Adv Antest Corporation

Olympus Corporation

Hiroto Nakamura

Yoshihito Kobayashi

Akihiko Ito

Yutaka Watanabe

Kenichi Shimada

Tsuyoshi Yamashita

Noriyuki Igarashi

Shin Nemoto

Hiroyuki Takahashi

Katsuhiko Suzuki

Noboru Saito

Aritomo Kikuchi

Yoshiyuki Masuo

Keiichi Fukumoto

Makoto Sagawa

Toshiyuki Kiyokawa

Yasuo Tanigami

Kazuyuki Yamashita

Takaji Ishikawa

Yoshito Kobayashi

Katsuhiko Ikeda

Koji Kimoto

Ryo Miyasaka

Toshio Yabe

Michirou Chiba

Kempei Suzuki

Jinji Tokita

A drive device includes: a first circuit including an alternating current (AC) power supply, a primary winding constituting a first side of an output transformer, and an input line connecting the primary winding and the AC power supply to each other; a second circuit including a pair of electrodes detachably connected to an ultrasound treatment instrument, a secondary winding constituting a second side of the output transformer, and a pair of output lines connecting the pair of electrodes and the secondary winding; and a pair of third circuits each having one end respectively connected to the output lines and another end connected to a ground. Each of the pair of third circuits includes an inductor being a passive element, and a capacitor being a passive element connected in series to the inductor. Each of the pair of third circuits is connected to each of the output lines.

Drive device

A drive device includes: a drive signal generator configured to generate a pair of drive signals, a pair of buffer circuits, a pair of switching elements configured to repeatedly turn on and off the pair of drive signals, a first radiation material that has a longitudinal axis and that is arranged to face one of the pair of switching elements, a second radiation material that has a longitudinal axis and that is arranged to face an other one of the pair of switching elements, a fan and a casing. The switching elements, the first radiation material, and the second radiation material are positioned within a projection plane of the fan viewed along the longitudinal axes of the first radiation material and the second radiation material.

An ultrasonic treatment system for a joint has an ultrasonic transducer configured to generate ultrasonic vibration at a predetermined frequency, a treatment unit configured to treat a bone or a cartilage with the ultrasonic vibration, a frequency measurement unit configured to measure the frequency of the ultrasonic vibration of the treatment unit, a calculation unit configured to calculate a tilt indicating change, in a predetermined time, of the frequency measured with the frequency measurement unit, and a controller configured to determine whether change of absolute value of the tilt is equal to or larger than predetermined absolute value of the tilt.

Ultrasonic treatment system for joint

An electronic device handling apparatus, which handles an electronic device under test having a first main surface provided thereon with first device terminals and a second main surface provided thereon with second device terminals, includes: a contact arm having a holding-side contact arm to which a first socket is attached and a suction pad which holds the electronic device under test; an alignment apparatus which positions the first socket and the electronic device under test; and the alignment apparatus which positions, with respect to a second socket, the electronic device under test being held by the suction pad and contacting the first socket, wherein the contact arm presses the second device terminals of the electronic device under test to the second socket.

Electronic component handling apparatus, electronic component testing apparatus, and electronic component testing method

In an electronic device test apparatus using image processing technology to position an IC device relative to a socket, a calibration method of an electronic device test apparatus of calibrating a relative position of a device camera with respect to a socket, the method comprising: calculating an offset amount of a socket guide with respect to the socket on the basis of a relative position of the socket camera with respect to the socket guide and a relative position of a socket camera with respect to the socket; and adding this offset amount to the relative position of the device camera with respect to the socket guide so as to calculate the relative position of the device camera with respect to the socket.

Calibration method of electronic device test apparatus

An electronic device testing apparatus for conducting a test by pressing input/output terminals of electronic devices to be tested () against contact portions () of a test head () while holding the electronic devices to be tested () on electronic device conveying media (): wherein the electronic device testing apparatus comprises a test head () provided with a plurality of contact groups () made by sets of contact portions (), and a plurality of moving means capable of controlling independently from each other; and the respective moving means move the electronic device conveying media () loaded with the electronic devices to be tested () to corresponding contact groups () to conduct a test.

