Sekisui Chemical Co., Ltd.

Hiroya Ishida

Takeshi Wakiya

Shinya Uenoyama

Kiyoto Matsushita

The boron nitride nanomaterial of the present invention is a boron nitride nanomaterial comprising a boron nitride nanotube and a boron nitride nanosheet, and having a peak top of a Raman spectrum located at 1369 cmor more.

Boron nitride nanomaterial and resin composition

The present invention aims to provide electroconductive microparticles which are less likely to cause disconnection due to breakage of connection interfaces between electrodes and the electroconductive microparticles even under application of an impact by dropping or the like and are less likely to be fatigued even after repetitive heating and cooling, and an anisotropic electroconductive material and an electroconductive connection structure each produced using the electroconductive microparticles. The present invention relates to electroconductive microparticles each including at least an electroconductive metal layer, a barrier layer, a copper layer, and a solder layer containing tin that are laminated in said order on a surface of a core particle made of a resin or metal, the copper layer and the solder layer being in contact with each other directly, the copper layer directly in contact with the solder layer containing copper at a ratio of 0.5 to 5% by weight relative to tin contained in the solder layer.

Electroconductive microparticles, anisotropic electroconductive material, and electroconductive connection structure

It is the object of the present invention to provide a conductive particle which has excellent adhesion between a base particle and a conductive layer, a conductive layer being resistant to breaking, impact resistance being improved, and an anisotropic conductive material using the conductive particle. The prevent invention is a conductive particle, which comprises a base particle and a conductive layer formed on a surface of said base particle, said conductive layer having a non-crystal nickel plating layer in contact with the surface of said base particle and a crystal nickel plating layer, and a proportion of a nickel crystal grain aggregate oriented in a nickel (111) plane derived from an integrated intensity ratio in X-ray diffraction measurement being 80% or more.

Electroconductive fine particle and anisotropically electroconductive material comprising non-crystal and crystal nickel plating layers and method of making thereof

Conductive fine particles which prevent a leak current from being caused by conductive fine particles as a result of fine-pitched electrodes and are low in connection resistance and excellent in conduction reliability, and an anisotropic conductive material using the conductive fine particles. The conductive fine particles have the surfaces of base material fine particles covered with conductive films, with the conductive films provided on the surfaces thereof with swelling protrusions, wherein the swelling protrusions have an average height of at least 50 nm, the portions of swelling protrusions consist of, as a core material, conductive materials different from those of the conductive films, and the outer peripheries of the conductive fine particles are provided with insulating coating layers or insulating fine particles, preferably the thickness of the insulating coating layers being at least 0.2 nm, preferably an average particle size of the insulating fine particles being at least 30 nm and up to an average height of the protrusions; and the anisotropic conductive material having the conductive fine particles dispersed in its resin binder.

Conductive fine particles and anisotropic conductive material

A conductive particle having a low connection resistance, a small variation of conduction performance, and excellent conduction reliability and an anisotropic conductive material using such particles are disclosed. Conventional anisotropic conductive materials using conductive particles are used in the form that they are interposed between opposed boards or between opposed electrode terminals of electronic devices such as mobile telephones. However, as electronic devices have been recently developing, enhancement of the conduction reliability of the conductive particles used for the anisotropic conductive materials have been required. The surface () of the base particle of a conductive particle () of the invention used for an anisotropic conductive material is covered with a conductive film or films (). The conductive particle () has projections (b) projecting from the conductive film or films. A core material ()for projecting the surface of the conductive film is provided on the surface of the base particle. The core material () is different from the conductive material of the conductive films. By thus using such conductive particles, the conduction reliability is enhanced.

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Kouka, Japan

Hiroya Ishida