Tokyo Electron Limited

Hisashi Higuchi

Kandabara N Tapily

Gerrit J Leusink

Cory Wajda

Kai-Hung Yu

Yoshihiro Takezawa

Kazuyoshi Matsuzaki

Ayuta Suzuki

Gyanaranjan Pattanaik

Yuji Seshimo

Taiki Kato

Kosuke Yamamoto

Susumu Takada

Robert Clark

Embodiments of methods are provided for thermal dry etching of a ruthenium (Ru) metal layer. In the disclosed embodiments, a substrate containing a Ru metal layer formed thereon is exposed to a gas pulse sequence, while the substrate is held at a relatively high substrate temperature (e.g., a temperature greater than or equal to about 160° C.), to provide thermal etching of the Ru metal layer. As described further herein, the gas pulse sequence may generally include a plurality of gas pulses, which are supplied to the substrate sequentially with substantially no overlap between gas pulses. The gas pulses supplied to the substrate form: (i) volatile reaction products that are vaporized from the Ru surface, and (ii) non-volatile oxide surface layers that are removed from the Ru surface by the next gas pulse, resulting in atomic layer etching (ALE) of the Ru metal layer.

Thermal etching of ruthenium

A method of manufacturing a semiconductor device having a metal oxide film with workpiece accommodated in a chamber, includes: supplying a precursor gas containing a metal complex into the chamber to form a precursor layer on the workpiece from the precursor gas; supplying an oxidizing gas into the chamber to oxidize the precursor layer so that a metal oxide layer is formed, the oxidizing gas being a gas containing HO or a gas having a functional group containing hydrogen atoms in the metal complex and containing an oxidant to generate HO by reaction with the functional group; supplying an HO removal gas containing alcohols or amines into the chamber to remove HO adsorbed onto the metal oxide layer; and executing a plurality of cycles each including the supplying a precursor gas and the supplying an oxidizing gas. At least some of the cycles includes the supplying an HO removal gas.

Method of manufacturing semiconductor device and method of forming metal oxide film

Growing community of inventors

Nirasaki, Japan

Hisashi Higuchi