Electronic device testing apparatus

To attain an object of providing an insert for holding wide-ranging kinds of area array type electronic components and realizing certain connection between external terminals of an area array type electronic component and connection terminals of a socket, and an electronic component testing apparatus and an electronic component testing method using the same, a thin platefor supporting an IC deviceis positioned between an external terminal faceof the IC deviceand a connection terminal faceof a socket, and a thickness of the thin plateis made to be approximately equal to or less than a distance between a tip portion of the external terminalsand the external terminal face

Insert attachable to an insert magazine of a tray for holding an area array type electronic component to be tested

A device testing apparatus including a connection terminal to which an electronic device under test is detachably attached, a pusher for pushing the electronic device in the direction of the connection terminal so as to connect the electronic device to the connection terminal, and a cooling unit for cooling the electronic device. As the cooling unit, an element cooling the device using electricity is for example used. The cooling unit includes a cooling medium blower for blowing a cooling medium around the electronic device and heat exchange projections or depressions for raising the cooling efficiency by blowing a cooling medium. In the device testing apparatus, even if the electronic device generates heat on its own during testing, the electronic device is cooled through the pusher, connection terminals, or socket, so the effect of the heat generated by the electronic device is canceled out and the electronic device can be tested at the predetermined temperature as prescribed in the specification.

Cooling fin connected to a cooling unit and a pusher of the testing apparatus

To control the temperature of an electronic component testing socket without mixing any noise into a test signal to be applied to an electronic component and a respond signal to be read from the electronic component when conducting a test on the electronic component, a first spacein the electronic component testing socket baseand a socket body inside spacein the electronic component testing socketare connected via a gas outletand a gas inlet, and a second spacein the electronic component testing socket baseand a socket body inside spacein the electronic component testing socketare connected via a gas inletand a gas outlet

Electronic component testing socket and electronic component testing apparatus using the same

An electric device testing apparatus comprises a connection terminal to which an IC chip to be tested is removably connected, a pusher for pushing the IC chip in the direction of the connection terminal in order to connect the IC chip to the connection terminal, and temperature adjusted air supply for blowing a temperature adjusted air to around the IC chip during a test on the IC chip via a through hole formed on the pushed.

Electric device testing apparatus

A semiconductor device testing apparatus having a reduced transverse width and compact in size is provided. Adjacent to a constant temperature chamber containing therein a vertical transport means is located a test chamber which is in turn adjoined by a temperature-stress removing chamber likewise containing therein a vertical transport means, so that the constant temperature chamber and the test chamber are arranged transversely in a line, while the temperature-stress removing chamber is located in front of the test chamber when viewed in front view of the apparatus. Further, a loader section is located in front of the constant temperature chamber, and an unloader section is located above the temperature-stress removing chamber. With this arrangement, the transverse width of the testing apparatus may be reduced to about two test tray lengths.

Semiconductor device testing apparatus

An IC receiving tray storage device is provided which is capable of securedly identifying the category of the tested ICs sorted for each category and received in the corresponding tray in the unloader section after end of test. Mounted to the tray storage is a casing comprising a generally rectangular base plate and a plurality of outer walls standing substantially upright and separately from each other on the base plate. A category identifying indicator is attached to at least one outer wall of the casing. This category identifying indicator indicates the category of ICs received in the tray. Also, in the base plate of the casing is formed an opening through which vertically movable unit is free to move. By the category identifying indicator, the category of the tested ICs received in the tray can be easily confirmed after the tray storage device has been taken out from the IC handler.

IC receiving tray storage device and mounting apparatus for the same

An electronic device tray having a plurality of IC holders in which IC chips are held and having a shutter for opening and closing openings of the IC holders , the shutter being opened and closed by fluid pressure cylinders etc. provided at an IC tester. Further, a tray vertical carrier for conveying a tray holding IC chips in a substantially vertical direction, including a tray end holding member able to detachably hold an end of the lowermost level tray positioned at the lowermost level among stacked trays , a tray elevating member for conveying the lowermost level tray downward or upward, an actuator member for driving the tray end holding member so as to release the hold on the lowermost level tray and then hold the end of another tray next arriving at the lowermost level position when the lowermost level tray is in a state where it can be supported by the tray elevating member , and a tray horizontal carrier receiving the lowermost level tray when the tray elevating member descends and able to move in the substantially horizontal direction, the tray horizontal carrier being moved by a drive wire

Electronic device tray electronic device tray, transporting apparatus, and electronic device testing apparatus

A tray transfer arm,for transferring one or more customer trays KST which hold semiconductor devices IC, comprises a pair of tray holders,which are provided substantially in the upper and lower direction.

Growing community of inventors

Tokyo, Japan

Hiroto Nakamura