Sumitomo Chemical Company, Limited

Hirotoshi Nakanishi

Yasunori Uetani

Jun Tomioka

Koji Kuwana

Ryotaro Hanawa

Fumio Oi

Makoto Hanabata

Ayako Ida

Yukio Hanamoto

Yasunori Doi

Naoko Suzuki

Isao Yoshida

Naoki Takeyama

Takeshi Hioki

Yoshiyuki Takata

Hiroshi Moriuma

Hiroshi Yamachika

Fujio Masuko

Hiroshi Takagaki

Hideaki Suda

Tatsumi Nuno

Hiroshige Tomita

Kyouko Nagase

Tatsuo Kanda

Hiromu Hida

Seiichi Akutsu

Masayuki Maeyashiki

Keiji Kagawa

Naoya Kanda

The present invention provides a chemical amplification type positive resist composition comprising  

Chemical amplification type resist composition

A polyhydric phenol compound of the formula: ##STR1## wherein R.sub.1 to R.sub.5 are independently a hydrogen atom, an alkyl group, an alkenyl group, a cycloalkyl group or an aryl group, provided that at least one of R.sub.1 and R.sub.2 is an alkyl group, an alkenyl group, a cycloalkyl group or an aryl group, and its quinone diazide sulfonate which gives a positive resist composition having improved sensitivity and a good depth of focus.

Polyhydric phenol compound and positive resist composition comprising

A bislactone compound represented by the general formula (I): ##STR1## wherein R.sub.1 and R.sub.2 each independently represent a hydrogen atom or an alkyl group having 6 or less carbon atoms, and R.sub.3, R.sub.4, R.sub.5 and R.sub.6 each independently represent a hydrogen atom, a hydroxy group or an alkyl group having 6 or less carbon atoms, which is useful as a stabilizer for polymers and as a raw material of a positive type resist:

Bislactone compound and a process for producing the same

A process for preparing the polyhydric phenol compounds represented by the formula (I): ##STR1## (wherein R.sub.1, R.sub.2 and R.sub.3 represent independently hydrogen atom, alkyl group, etc.) which comprises subjecting the compounds represented by the formula (II): ##STR2## (wherein R.sub.1, R.sub.2 and R.sub.3 are as defined above) to a condensation reaction with pyrogallol in the presence of an organic solvent and an acid catalyst.

Process for the preparation of polyhydric phenol compounds

A positive resist composition which comprises, in admixture, an alkali-soluble resin; at least one quinone diazide sulfonate of a polyhydric phenol compound of the formula: ##STR1## wherein R.sub.1 to R.sub.5 are independently a hydrogen atom, an alkyl group, an alkenyl group, a cycloalkyl group or an aryl group, provided that at least one of R.sub.1 and R.sub.2 is an alkyl group, an alkenyl group, a cycloalkyl group or an aryl group; and

Positive resist composition

A positive resist composition comprising an alkali-soluble resin containing a novolak resin which is obtained by a condensation reaction of a phenol compound and a carbonyl compound and has an area in a GPC pattern of a range in that a molecular weight as converted to polystyrene is not larger than 900 not exceeding 20% of a whole pattern area excluding the unreacted phenol compound, a quinonediazide compound and a polyphenol compound of the formula: ##STR1## in which R.sub.1 and R.sub.2 are independently a hydrogen atom, a halogen atom, an alkyl group, an alkoxy group or a group: --OCOR.sub.3 in which R.sub.3 is an alkyl group or a phenyl group, x and y are independently an integer of 1 to 3, and m is an integer of 0 to 4, wherein a weight ratio of said polyphenol compound (I) to said alkali-soluble resin is from 3:10 to 5:10, which is excellent in heat resistance, sensitivity, resolution and a depth of focus and leaves no scum after development.

