Canon Kabushiki Kaisha

Hiroyuki Otsuka

Makoto Higomura

Michio Horikoshi

Kotaro Hosaka

A fabrication method for an electron source substrate comprises: a measurement step wherein at least one of a substrate, having a plurality of pairs of electrodes on the surface thereof, and measurement means for measuring the position of the substrate in at least one direction of the mutually orthogonal XYZ directions, is scanned relatively in one direction, thereby measuring the substrate position; a control step for controlling the discharge position of droplets containing electroconductive thin-film material onto the substrate from an ink-jet head, based on the measurement results; and a discharge step for discharging the droplets between the pairs of electrodes while relatively scanning at least one of the ink-jet head and substrate in one direction; wherein the scanning direction in the measurement step and the scanning direction in the discharge step are generally parallel; and wherein the measurement step and the discharge step are performed in a single scan.

Fabrication method for electron source substrate

Control method and apparatus for positioning an X-ray stage which is movable in X and Y directions to move a semiconductor wafer, for example, in a stepper wherein a pattern formed in the mask is sequentially printed on the shot areas of a semiconductor wafer in a step-and-repeat manner. The X-Y stage is provided with a wafer chuck supported by means of a tilting stage to control the tilting of the wafer chuck relative to the X-Y plane. In order to detect the position of the wafer chuck in the X and Y directions, the inclination of a laser interferometer mirror provided integrally with the wafer chuck relative to the X-Y plane can be detected. By this, when a positioning error for the X-Y stage occurs due to the Abbe length, in the Z direction, between the wafer supporting surface of the wafer chuck and the point in the mirror at which the laser beam from the laser interferometer is incident and due to the pitching and rolling of the X-Y stage, the error is detected on the basis of the attitude change by the movement of the X-Y stage, and is corrected.

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Ibaraki, Japan

Hiroyuki Otsuka