Ebara Corporation

Hisajiro Nakano

Tomoatsu Ishibashi

Junji Kunisawa

Koji Maeda

Koichi Fukaya

Hiroshi Shimomoto

Yoshitaka Kitagawa

Mitsuru Miyazaki

Yusuke Watanabe

Yasuyuki Motoshima

Takahiro Ogawa

Takuya Inoue

Yoichi Shiokawa

Fumitoshi Oikawa

Masayoshi Imai

Shinji Kajita

Yohei Eto

Michiaki Matsuda

Fuyuki Ogaki

The disclosure provides one technique for suppressing wear of a cleaning member and unexpected dust generation. A substrate support mechanismincludes a first support partwhich is swingable and has a contact region that can come into contact with a peripheral edge of one surface of a substrate W in a closed state, a second support partwhich supports the other surface of the substrate W, and a first support part moving partwhich swings the first support part

Substrate support mechanism, substrate cleaning device and substrate processing method

A cleaning device includes: a plurality of rollers that hold a peripheral edge part of a substrate; a rotation driving unit that rotates the substrate by rotationally driving the plurality of rollers; a cleaning member that abuts on the substrate and cleans the substrate; a cleaning liquid supply nozzle that supplies a cleaning liquid to the substrate; a microphone that detects a sound generated when a notch of the peripheral edge part of the substrate hits the plurality of rollers; and a rotation speed calculation unit that calculates a rotation speed of the substrate on the basis of the sound detected by the microphone.

Cleaning device, polishing device, and device and method for calculating rotation speed of substrate in cleaning device

A cover for a swing member of a substrate processing apparatus includes an upper surface including a first groove, and a first side edge and a second side edge located respectively at both ends of the upper surface in the short-length direction of the cover, where a bottom portion of the first groove is located lower than the first side edge and the second side edge.

Cover for swing member of substrate processing apparatus, swing member of substrate processing apparatus, and substrate processing apparatus

A substrate cleaning apparatus and related apparatuses/methods are disclosed. In one embodiment, a substrate cleaning apparatus includes: a first spindle group including a first driving spindle having a first driving roller configured to rotate a substrate and an idler spindle having a driven roller rotated by the substrate; a second spindle group including a plurality of second driving spindles each having a second driving roller configured to rotate the substrate; a cleaning mechanism configured to clean the substrate rotated by the first driving roller and the plurality of second driving rollers; and a rotation detector configured to detect the rotational speed of the driven roller. The driven roller is positioned on the opposite side to a direction in which the substrate receives a force from the cleaning mechanism.

Substrate cleaning apparatus, substrate processing apparatus, and method of cleaning substrate

Various methods of cleaning a substrate are provided. In one aspect, method of cleaning a substrate, comprising: holding and rotating a substrate by a substrate holder; and supplying a chemical liquid to a chemical liquid nozzle and supplying two fluids to a two-fluid nozzle while moving the chemical-liquid nozzle and the two-fluid nozzle radially outwardly from the center to the periphery of the substrate, wherein the distance of the chemical-liquid nozzle from a rotating axis of the substrate holder is longer than the distance of the two-fluid nozzle from the rotating axis of the substrate holder while the chemical-liquid nozzle and the two-fluid nozzle are moved radially outwardly from the rotating axis of the substrate holder.

Method of cleaning a substrate

A substrate cleaning apparatus includes a substrate holding mechanism holding the substrate, a rotation mechanism rotating the substrate held by the substrate holding mechanism, and a cleaning mechanism cleaning the substrate. The cleaning mechanism includes a support column, an arm extending from the support column and having a fixed height position, a cleaning tool supported by the arm and cleaning a surface of the substrate by contacting the surface, a lift mechanism moving the cleaning tool vertically with respect to the arm between an raised position separated from the substrate and a lowered position in contact with the substrate, and a controller controlling at least a speed at which the cleaning tool descends.

Substrate cleaning apparatus and substrate cleaning method

A storage container of a scrub member includes a container main body and a lid body engaging with the container main body, where the scrub member is accommodated in an internal portion of the storage container surrounded by the container main body and the lid body, and a ventilation groove which communicates the internal portion of the storage container and an outside of the storage container is formed on an engagement surface where the container main body and the lid body are engaged.

Storage container of scrubbing member and package of same

An apparatus for cleaning a substrate has a holding unitthat holds a substrate W; a rotated unitconnected to the holding unit; a rotating unitthat is provided on a peripheral outer side of the rotated unitand rotates the rotated unit; and a cleaning unitthat physically cleans the substrate W held by the holding unit

Apparatus for cleaning substrate and substrate cleaning method

A substrate washing device includes a substrate holding mechanismthat holds a substrate W, a substrate rotating mechanismthat rotates the substrate W held by the substrate holding mechanism, and a two-fluid nozzlethat ejects a two-fluid jet toward a surface of the rotating substrate W. The two-fluid nozzleis formed of a conductive material. Accordingly, the electrification amount of droplets ejected as the two-fluid jet from the two-fluid nozzlecan be suppressed.

Substrate washing device

A substrate cleaning apparatus for bringing an elongated roll cleaning member into sliding contact with a flat plate type substrate to perform cleaning processing on the substrate includes a roll holder for supporting the roll cleaning member so that the roll cleaning member is rotatable, an elevating mechanism that has a linking member for supporting the roll holder, and moves the roll holder up and down so that the roll cleaning member applies a predetermined roll load to the substrate, a sensor member that is provided to the linking member and measures frictional force between the roll cleaning member and the substrate, and a controller for performing feedback control on the frictional force between the roll cleaning member and the substrate based on a measured value of the sensor member.

Substrate cleaning apparatus and substrate processing apparatus X

A substrate cleaning apparatus capable of preventing a cleaning vessel from being corroded by a chemical liquid while constituting the cleaning vessel with a low-price material is provided. The substrate cleaning apparatus includes: a cleaning vessel for holding a substrate therein; a substrate holder arranged in the cleaning vessel; a chemical liquid nozzle for supplying a chemical liquid onto the substrate held by the substrate holder; and a plurality of cleaning liquid nozzles for supplying a cleaning liquid onto an inner surface of the cleaning vessel. The inner surface of the cleaning vessel has been subjected to a hydrophilization treatment.

Substrate cleaning apparatus and polishing apparatus

A substrate processing apparatus is used for a spin drying apparatus, a pencil-type scrubbing cleaning apparatus, an IPA drying apparatus and the like, which are used as semiconductor wafer processing apparatuses. The substrate processing apparatus includes a substrate stage and a substrate chuck mechanism. The substrate chuck mechanism includes a chuck body having a substrate placing portion configured to place a peripheral portion of a substrate and a guide surface configured to guide an outer circumferential end surface of the substrate and to position the substrate when the substrate is placed on the substrate placing portion, and a chuck claw rotatably supported on the chuck body and configured to hold the peripheral portion of the substrate between the substrate placing portion and the chuck claw by turning the chuck claw inward in a closing direction. The guide surface comprises a first guide surface and a second guide surface which guide the outer circumferential end surface of the substrate and differ in inclinations from each other.

Growing community of inventors

Tokyo, Japan

Hisajiro Nakano