Positive resist composition comprising a quinone diazide sulfonic acid

A positive resist composition comprising an alkali-soluble resin and a light-sensitive quinonediazide material containing a quinonediazidesulfonic acid diester of at least one member selected from the phenol compounds represented by the following general formulas: ##STR1## wherein R.sub.1 and R.sub.2 each represent hydrogen, halogen, --OCOR.sub.3, alkyl or alkoxy in which R.sub.3 represents alkyl or phenyl, x and y each represent 1, 2 or 3, and R, R.sub.o, R' and R.sub.o ' each represent hydrogen atom, alkyl or phenyl group; wherein the content of said diester is 50% or greater based on the total light-sensitive quinonediazide material. This composition is excellent in the balance between properties such as resolution, profile and depth of focus.

A positive resist composition comprising an alkali-soluble resin and a light-sensitive quinonediazide material containing a quinonediazidesulfonic acid ester of at least one phenol compound represented by the following general formulas: ##STR1## wherein R.sub.1 represents hydrogen, halogen, or the like; R.sub.3 represents alkyl or phenyl; x represents 1-3; Q.sub.1 to Q.sub.12 represent hydrogen, alkyl or phenyl; and Z.sub.1 to Z.sub.5 represent the groups of the following formulas: ##STR2## wherein R.sub.2 is hydrogen, halogen or the like; R.sub.3 is as defined above; y is 1-3; and p is 0 or 1. This positive resist composition is excellent in the balance between properties such as resolution, profile, depth of focus, etc.

A positive resist composition which comprises in admixture an alkali-soluble resin and, as a sensitizer, first and second quinone diazide sulfonic acid esters of a phenol compound, wherein

Resist composition comprising a quinone diazide sulfonic diester and a

A positive resist composition comprising an alkali-soluble resin, a quinone diazide compound and a specific hydroxyl group-containing compound can improve sensitivity without deterioration of heat resistance and film thickness retention.

A photoresist composition which comprises a compound of the general formula: ##STR1## wherein R.sub.1, R.sub.2 and R.sub.3 are the same or different and represent a hydrogen atom, a hydroxyl group, --OCOR.sub.4, --O--R.sub.5, --OSi(R.sub.6).sub.3, a halogen atom, an optionally substituted alkyl group, an optionally substituted alkenyl group, an optionally substituted phenyl group or an optionally substituted aralkyl group; R.sub.4, R.sub.5 and R.sub.6 represent an optionally substituted lower alkyl group or an optionally substituted phenyl group; X and Y are the same or different and represent --CN, --COOR.sub.7, --CONR.sub.8 R.sub.9, ##STR2## R.sub.7 represents an alkyl group; R.sub.8 and R.sub.9 are the same or different and represent a hydrogen atom, an optionally substituted alkyl or phenyl group; R.sub.10 represents a hydrogen atom, an optionally substituted alkyl group or a hydroxyl group; and a is a number of 1 to 2, which is suitable for forming fine patterns having high resolution on a substrate having high reflectance.

Quinone diazide photoresist composition containing alkali-soluble resin

Positive working quinone diazide and alkali soluble resin resist

A quinone diazide sulfonic acid ester of a phenol compound of the general formula (I): ##STR1## wherein Y.sub.1, Y.sub.2, Y.sub.3 and Y.sub.4 are the same or different and each a hydrogen atom, an alkyl group, a halogen atom or a hydroxyl group, provided that at least one of Y.sub.1, Y.sub.2, Y.sub.3 and Y.sub.4 is a hydroxyl group; Z.sub.1, Z.sub.2, Z.sub.3, Z.sub.4, Z.sub.5 and Z.sub.6 are the same or different and each a hydrogen atom, an alkyl, an aryl group, a halogen atom or a hydroxyl group, provided that at least one of Z.sub.1, Z.sub.2, Z.sub.3, Z.sub.4, Z.sub.5 and Z.sub.6 is a hydroxyl group; X is ##STR2## in which R.sub.1 and R.sub.2 are the same or different and each a hydrogen atom, an alkyl group, an alkenyl group, a cyclo-alkyl group, an alkoxy group or an aryl group, provided that when at least one of R.sub.1 and R.sub.2 is a hydrogen atom, an alkyl or aryl group is present at the ortho position to a hydroxyl group which is present at the ortho position to X provides a positive resist composition which has a high .gamma.-value.

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Osaka, Japan

Hirotoshi Nakanishi