Tokyo Ohka Kogyo Co., Ltd.

Hisanobu Harada

Yasushi Fujii

Daisuke Kawana

Toshimasa Nakayama

Hidekatsu Kohara

Kazufumi Sato

Tomotaka Yamada

Toshikazu Takayama

Taku Nakao

Shinichi Hidesaka

Naoki Yamashita

Isamu Takagi

Hayato Ohno

Shinichi Kohno

Koji Yonemura

A photosensitive resin composition which has a quenching function and satisfactory long-term stability and which, in particular, can be prevented from suffering sensitivity abnormality caused by change with time during storage (change from given sensitivity); and a method of forming a pattern from the composition. The resist composition contains a base resin comprising, as the main component, a silicon-containing polymer which is a siloxane or silsesquioxane polymer or the like, the composition containing, as a quencher, a specific sulfonium compound in place of a nitrogenous compound.

Photosensitive resin composition and method of forming pattern

A method of forming a pattern including: forming an underlayer film on a support using an underlayer film-forming material, forming a hard mask on the underlayer film using a silicon-based hard mask-forming material, forming a first resist film by applying a chemically amplified positive resist composition to the hard mask, forming a first resist pattern by selectively exposing the first resist film through a first mask pattern and then performing developing, forming a first pattern by etching the hard mask using the first resist pattern as a mask, forming a second resist film by applying a chemically amplified positive silicon-based resist composition to the first pattern and the underlayer film, forming a second resist pattern by selectively exposing the second resist film through a second mask pattern and then performing developing, and forming a second pattern by etching the underlayer film using the first pattern and the second resist pattern as a mask.

Method of forming pattern

A thermoacid generator for antireflective film formation, characterized by being represented by the following formula (1): (wherein Rrepresents Calkyl, alkenyl, oxoalkyl, or oxoalkenyl (hydrogen atoms in these groups may have been replaced with fluorine atoms); Rrepresents linear, branched, or cyclic Calkyl, alkenyl, oxoalkyl, or oxoalkenyl, Caryl, or Caralkyl or aryloxoalkyl; Rrepresents hydrogen or alkyl; and Yrepresents a non-nucleophilic counter ion); a composition for forming an antireflective film; and an antireflective film made from the composition. With the thermoacid generator and composition, satisfactory etching resistance and the satisfactory ability to prevent the reflection of short-wavelength light (ability to absorb short-wavelength light) are attained. Furthermore, the antireflective film can inhibit an overlying photoresist film from generating a scum.

Thermoacid generator for antireflection film formation, composition for antireflection film formation, and antireflection film made therefrom

A positive photoresist coating solution comprising (a) an alkali-soluble resin, (b) a quinone diazide group-containing compound, and (c) an organic solvent in an amount sufficient for dissolving said (a) and (b) components, wherein said organic solvent contains (i) propylene glycol monopropyl ether and (ii) 2-heptanone. The solution of the present invention exhibits excellent coating ability, sensitivity, thermostability, focal depth range, shape-profiling ability, and the like.

Positive photoresist coating solution comprising a mixed solvent of

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Kawasaki, Japan

Hisanobu Harada