by vacuum adsorption and a back plate disposed on the back side of the body, which is provided with temperature controlling means or cooling means for the holder body. Thus, there is provided a workpiece holder for polishing, a polishing apparatus and a polishing method, which can provide a workpiece having good flatness by suppressing thermal deformation of the workpiece holder body and deformation of a resin film coated on the workpiece holding surface without degrading flatness of a workpiece held on the workpiece holder in the polishing of the workpiece, even when the number of polishing operation increases.

Workpiece holder for polishing, polishing apparatus and polishing method

The present invention provides a process for manufacturing a semiconductor wafer capable of effectively reducing unevenness having a wavelength of 0.5 mm or more which remains on a surface of the semiconductor wafer after a first polishing step and improving flatness thereof; and a semiconductor wafer manufactured by the manufacturing process. The manufacturing process comprises: plural polishing steps including a first polishing step and a final polishing step; and a corrective polishing step performed after the first polishing step using a polishing cloth harder than that used in the first polishing step.

Process for manufacturing semiconductor wafer and semiconductor wafer

Provided are a wafer polishing method in which, in single side polishing, covering a wafer holding surface (one side surface) with a protective film, a wafer polishing surface (the other side surface) is polished, so that the wafer holding surface can be prevented from being etched and contaminated by a polishing agent; a wafer cleaning method in which the protective film that remains behind on the wafer holding surface after polishing can be efficiently removed, and a waste cleaning solution is easily treated; and a wafer protective film that sufficiently covers the wafer holding surface in polishing but is effectively removed in cleaning. In a wafer polishing method in which a wafer holding surface of one side surface of a wafer is held and a wafer polishing surface of the other side surface thereof is polished while dripping a polishing agent, the wafer polishing surface is polished while covering the wafer holding surface with a synthetic resin protective film of etching resistance against the polishing agent, good adhesiveness to the wafer and a property easy to peel off from the wafer after polishing.

Wafer polishing method, wafer cleaning method and wafer protective film

A workpiece holder for polishing comprising a workpiece holder body which is provided with multiple perforated holes for holding a workpiece by vacuum suction and a holder back plate which is closely contacted with a back face of the holder body and has grooves for vacuum, wherein the holder back plate is composed of a synthetic resin and has an Asker C hardness of 70 or higher but lower than 98, and an apparatus for polishing a workpiece and a method for polishing a workpiece utilizing it. By improving the material of holder back plate of a workpiece holder for polishing that holds a workpiece by vacuum suction to enhance sealing with the holder body, thereby developing such a holder back plate that should not transfer deformation of the holder body to the workpiece surface, even if polishing agent slurry is introduced and solidified, to provide a workpiece holder for polishing having a workpiece holding surface of high precision, an apparatus for polishing a workpiece and a method for polishing a workpiece.

Workpiece holder for polishing, apparatus for polishing workpiece and method for polishing workpiece

There is disclosed a method of processing a work comprising polishing a work holding surface of a work holding plate by contacting and rubbing a work holding surface of a work holding plate with a polishing pad attached on a polishing turn table with providing polishing agent thereto, holding a wafer W on said work holding surface by vacuum-holding, and contacting and rubbing the wafer W with said polishing pad to polish the work with providing polishing agent wherein temperature of the polishing agent or the polishing turn table is controlled by temperature controller so that a temperature of said work holding surface when polishing said work holding plate and a temperature of said work holding surface when polishing the wafer w are controlled to be the same. Degradation of flatness due to thermal influence when polishing the holding plate and polishing the wafer can be prevented in a method of processing comprising polishing the work holding surface of the work holding plate to conform with the deformed shape of the polishing pad, holding a work with the work holding surface, and polishing the work.

Method and apparatus for polishing work

Growing community of inventors

Fukushima, Japan

Hisashi Masumura